Integrated circuit die, integrated circuit package, and packaging method
View Patent ↗An integrated circuit package includes an integrated circuit die 1 having a plurality of optical elements 5 sensitive to and/or capable of generating light, whereby data communication to circuitry of the integrated circuit die can be effected using a data channels implemented using the plurality of elements. The data channels are along optical pathways provided by an adapter unit 17 mounted on a PCB 19. The adapter unit 17 forms the optical pathways between optical fibers 23 and the respective optical element 5. Thus, there is no requirement to implement expensive wire-bonding as part of the packaging process.
1. An integrated circuit device, comprising:
an integrated circuit die having outer surfaces and internal electronic circuitry, the electronic circuitry including a plurality of optical elements disposed within but proximate to a major surface of the die, one or more of said optical elements including an optical detector, and one or more of the optical elements including an optical transmitter;
a plurality of electrical contacts coupled with the electronic circuitry;
a laminar support element that supports the integrated circuit die, wherein the laminar support element includes a plurality of vias in register with the plurality of optical elements, the vias allowing light to be transmitted to and from the plurality of optical elements, and wherein the electronic circuitry is powered by electrical power received by way of the electrical contacts, for processing data signals generated by the one or more optical detectors, and to generate data signals for transmission by the one or more optical transmitters; and
a resin body surrounding the outer surfaces of the integrated circuit die not supported by the laminar support element.
2. The integrated circuit device of claim 1 , further comprising:
an adapter unit on which the support element is mounted, the adapter unit comprising optical pathways for transmitting optical signals to the optical detectors through the vias, and receiving optical signals from the optical transmitters through the vias.
3. The integrated circuit device of claim 2 , wherein the adapter unit further comprises electrical paths in contact with the electrical contacts for transmitting electrical power to the electrical contacts.
4. The integrated circuit device of claim 2 , wherein the adapter unit includes a plurality of optical fibres, each optical fibre being in optical communication with at least one corresponding said optical pathway.
5. The integrated circuit device of claim 4 , wherein the adapter unit includes one or more elements for deflecting a beam of light transmitted between one of the optical fibers and a corresponding one of the optical elements.
6. The integrated circuit device according to claim 2 , wherein the adapter unit is mounted on a printed circuit board.
7. The integrated circuit device of claim 6 , further comprising a heat sink element mounted on the printed circuit board and thermally coupled to the integrated circuit die.
8. The integrated circuit device of claim 7 , wherein the heat sink element is thermally coupled to the die by a cured resin layer.