Method of making a semiconductor device including a bridgeable material
View Patent ↗A method for making a semiconductor device ( 10 ) includes providing an interconnect layer ( 14 ) over an underlying layer ( 12 ), forming a first insulating layer ( 16 ) over the interconnect layer, and forming an opening ( 18 ) through the insulating layer to the interconnect layer. A first conductive layer ( 24 ) is formed over the interconnect layer and in the opening. This is performed by plating so it is selective. A second conductive layer ( 28 ) in the opening is formed by displacement by immersion. This is performed after the first conductive layer has been formed. The result is the second conductive layer is formed by a selective deposition and is effective for providing it with bridging material. A layer of bridgeable material ( 34 ) is formed over the second conductive layer and in the opening. A third conductive layer ( 42 ) is formed over the bridgeable material. The semiconductor device may be useable as a conductive bridge memory device.
1. A method for making a semiconductor device, comprising:
providing an interconnect layer over an underlying layer;
forming a first insulating layer over the interconnect layer;
forming an opening through the insulating layer to the interconnect layer;
forming a first conductive layer over the interconnect layer and in the opening by plating;
forming a second conductive layer in the opening by immersion, wherein:
the second conductive layer is formed after the first conductive layer;
during immersion, the second conductive layer displaces a portion of the first conductive layer; and
the second conductive layer comprises bridging material;
forming a barrier layer over the second conductive layer;
forming a layer of bridgeable material over the barrier layer; and
forming a third conductive layer over the bridgeable material.
2. The method of claim 1 further comprising applying energy to the second conductive layer for forming clusters of bridging material in the layer of bridgeable material, wherein the clusters comprise bridging material from the second conductive layer.
3. The method of claim 1 further comprising applying a voltage between the interconnect layer and the third conductive layer to form a bridge of bridging material between the second conductive layer and the third conductive layer, wherein the clusters are connected by bridging material.
4. The method of claim 2 , wherein the step of forming the second conductive layer causes a replacement of a top portion of the first conductive layer.
5. The method of claim 4 , wherein the step of forming the second conductive layer is further characterized by bridging material comprising silver.
6. The method of claim 5 , wherein the step of forming the first conductive layer is further characterized by the first conductive layer comprising copper.
7. The method of claim 5 , wherein the step of forming the bridgeable material is further characterized by the bridgeable material comprising a chalcogenide.
8. The method of claim 5 , wherein the step of forming the bridgeable material is further characterized by the bridgeable material comprising an oxide.
9. The method of claim 1 , further comprising:
forming a second insulating layer over the first insulating layer and in the opening, wherein the second insulating layer is conformal, wherein the forming the second insulating layer is performed before forming the first conductive layer and the second insulating layer is of a different type of material from the first insulating layer; and
anisotropically etching the second insulating layer to result in a sidewall spacer along a sidewall of the opening.
10. The method of claim 1 , further comprising forming another barrier along a sidewall of the opening before forming the first conductive layer.
11. The method of claim 1 , wherein the barrier layer comprises one of a group consisting of cobalt and nickel, one of a group consisting of tungsten, molybdenum, and rhenium, and one of a group consisting of boron and phosphorus.
12. A method of forming a semiconductor device, comprising:
providing an interconnect layer over an underlying layer;
forming a first insulating layer over the interconnect layer;
forming an opening through the insulating layer to the interconnect layer;
forming a first conductive layer over the interconnect layer and in the opening by selective deposition, wherein the first conductive layer comprises bridging material;
forming a barrier layer over the first conductive layer;
forming a layer of bridgeable material over barrier layer; and
forming a second conductive layer over the bridgeable material.
13. The method of claim 12 , wherein the step of forming the first conductive layer is further characterized by the first conductive layer comprising copper.
14. The method of claim 12 , wherein the step of forming the layer of bridgeable material is further characterized by the layer of bridgeable material being a chalcogenide.
15. The method of claim 12 , wherein the step of forming the layer of bridgeable material is further characterized by the layer of bridgeable material being an oxide.
16. The method of claim 12 , further comprising:
forming a second insulating layer over the first insulating layer and in the opening, wherein the second insulating layer is conformal, wherein the forming the second insulating layer is performed before forming the first conductive layer and the second insulating layer is of a different type of material from the first insulating layer; and
anisotropically etching the second insulating layer to result in a sidewall spacer along a sidewall of the opening.
17. The method of claim 12 wherein the barrier layer comprises one of a group consisting of cobalt and nickel, one of a group consisting of tungsten, molybdenum, and rhenium, and one of a group consisting of boron and phosphorus.
18. A semiconductor memory device, comprising:
an interconnect layer over an underlying layer;
a first insulating layer over the interconnect layer;
an opening in the insulating layer to the interconnect layer;
a first conductive layer over the interconnect layer and in the opening, wherein the first conductive layer comprises a bridging material;
a first barrier over the first conductive layer;
a layer of bridgeable material over the first barrier; and
a second conductive layer over the bridgeable material.
19. The semiconductor memory device of claim 18 , further comprising a second barrier along a sidewall of the opening, wherein the second barrier is characterized as being an insulator and functions as a diffusion barrier between the first insulating layer and the first conductive layer.
20. The semiconductor memory device of claim 19 , wherein:
the second barrier allows transfer of material between the first conductive layer and the layer of bridgeable material during programming and erasing of the semiconductor memory device; and
the second barrier blocks transfer of material between the first conductive layer and the layer of bridgeable material during reading of the semiconductor memory device.