IP Library Granted Patent US 7,701,682
Granted Patent B2
US 7,701,682 · App. 12/023,181 · Granted Apr 20, 2010

Electrostatic discharge protection

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,701,682
App. No.
12/023,181
Granted
Apr 20, 2010
Kind
B2
Abstract

An electrostatic discharge (ESD) protection device ( 61, 71 ), coupled across input-output (I/O) ( 22 ) and common ( 23 ) terminals of a core circuit ( 24 ) that it is intended to protect from ESD events, comprises, multiple serially coupled ESD clamp stages ( 41, 41′ ), each stage ( 41, 41′ ) comprising an interior node ( 52, 52′ ) and first ( 32, 32′ ) and second terminal ( 42, 42′ ) nodes wherein the first terminal node ( 42 ) of the first clamp stage ( 41 ) is coupled to the common terminal ( 23 ) and the second terminal node ( 42′ ) of the last clamp stages ( 41′ ) is coupled to the I/O terminals ( 22 ). A resistance-capacitance ladder ( 60 ) is provided in parallel with some of the clamp stages ( 41, 41′ ), with a resistance (R 1 , R 2 , R 3 etc.) coupled to each of the nodes ( 32, 52, 65 ( 42; 32′ )) of one of the ESD clamp stages ( 41, 41′ ) by first terminals thereof and capacitors (C 1 , C 2 , etc.) are coupled between second terminals of the resistances (R 1 , R 2 , R 3 etc.). The clamp stages ( 41, 41′ ) are desirably bi-directional and a diode (D 1 ) may bridge one or more of the clamp stages (e.g., 41 ) to provide different clamp voltages for different polarity ESD events.

Claims (26)

1. An electrostatic discharge (ESD) protection circuit, having an input/output (I/O) terminal and a common terminal, adapted to protect a circuit core coupled between the I/O and common terminals, and comprising:

multiple serially arranged ESD clamp stages coupled between the I/O terminal and the common terminal; and

a resistance-capacitance (RC) ladder in parallel with at least a part of the multiple serially arranged ESD clamp stages and with resistances of the RC ladder coupled to nodes of the serially arranged ESD clamp stages.

2. The circuit of claim 1 , wherein the multiple serially arranged ESD clamp stages comprise first and second serially arranged ESD clamp stages and the nodes comprise a first node at a first terminal of the first ESD clamp stages, a second node internal to the first ESD clamp stage and a third node serially coupling a second terminal of the first ESD clamp stage to a first terminal of the second ESD clamp stage, a fourth node internal to the second ESD clamp stage and a fifth node at an end terminal of the second ESD clamp stage, wherein the first node is coupled to the common terminal and the fifth node is coupled to the I/O terminal.

3. The circuit of claim 2 , wherein the RC ladder comprises first, second and third resistances and first and second capacitances, wherein a first terminal of the first resistance is coupled to the first node, a first terminal of the second resistance is coupled to the second node and a first terminal of the third resistance is coupled to the third node and the first capacitance is coupled between second terminals of the first and second resistances and the second capacitance is coupled between second terminals of the second and third resistances.

4. The circuit of claim 2 , further comprising a diode coupled between the first and third nodes.

5. The circuit of claim 2 , further comprising a fourth resistance and a third capacitance, the fourth resistance having a first terminal thereof coupled to the fourth node and the third capacitance is coupled between the second terminal of the third resistance and a second terminal of the fourth resistance.

6. The circuit of claim 2 , further comprising a fifth resistance and a fourth capacitance, the fifth resistance having a first terminal thereof coupled to the fifth node and the fourth capacitance coupled between the second terminal of the fourth resistance and a second terminal of the fifth resistance.

7. The circuit of claim 1 , wherein at least some of the multiple serially arranged ESD clamp stages are bi-directional.

8. The circuit of claim 7 , further comprising a diode coupled across at least one of the multiple serially arranged bi-directional ESD clamp stages.

9. An electrostatic discharge (ESD) protection device, coupled across input-output (I/O) and common terminals of a core circuit that it is intended to protect from ESD events, comprising:

first through N serially coupled bi-directional ESD clamp stages, each of the N ESD clamp stages comprising first and second terminal nodes and an interior node, wherein the first terminal node of the first ESD clamp stage is coupled to the common terminal, the second terminal node of the N th ESD clamp stages is coupled to the I/O terminal and 2 nd through the N th ESD clamp stages have first terminal nodes coupled to second terminal nodes of an immediately preceding ESD clamp stage, thereby forming N−1 coupling nodes between adjacent pairs of the first through N serially coupled ESD clamp stages; and

a resistance-capacitance (RC) ladder with multiple resistances and capacitances, wherein the resistances have first terminals coupled to at least some of the nodes of the ESD clamp stages and the capacitances are coupled between second terminals of successive resistances of the RC ladder.

10. The device of claim 9 , wherein first terminals of the resistances are coupled to the first node of the first ESD clamp stage, to the interior nodes of the N ESD clamp stages, to the second node of the N th ESD clamp stage, and to the N−1 coupling nodes between successive serially coupled ESD stages, one resistance per node, and the capacitances are coupled between second terminals of successive resistances of the RC ladder.

11. The device of claim 10 , wherein the resistance having a first terminal coupled to the second node of the N th ESD clamp stage and the capacitance coupled to the second terminal of such resistance, or the resistance having a first terminal coupled to the interior node of the N th ESD stage and capacitance coupled to the second terminal of such resistance, or both such resistances and capacitances, are omitted.

12. The device of claim 9 , further comprising a diode coupled across first and second terminal nodes of one or more of the N serially coupled bi-directional ESD clamp stages.

13. The device of claim 11 , wherein the diode is coupled across first and second terminal nodes of the first ESD clamp stage.

14. An electrostatic discharge (ESD) protection device, coupled across input-output (I/O) and common terminals of a core circuit that it is intended to protect from ESD events, comprising:

N serially coupled ESD clamp stages, each ESD clamp stage comprising first and second terminal nodes and an interior node, wherein the first terminal node of a first of the serially coupled ESD clamp stages is coupled to the common terminal and the second terminal node of the N th serially coupled ESD clamp stage is coupled to the I/O terminal; and

a resistance-capacitance (RC) ladder with a resistance coupled to each of the nodes of one or more of the N ESD clamp stages by first terminals of the resistances and capacitors coupled between second terminals of the resistances.

15. The device of claim 14 , wherein each ESD clamp stage comprises first and second transistor stages serially coupled in mirror configuration, each transistor stage having emitter, base and collector, and wherein the interior node of each ESD clamp stage couples the collectors of the first and second transistor stages.

16. The device of claim 15 , wherein emitters of the first and second transistor stages are coupled respectively to the first and second terminal nodes of each ESD clamp stages.

17. The device of claim 15 , further comprising a Zener diode coupled between the collector and base of each transistor stage.

18. The device of claim 15 , wherein an emitter of the first transistor stage of a first of the N ESD clamp stages is coupled to the common terminal and an emitter of the second transistor stage of the N th ESD clamp stage is coupled to the I/O terminal.

19. The device of claim 14 , wherein the resistances of the RC ladder have substantially similar values and the capacitances of the RC ladder have substantially similar values.

20. The device of claim 14 , further comprising a diode coupled across the first and second terminal nodes of one of the ESD clamp stages.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0688 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
SECURITY AGREEMENT Recorded Jul 7, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021194/0593 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2008
From: GOYAL, ABHIJAT; GILL, CHAI EAN E.; WHITFIELD, JAMES D.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 020668/0123 →