IP Library Granted Patent US 8,101,939
Granted Patent B2
US 8,101,939 · App. 12/010,888 · Granted Jan 24, 2012

GaN single-crystal substrate and method for producing GaN single crystal

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Quick Facts
Patent No.
US 8,101,939
App. No.
12/010,888
Granted
Jan 24, 2012
Kind
B2
Abstract

A GaN single-crystal substrate has a substrate surface in which polarity inversion zones are included. The number density of the polarity inversion zones in the substrate surface is not more than 20 cm −2 . A GaN single crystal production method includes introducing group III and V raw material gases on a substrate, and growing a GaN single crystal on the substrate. The growth temperature is within the range of not less than 1100° C. and not more than 1400° C., the group V to III raw material gas partial pressure ratio (V/III ratio) is within the range of not less than 0.4 and not more than 1, and the number density of polarity inversion zones in a surface of the substrate is not more than 20 cm −2 .

Claims (25)

1. A GaN single-crystal substrate, comprising:

a substrate surface comprising a frontside and a backside; and

polarity inversion zones extending from the frontside to the backside,

wherein the polarity inversion zones are formed in line shapes and are concentrated in a specified position to exist in the substrate surface, and the polarity inversion zones have a number density of the polarity inversion zones in the substrate surface within a range of not more than 20 cm −2 , and

wherein a maximum outside diameter of the polarity inversion zones is not more than 1 mm.

2. The GaN single-crystal substrate according to claim 1 , wherein a ratio of a sum of respective areas of the polarity inversion zones to a total area of the substrate surface is equal to or less than 2%.

3. A GaN free-standing substrate, comprising:

a first substrate side comprising a frontside and a backside; and

a plurality of inversion domains extending from the frontside to the backside,

wherein the inversion domains are formed in line shapes concentrated in a specified position to exist in the substrate surface, and the polarity inversion zones have a number density of the plurality of inversion domains within the first substrate side within a range of equal to or less than 20 cm −2 , and

wherein the plurality of inversion domains have a maximum outside diameter equal to or less than 1 mm.

4. The GaN free-standing substrate according to claim 3 , wherein a ratio of a sum of respective areas of the inversion domains to an area of the first substrate side is equal to or less than 2%.

5. The GaN free-standing substrate according to claim 3 , wherein the inversion domains comprise polarity inversion zones.

6. The GaN free-standing substrate according to claim 3 , further comprising:

a second substrate side facing away from the first substrate side,

wherein the inversion domains substantially extend from the first substrate side to the second substrate side.

7. The GaN free-standing substrate according to claim 3 , wherein the inversion domains have N polarity.

8. The GaN single-crystal substrate according to claim 1 , wherein the polarity inversion zones are accompanied by high impurity concentration regions disposed on a periphery of the polarity inversion zones, the high impurity concentration regions having a width in a range of 10 to 100 times a diameter of the polarity inversion zones.

9. The GaN free-standing substrate according to claim 3 , wherein the inversion domains are accompanied by high impurity concentration regions disposed on a periphery of the inversion domains, the high impurity concentration regions having a width in a range of 10 to 100 times a diameter of the inversion domains.

10. The GaN single-crystal substrate according to claim 1 , wherein the polarity inversion zones extend from an exposed area of the frontside to the backside of the substrate surface.

11. The GaN single-crystal substrate according to claim 1 , wherein a region that comprises the polarity inversion, zones is inverted relative to a surrounding crystal of said region.

12. The GaN single-crystal, substrate according to claim 1 , wherein a ratio of a sum of respective areas of the polarity inversion zones to a total area of the substrate frontside is equal to or less than 2%.

13. The GaN single-crystal substrate according to claim 1 , wherein the polarity inversion zones are formed apart from each other on the frontside of the substrate surface.

14. The GaN single-crystal substrate according to claim 1 , wherein the number density of the polarity inversion zones in the substrate surface is equal to or more than 1 cm −2 .

15. The GaN single-crystal substrate according to claim 1 , wherein the number density of the polarity inversion zones in the substrate surface is more than 0 cm −2 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER AND CHANGE OF NAME Recorded Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →