SEMICONDUCTOR MANUFACTURING PROCESS MODULES
A variety of process modules are described for use in semiconductor manufacturing processes.
1 . A device comprising:
a first entry shaped and sized for passage of a wafer;
a first interior accessible through the first entry;
a first slot valve operable to selectively isolate the first interior;
a second entry shaped and sized for passage of the wafer;
a second interior accessible through the second entry; and
a second slot valve operable to selectively isolate the second interior.
2 . The device of claim 1 further comprising a robotic arm adapted to access the first interior and the second interior.
3 . The device of claim 2 wherein the robotic arm includes a four-link SCARA arm.
4 . The device of claim 1 further comprising two robotic arms, including a first robotic arm adapted to access the first interior and a second robotic arm adapted to access the second interior.
5 . The device of claim 4 wherein the first robotic arm and the second robotic arm are separated by a buffer station.
6 . The device of claim 1 wherein the first interior includes a vacuum sub-chamber adapted for independent processing of wafers.
7 . The device of claim 6 wherein the second interior includes a second vacuum sub-chamber having a different processing tool than the first interior.
8 . The device of claim 1 wherein the second interior is separated from the first interior by a wall.
9 . The device of claim 1 wherein the first entry and the second entry are substantially coplanar.
10 . The device of claim 1 wherein the first entry forms a first plane angled to a second plane formed by the first entry.
11 . The device of claim 10 further comprising a robotic arm adapted to access the first entry and the second entry, wherein the first plane and the second plane are substantially normal to a line through a center axis of the robotic arm.
12 . The device of claim 1 further comprising:
a third entry shaped and sized for passage of the wafer;
a third interior accessible through the third entry; and
a third slot valve operable to selectively isolate the third interior.
13 . A device comprising:
a first entry shaped and sized for passage of a wafer;
an interior chamber adapted to hold a wafer;
a second entry shaped and sized for passage of the wafer, the second entry on an opposing side of the interior chamber from the first entry;
a slot valve at each of the first and second entries, the slot valves operable to selectively isolate the interior chamber; and
a tool for processing the wafer within the interior chamber.
14 . The device of claim 13 further comprising a first robot adapted to transfer wafers through the first entry.
15 . The device of claim 14 further comprising a second robot adapted to transfer wafers through the second entry.
16 . A system comprising:
a plurality of process modules coupled together to form a vacuum environment, the plurality of process modules including at least one process module selected from the group consisting of an in-line process module, a dual-entry process module, and a wide-entry process module;
one or more robot handlers within the vacuum environment adapted to transfer wafers among the plurality of process modules; and
at least one load lock adapted to transfer wafers between the vacuum environment and an external environment.
17 . The system of claim 16 further comprising at least one multi-wafer process module having an entry shaped and sized for passage of a single wafer.
18 . The system of claim 16 wherein one of the plurality of process modules includes an in-line process module.
19 . The system of claim 16 wherein one of the plurality of process modules includes a wide-entry process module.
20 . The system of claim 16 wherein one of the plurality of process modules includes dual-entry process module.