IP Library Granted Patent US 7,817,387
Granted Patent B2
US 7,817,387 · App. 11/971,591 · Granted Oct 19, 2010

MIGFET circuit with ESD protection

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Quick Facts
Patent No.
US 7,817,387
App. No.
11/971,591
Granted
Oct 19, 2010
Kind
B2
Abstract

An electrostatic discharge (ESD) protected circuit is coupled to a power supply voltage rail and includes a multiple independent gate field effect transistor (MIGFET), a pre-driver, and a hot gate bias circuit. The MIGFET has a source/drain path coupled between an output pad and the power supply voltage rail and has a first gate terminal and a second gate terminal. The pre-driver circuit has an output. The hot gate bias circuit is coupled to the first gate terminal of the MIGFET, and the output of the pre-driver circuit is coupled to the second gate terminal of the MIGFET. The hot gate bias circuit is configured to apply a bias voltage to the first gate terminal of the MIGFET during an ESD event that increases the breakdown voltage of the MIGFET so as to better withstand the ESD event.

Claims (27)

1. An electrostatic discharge (ESD) protected circuit coupled to a power supply voltage rail, comprising: a multiple independent gate field effect transistor (MIGFET) having a source/drain path coupled between an output pad and the power supply voltage rail, the MIGFET having a first gate terminal and a second gate terminal, wherein the MIGFET functions as an output driver;

a pre-driver circuit having an output coupled to the second gate terminal of the MIGFET, wherein the pre-driver circuit controls the second gate terminal; and

a hot gate bias circuit coupled to the first gate terminal of the MIGFET, wherein the hot gate bias circuit is configured to apply a bias voltage to the first gate terminal of the MIGFET during an ESD event.

2. The ESD protected circuit of claim 1 , wherein the hot gate bias circuit is further configured to detect the electrostatic discharge event.

3. The ESD protected circuit of claim 1 , wherein the hot gate bias circuit is configured to apply the bias voltage of a sufficient magnitude so as to make the bias voltage substantially same as a voltage at the output pad.

4. The ESD protected circuit of claim 1 , wherein the hot gate bias circuit is configured to apply the bias voltage of a sufficient magnitude so as to raise a breakdown voltage associated with the MIGFET.

5. The ESD protected circuit of claim 1 further comprising an electrostatic discharge (ESD) detection circuit configured to detect an electrostatic discharge event, wherein the ESD detection circuit is coupled to the hot gate bias circuit.

6. The ESD protected circuit of claim 5 , wherein the ESD detection circuit is configured to provide a trigger signal to the hot gate bias circuit in response to detection of the electrostatic discharge event, such that the hot gate bias circuit applies the bias voltage to the first gate terminal of the MIGFET in response to the trigger signal.

7. An electrostatic discharge (ESD) protected circuit coupled to a first power supply voltage rail and a second power supply voltage rail, comprising:

a first multiple independent gate field effect transistor (MIGFET) having a source/drain path coupled between an output pad and the first power supply voltage rail, wherein the first MIGFET has a first gate terminal and a second gate terminal and functions as an output driver;

a second MIGFET having a source/drain path coupled between the output pad and the second power supply voltage rail, wherein the second MIGFET has a first gate terminal and a second gate terminal and functions as an output driver;

a pre-driver circuit having an output coupled to the second gate terminal of the first MIGFET and the second gate terminal of the second MIGFET, wherein the pre-driver circuit controls the second gate terminal of the first MIGFET and the second gate terminal of the second MIGFET; and

a gate bias circuit coupled to the first gate terminal of the first MIGFET and the first gate terminal of the second MIGFET, wherein the gate bias circuit is configured to apply a first bias voltage to the first gate terminal of the first MIGFET and a second bias voltage to the first gate terminal of the second MIGFET during an ESD event.

8. The ESD protected circuit of claim 7 , wherein the gate bias circuit is further configured to detect the ESD event.

9. The ESD protected circuit of claim 7 , wherein the gate bias circuit is configured to apply the first bias voltage of a sufficient magnitude so as to make the first bias voltage substantially same as a voltage at the output pad.

10. The ESD protected circuit of claim 7 , wherein the gate bias circuit is configured to apply the first bias voltage of a sufficient magnitude so as to raise a breakdown voltage associated with the first MIGFET and to apply the second bias voltage of a sufficient magnitude to raise a breakdown voltage associated with the second MIGFET.

11. The ESD protected circuit of claim 7 further comprising an ESD detection circuit configured to detect an electrostatic discharge event, wherein the ESD detection circuit is coupled to the gate bias circuit.

12. The ESD protected circuit of claim 11 , wherein the ESD detection circuit is configured to provide a trigger signal to the gate bias circuit in response to detection of the electrostatic discharge event, such that the gate bias circuit applies the first bias voltage to the first gate terminal of the first MIGFET and the second bias voltage to the first gate terminal of the second MIGFET in response to the trigger signal.

13. The ESD protected circuit of claim 7 , wherein, during normal operation, the gate bias circuit is configured to apply the first bias voltage of a sufficient magnitude to the first gate terminal of the first MIGFET so as to make the first bias voltage substantially same as the first power supply voltage rail.

14. The ESD protected circuit of claim 7 , wherein the first MIGFET is an n-type transistor and the second MIGFET is a p-type transistor.

15. A method in an electrostatic discharge (ESD) protected circuit, coupled between a first power supply voltage rail and a second power supply voltage rail, comprising a multiple independent gate field effect transistor (MIGFET) having a source/drain path coupled between an output pad and the second power supply voltage rail, the MIGFET having a first gate terminal and a second gate terminal, the method comprising:

controlling the second gate terminal of the MIGFET with a pre-driver circuit, wherein the MIGFET functions as an output driver;

applying a first bias voltage of a sufficient magnitude to the first gate terminal of the MIGFET so as to make the first bias voltage substantially same as the second power supply voltage rail during normal operation; and

applying a second bias voltage of a sufficient magnitude to the first gate terminal of the MIGFET so as to make the second bias voltage substantially same as a voltage at the output pad during an ESD event.

16. The method of claim 15 , wherein the steps of applying are further characterized as using a bias circuit for applying the first and second bias voltages, further comprising using the bias circuit to detect the ESD event.

17. The method of claim 15 further comprising selecting the second bias voltage so as to raise a breakdown voltage associated with the MIGFET.

18. The method of claim 15 further comprising providing a trigger signal to a hot gate bias circuit in response to detection of the electrostatic discharge event, such that the hot gate bias circuit applying the second bias voltage to the first gate terminal of the MIGFET in response to the trigger signal.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0688 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
SECURITY AGREEMENT Recorded Jul 7, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021194/0593 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2008
From: KHAZHINSKY, MICHAEL G.; MATHEW, LEO; MILLER, JAMES W.
To: FREESCALE SEMICONDUCTOR, INC.
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