IP Library Granted Patent US 7,471,558
Granted Patent B2
US 7,471,558 · App. 12/000,472 · Granted Dec 30, 2008

Semiconductor storage device

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Quick Facts
Patent No.
US 7,471,558
App. No.
12/000,472
Granted
Dec 30, 2008
Kind
B2
Abstract

A semiconductor storage device comprising: unit blocks each including memory cells, first row of sense amplifiers on one side of bit lines; second row of sense amplifiers on an other side of the bit lines; first switch means which switches a connection state between the one side of the bit lines and the first row of sense amplifiers; second switch means which switches a connection state between the other side of the bit lines and the second row of sense amplifiers; third switch means arranged in the approximate center of the bit lines in an extending direction thereof to switch a connection state of the bit lines; and refresh control means which divides the unit block into two areas and controls the refresh operation using the switch means and the row of sense amplifiers according to which area a selected word line to be refreshed is in.

Claims (43)

1. A semiconductor device comprising:

first and second field-effect transistors each including a gate electrode, one of source and drain regions, and the other of source and drain regions;

a first active region defining diffusion layer; and

first to third interconnection lines, wherein

said gate electrodes of said first and second transistors intersect said first active region,

said first active region has first to third regions, the first region between said gate electrodes acting as said one of source and drain regions of said transistors, the second region acting as said the other of source and drain regions of said first transistor, and the third region acting as said the other of source and drain regions of said second transistor,

said first interconnection line is in contact with said second region and extends from said second region in a first direction so as to intersect said gate electrodes,

said second interconnection line is in contact with said third region and extends from said third region in said first direction, and,

said third interconnection line is in contact with said first region and extends from said first region in a second direction opposite to said first direction so as to intersect said gate electrode of said first transistor.

2. The semiconductor device as defined in claim 1 , wherein a plurality of said semiconductor devices are arrayed in the direction orthogonal to said first direction or said second direction.

3. The semiconductor device as defined in claim 2 further comprising:

a plurality of memory cells coupled with said first and second interconnection lines; and

a plurality of sense amplifiers which are coupled with said third interconnection lines and arrayed in the orthogonal direction and used for detecting information stored in said memory cells.

4. The semiconductor device as defined in claim 3 further comprising:

third and fourth field-effect transistors each including a gate electrode, one of source and drain regions, and the other of source and drain regions;

a second active region defining diffusion layer; and

fourth to sixth interconnection lines, wherein

said gate electrodes of said third and fourth transistors intersect said second active region,

said second active region has fourth to sixth regions, the fourth region between said gate electrodes acting as said one of source and drain regions of said third and fourth transistors, the fifth region acting as said the other of source and drain regions of said third transistor, and the sixth region acting as said the other of source and drain regions of said fourth transistor,

said fourth interconnection line is in contact with said fifth region and extends from said fifth region in said first direction so as to intersect said gate electrodes of said third and fourth transistors,

said fifth interconnection line is in contact with said sixth region and extends from said sixth region in said first direction,

said sixth interconnection line is in contact with said fourth region and extends from said fourth region in said second direction so as to intersect said gate electrode of said third transistor, and,

said second active region is provided adjacent to and apart from said first active region, and displaced from the first active region in said first direction.

5. The semiconductor device as defined in claim 4 , wherein, a plurality of said semiconductor devices are arrayed in the direction orthogonal to said first direction or said second direction.

6. The semiconductor device as defined in claim 5 further comprising:

a plurality of memory cells coupled with said first, second, fourth and fifth interconnection lines; and

a plurality of sense amplifiers which are coupled with said third and sixth interconnection lines and arrayed in the orthogonal direction and used for detecting information stored in said memory cells.

7. A semiconductor device comprising:

first, second third regions arranged in line in a first direction, the second region being between the first and third regions, the first and second regions defining a first channel region therebetween, and the second and third regions defining a second channel regions therebetween;

a first signal line extending in a second direction crossing the first direction, the first signal line having a first portion covering the first channel region;

a second signal line extending in the second direction, the second signal line having a second portion covering the second channel region;

a third signal line extending in the first direction, the third signal line passing over the first and second signal lines and having a first electrical contact with the first region;

a fourth signal line extending in the first direction, the fourth signal line passing over the first signal line and having a second electrical contact with the second region; and

a fifth signal line extending in the first direction and having a third electrical contact with the third region.

8. The device as claimed in claim 7 , wherein the fourth and fifth signal lines are arranged in line in the first direction, the second signal line intervening between the fourth and fifth signal lines.

9. The device as claimed in claim 7 , wherein the first and second regions and the first portion of the first signal line constitutes a first MOS transistor, and the second and third regions and the second portion of the second signal line constitutes a second MOS transistor.

10. The device as claimed in claim 7 , further comprising a memory circuit, the memory circuit including:

first and second bit lines each extending in the first direction;

a word line extending in the second direction to intersect the first and second bit lines;

a plurality of memory cells disposed at respective intersections of the first and second bit lines and the word line; and

a sense amplifier,

the third signal line being connected to the first bit line, the fifth signal line being connected to the second bit lien, and the fourth bit line being electrically connected to the sense amplifier.

11. The device as claimed in claim 10 , wherein the first and second regions and the first portion of the first signal line constitutes a first MOS transistor and the second and third regions and the second portion of the second signal line constitutes a second MOS transistor, the first MOS transistor being turned on by a signal supplied from the first signal line to connect the first bit line to the sense amplifier through the third and fourth signal lines, and the second MOS transistor being turned on by a signal supplied from the second signal line to connect the second bit line to the sense amplifier through the fifth and fourth signal lines.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: ELPIDA MEMORY, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 032645/0422 →