IP Library Granted Patent US 7,920,987
Granted Patent B2
US 7,920,987 · App. 12/037,333 · Granted Apr 5, 2011

Device under test de-embedding

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Quick Facts
Patent No.
US 7,920,987
App. No.
12/037,333
Granted
Apr 5, 2011
Kind
B2
Abstract

A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.

Claims (41)

1. A method, comprising:

determining at a processor device a first set of test measurements based on a first test structure;

determining at the processor device a first device under test (DUT) measurement based on an open test structure, a short test structure, and a through test structure and based on the first set of test measurements;

determining at the processor device a second DUT measurement based on the open test structure and the short test structure and based on the first set of test measurements;

calculating at the processor device an imperfection error based on the first DUT measurement and the second DUT measurement;

determining at the processor device a set of intrinsic electrical characteristics for a device under test based on the open test structure, the short test structure, the through test structure, a left test structure and a right test structure and based on the imperfection error; and

storing the set of intrinsic electrical characteristics.

2. The method of claim 1 , wherein the first test structure includes the device under test.

3. The method of claim 1 , wherein determining a set of intrinsic electrical characteristics comprises:

determining a second set of test measurements based on a second test structure including the device under test; and

determining the set of intrinsic electrical characteristics based on the second set of test measurements.

4. The method of claim 3 , wherein the first set of test measurements is associated with a two-port test structure and the second set of test measurements is associated with a three-port device.

5. The method of claim 4 , wherein the two-port test structure includes a resistive element.

6. The method of claim 1 , wherein calculating an imperfection error comprises subtracting the second test measurement from the first test measurement to determine the imperfection error.

7. The method of claim 1 , wherein determining the set of intrinsic electrical characteristics comprises subtracting the imperfection error from test measurements of the short test structure.

8. The method of claim 1 , wherein determining the first DUT measurement comprises determining the first DUT measurement based on a three-step method.

9. The method of claim 1 , wherein determining the second DUT measurement comprises determining the second DUT measurement based on a three-step method.

10. The method of claim 1 , wherein determining the set of intrinsic electrical characteristics comprises determining the set of intrinsic electrical characteristics based on a four-port method.

11. The method of claim 1 , wherein the first set of test parameters comprise scatter measurements.

12. The method of claim 1 , wherein the device under test is a two terminal device.

13. The method of claim 1 , further comprising designing an integrated circuit device based on the set of intrinsic electrical characteristics to produce an integrated circuit design.

14. The method of claim 13 , further comprising forming an integrated circuit based on the integrated circuit design.

15. A method, comprising:

determining at a processor device a first set of test measurements based on a first test structure including a device under test;

determining at the processor device a first DUT measurement based on the first set of test measurements and a three-step de-embedding method;

determining at the processor device a second DUT measurement based on the first set of test measurements and an open-short de-embedding method;

determining at the processor device an imperfection error based on the first DUT measurement and the second DUT measurement;

determining at the processor device a set of intrinsic electrical characteristics based on the imperfection error and a four-port de-embedding method; and

storing the set of intrinsic electrical characteristics.

16. The method of claim 15 , wherein the imperfection error is a short imperfection error.

17. The method of claim 15 , wherein determining the first set of test measurements comprises determining a set of scatter parameter measurements for the device under test.

18. A non-transitory computer readable medium containing a computer program, the computer program comprising instructions that, when executed by a processor, perform a method comprising:

determining a first set of test measurements based on a first test structure;

determining a first device under test (DUT) measurement based on an open test structure, a short test structure, and a through test structure and based on the first set of test measurements;

determining a second DUT measurement based on the open test structure and the short test structure and based on the first set of test measurements;

calculating an imperfection error based on the first DUT measurement and the second DUT measurement; and

determining a set of intrinsic electrical characteristics for the device under test based on the open test structure, the short test structure, the through test structure, a left test structure and a right test structure and based on the imperfection error.

19. The non-transitory computer readable medium of claim 18 , wherein the first test structure includes the device under test.

20. The non-transitory computer readable medium of claim 18 , wherein the instructions to determine a set of intrinsic electrical characteristics comprise instructions, when executed by the processor, perform a method to:

determining a second set of test measurements based on a second test structure including the device under test; and

determining the set of intrinsic electrical characteristics based on the second set of test measurements.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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SECURITY AGREEMENT Recorded Jul 7, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2008
From: KUO, SHUN-MEEN; TUTT, MARCEL N.
To: FREESCALE SEMICONDUCTOR, INC.
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