IP Library Granted Patent US 7,728,648
Granted Patent B2
US 7,728,648 · App. 12/032,326 · Granted Jun 1, 2010

Semiconductor device chip, semiconductor device system, and method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,728,648
App. No.
12/032,326
Granted
Jun 1, 2010
Kind
B2
Abstract

A semiconductor device chip, semiconductor device system, and a method. One embodiment provides a semiconductor device chip including a device for determining whether the semiconductor device chip is to be placed in a current saving operating mode.

Claims (11)

1. A semiconductor device chip comprising a device configured to determine whether the semiconductor device chip is to be placed in a deactivation or a current saving operating mode and including a onetime programmable element, wherein the device determines whether the semiconductor chip is to be placed in the current saving operating mode based on a state of the one-time programmable element, and wherein one or a plurality of receiver or driver/receiver using the chip are placed in a deactivated state in the current saving operating mode.

2. The semiconductor device chip of claim 1 , comprising wherein the one time programmable element is a fuse element.

3. The semiconductor device chip of claim 1 , comprising wherein the one time programmable element is an e-fuse resistor.

4. The semiconductor device chip of claim 1 , comprising wherein the state of one or a plurality of signals present at one or a plurality of pads of the chip is evaluated during the determination of whether the semiconductor device chip is to be placed in the current saving operating mode.

5. The semiconductor device chip of claim 4 , comprising wherein one or a plurality of the signal(s) is/are signals individually destined for the chip.

6. The semiconductor device chip of claim 5 , comprising wherein it is determined that the chip is to be placed in the current saving operating mode if one or a plurality of the signal(s) is/are in a state invalid for a non-current saving operating mode.

7. The semiconductor device chip of claim 4 , comprising wherein one or a plurality of the signal(s) is/are signals destined for one or a plurality of further chips in addition to the chip.

8. A semiconductor device chip comprising a device configured to determine, whether the semiconductor device chip is to be placed in a deactivation or a current saving operating mode and including a onetime programmable element wherein the device determines whether the semiconductor chip is to be placed in the current saving operating mode based on a state of the one-time programmable element and wherein one or a plurality of voltage generators of the chip are placed in a deactivated state in the current saving operating mode.

9. A semiconductor device chip comprising a device configured to determine whether the semiconductor device chip is to be placed in a deactivation or a current saving operating mode and including a onetime programmable element, wherein the device determines whether the semiconductor chi is to be laced in the current saving operating mode based on a state of the one-time programmable element, and wherein one or a plurality of voltage pumps of the chip are placed in a deactivated state in the current saving operating mode.

10. A semiconductor device chip comprising a device configured to determine whether the semiconductor device chip is to be placed in a deactivation or a current saving operating mode and including a one-time programmable element, wherein the device determines whether the semiconductor chip is to be placed in the current saving operating mode based on a state of the one-time programmable element, and wherein one or a plurality of lines or networks provided on the chip are connected with ground potential in the current saving operating mode.

11. A memory module comprising at least one semiconductor device chip according to claim 10 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 037254/0782 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2008
From: MINZONI, ALESSANDRO; SCHAFFROTH, THILO
To: QIMONDA AG
Reel/Frame 020838/0450 →