IP Library Granted Patent US 8,264,041
Granted Patent B2
US 8,264,041 · App. 12/019,320 · Granted Sep 11, 2012

Semiconductor device with electrically floating body

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Quick Facts
Patent No.
US 8,264,041
App. No.
12/019,320
Granted
Sep 11, 2012
Kind
B2
Abstract

A semiconductor device along with circuits including the same and methods of operating the same are described. The device includes an electrically floating body region, and a gate is disposed over a first portion of the body region. The device includes a source region adjoining a second portion of the body region, the second portion adjacent the first portion and separating the source region from the first portion. The device includes a drain region adjoining a third portion of the body region, the third portion adjacent the first portion and separating the drain region from the first portion.

Claims (37)

1. A semiconductor device comprising:

a body region configured to be electrically floating;

a gate disposed over a first portion of the body region;

a source region adjoining a second portion of the body region, the second portion adjacent the first portion and separating the source region from the first portion; and

a drain region adjoining a third portion of the body region, the third portion adjacent the first portion and separating the drain region from the first portion;

wherein the body region extends outside of at least one lateral boundary of the gate at its closest proximity to the gate such that no portion of at least one of the source region and the drain region is disposed directly under the gate.

2. The device of claim 1 , comprising a first voltage coupled to the gate, wherein the first voltage may cause minority carriers to accumulate in the first portion of the body region.

3. The device of claim 2 , wherein the minority carriers accumulate at a surface region of the first portion of body region that is juxtaposed or near a gate dielectric which is disposed between the gate and the first portion of the body region.

4. The device of claim 2 , wherein a region that includes the minority carriers is disconnected from the source region by the second portion of the body region.

5. The device of claim 2 , wherein a region that includes the minority carriers is disconnected from the drain region by the third portion of the body region.

6. The device of claim 2 , comprising a first potential difference coupled between the source and the drain, the first potential difference generating source current as a result of impact ionization of the minority carriers.

7. The device of claim 6 , comprising a second voltage coupled to the gate after and instead of the first voltage, the second voltage causing an accumulation of majority carriers in the first portion of the body region, wherein the majority carriers result in the first data state which is representative of a first charge in the body region.

8. The device of claim 2 , comprising a second potential difference coupled between the source and the drain, the second potential difference resulting in a second data state which is representative of a second charge in the body region.

9. The device of claim 1 , comprising an insulating layer disposed between the gate and the body region.

10. The device of claim 1 , wherein the body region includes a first type of semiconductor material.

11. The device of claim 10 , wherein the source region and drain region includes a second type of semiconductor material.

12. The device of claim 11 , wherein the source region includes a lightly doped region.

13. The device of claim 11 , wherein the source region includes a highly doped region.

14. The device of claim 11 , wherein the source region includes a lightly doped region and a highly doped region.

15. The device of claim 11 , wherein the drain region includes a lightly doped region.

16. The device of claim 11 , wherein the drain region includes a highly doped region.

17. The device of claim 11 , wherein the drain region includes a lightly doped region and a highly doped region.

18. A semiconductor device comprising:

a gate;

a body region partially disposed under the gate and electrically floating; and

a source region and a drain region adjacent the body region, wherein one or more of the source region and the drain region include a doped region shaped so that a boundary of the doped region is separated from a portion of the body region underlying the gate;

wherein the body region extends outside of at least one lateral boundary of the gate at its closest proximity to the gate such that no portion of at least one of the source region and the drain region is disposed directly under the gate.

19. A semiconductor device comprising:

a gate;

a body region configured as an electrically floating body, the body region configured so that material forming the body region extends beyond at least one lateral boundary of the gate; and

a source region and a drain region adjacent the body region;

wherein the body region extends outside of at least one lateral boundary of the gate at its closest proximity to the gate such that no portion of at least one of the source region and the drain region is disposed directly under the gate.

20. A transistor comprising:

a floating body region on a insulating substrate;

a gate disposed over a portion of the floating body region; and

a source region and a drain region, wherein a doping profile of one or more of the source and the drain region is configured to prevent formation of a contiguous current channel extending between the source region and the drain region through the floating body region;

wherein the floating body region extends outside of at least one lateral boundary of the gate at its closest proximity to the gate such that no portion of at least one of the source region and the drain region is disposed directly under the gate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: MICRON TECHNOLOGY, INC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039974/0496 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2011
From: INNOVATIVE SILICON ISI S.A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025850/0798 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 020661 FRAME 0158. ASSIGNOR(S) HEREBY CONFIRMS THE SUBMISSION IS A CORRECTIVE DOCUMENT FOR THE INCORRECTLY RECORDED ASSIGNMENT DOCUMENT. Recorded Nov 21, 2008
From: OKHONIN, SERGUEI
To: INNOVATIVE SILICON ISI SA
Reel/Frame 021877/0384 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2008
From: OKHONIN, SERGUEI
To: INNOVATIVE SILICON
Reel/Frame 020661/0158 →