IP Library Granted Patent US 7,683,733
Granted Patent B2
US 7,683,733 · App. 12/025,315 · Granted Mar 23, 2010

Balun transformer with improved harmonic suppression

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Quick Facts
Patent No.
US 7,683,733
App. No.
12/025,315
Granted
Mar 23, 2010
Kind
B2
Abstract

An electronic assembly includes a substrate ( 66 ), a balun transformer ( 42 ) formed on the substrate ( 66 ) and including a first winding ( 50 ) and a second winding ( 52 ), each having respective first and second ends, and a reaction circuit component ( 48 ) formed on the substrate ( 66 ) and electrically coupled to the second winding ( 52 ) between the first and second ends thereof. The balun transformer ( 42 ) and the reaction circuit component ( 48 ) jointly form a harmonically suppressed balun transformer having a fundamental frequency, and the reaction circuit component ( 48 ) is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency.

Claims (30)

1. An electronic assembly comprising:

a substrate;

a balun transformer formed on the substrate and comprising a first winding and a second winding, each having respective first and second ends; and

a reaction circuit component formed on the substrate and electrically coupled to the second winding between the first and second ends thereof, wherein the balun transformer and the reaction circuit component jointly form a harmonically suppressed balun transformer having a fundamental frequency and the reaction circuit component is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency,

wherein the selected harmonic frequency is a second harmonic of the fundamental frequency, the reaction circuit component comprises a capacitor, and the reaction circuit component is electrically coupled to a mid-point of the second winding.

2. The electronic assembly of claim 1 , further comprising an antenna electrically coupled to the first end of the first winding of the balun transformer.

3. The electronic assembly of claim 2 , further comprising a ground terminal electrically coupled to the second end of the first winding of the balun transformer.

4. The electronic assembly of claim 3 , wherein the second winding of the balun transformer comprises a center tap and the reaction circuit component is electrically coupled to the second winding through the center tap.

5. The electronic assembly of claim 4 , further comprising an amplifier electrically coupled to the first winding of the balun transformer.

6. The electronic assembly of claim 5 , wherein the resonant circuit component further comprises an inductor.

7. The electronic assembly of claim 6 , wherein the substrate comprises silicon, germanium, gallium arsenide, or a combination thereof.

8. An electronic assembly comprising:

a substrate;

a balun transformer formed on the substrate and comprising a first winding and a second winding, each of the first and second windings having respective first and second ends;

an antenna formed on the substrate and electrically coupled to the first end of the first winding of the balun transformer;

a ground terminal on the substrate and electrically coupled to the second end of the first winding of the balun transformer;

an amplifier electrically coupled to the first end of the first winding of the balun transformer; and

a reaction circuit component formed on the substrate and electrically coupled to the second winding between the first and second ends thereof, wherein the balun transformer and the reaction circuit component jointly form a harmonically suppressed balun transformer having a fundamental frequency and wherein the reaction circuit component is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency.

9. The electronic assembly of claim 8 , wherein the reaction circuit component comprises a capacitor.

10. The electronic assembly of claim 9 , wherein the selected harmonic is a second harmonic of the fundamental frequency.

11. The electronic assembly of claim 10 , further comprising a transmitter on the substrate and electrically coupled to the first and second ends of the second winding of the balun transformer.

12. The electronic assembly of claim 11 , wherein the second winding of the balun transformer comprises a center tap and the reaction circuit component is electrically coupled to the second winding through the center tap, and further comprising a second ground terminal electrically coupled to the reaction circuit component.

13. A method for forming an electronic assembly comprising:

forming a first winding on a substrate, the first winding having first and second ends;

forming a second winding on the substrate, the second winding having first and second ends, the first and second windings jointly forming a balun transformer;

forming a reaction circuit component on the substrate, the reaction circuit component being electrically coupled to the second winding between the first and second ends thereof;

tuning the reaction circuit component such that the balun transformer and the reaction circuit component jointly form a harmonically suppressed balun transformer having a fundamental frequency and that resonates at a selected harmonic of the frequency; and

forming an antenna on the substrate, the antenna being electrically coupled to the first end of the first winding,

wherein the reaction circuit component comprises a capacitor and the selected harmonic frequency is a second harmonic of the fundamental frequency.

14. The method of claim 13 , wherein the second winding comprises a center tap and the reaction circuit component is electrically coupled to the second winding through the center tap.

Assignments (39)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
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RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
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SECURITY AGREEMENT Recorded Jun 18, 2013
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SECURITY AGREEMENT Recorded Sep 3, 2010
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SECURITY AGREEMENT Recorded Sep 3, 2010
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SECURITY AGREEMENT Recorded Sep 1, 2010
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To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Sep 1, 2010
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SECURITY AGREEMENT Recorded Mar 15, 2010
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To: CITIBANK, N.A.
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SECURITY AGREEMENT Recorded Jul 7, 2008
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2008
From: LI, QIANG; ABROKWAH, JONATHAN K.; HARTIN, OLIN L.; LIU, LIANJUN
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