Prober apparatus and operating method therefor
View Patent ↗An operating method for a prober apparatus is disclosed which includes controlling the temperature of at least one part of the prober apparatus. Another operating method for a prober apparatus includes production and transfer of thermal energy between means for the exchange of heat and at least one component of the prober apparatus, wherein the production, the transfer or the production and the transfer of thermal energy is controlled. A prober apparatus includes at least one heat exchange element disposed in a spatial relation to at least one probe tool support so as to have an impact on the temperature thereof.
1. A method for operating a prober apparatus, the method comprising:
determining a target temperature of a component of a prober apparatus;
bringing the component to the target temperature by supplying or withdrawing thermal energy to or from the component by controlling a heat exchange element, wherein the heat exchange element comprises a heating element, and wherein the heating element comprises a heating foil comprising a carrier sheet supporting a heating wire; and
performing electronic tests on a device under test after the target temperature has been reached, the device under test being disposed inside the prober apparatus, wherein the target temperature corresponds to a stationary temperature of a portion of the component that is reached under test conditions without controlling the heat exchange element.
2. The method of claim 1 , wherein controlling the heat exchange element comprises controlling a flow of thermal energy by means of pulse width modulation or automatic control on demand based on a microcontroller.
3. The method of claim 1 , wherein controlling the heat exchange element comprises controlling a flow of thermal energy by means of closed-loop control.
4. A prober apparatus comprising:
a housing that provides a testing environment;
a support structure disposed in the housing, the support structure being adapted to support a device under test;
a prober disposed adjacent the support structure and configured to perform electronic tests on the device under test are disposed; and
a heat exchange element disposed adjacent the prober, wherein the heat exchange element comprises a heating element, and wherein the heating element comprises a heating foil comprising a carrier sheet supporting a heating wire; and
a controller adapted to determine a target temperature of a component of the prober apparatus and adapted to control the heat exchange element to bring the component to the target temperature, wherein the target temperature corresponds to a stationary temperature of the component that is reached under test conditions without controlling the heat exchange element.
5. The prober apparatus of claim 4 , wherein the prober comprises a probe card and a headplate, the probe card being supported on a surface of the headplate.
6. The prober apparatus of claim 4 , wherein the controller is adapted to perform closed loop control of the heat exchange element.
7. The prober apparatus of claim 6 , further comprising a plurality of temperature sensors coupled to the controller.
8. The prober apparatus of claim 7 , wherein the temperature sensors are attached to the component of the prober apparatus.
9. The prober apparatus of claim 7 , wherein the temperature sensors are attached to one single surface of the component.
10. A prober apparatus, comprising:
a housing that provides a testing environment;
a support structure disposed in the housing, the support structure being adapted to support a device under test;
a prober disposed adjacent the support structure and configured to perform electronic tests on the device under test are disposed, wherein the prober comprises a probe card and a headplate, the probe card being supported on a surface of the headplate;
a heat exchange element disposed adjacent the prober; and
a controller adapted to determine a target temperature of a component of the prober apparatus and adapted to control the heat exchange element to bring the component to the target temperature, wherein the target temperature corresponds to a stationary temperature of the component that is reached under test conditions without controlling the heat exchange element, wherein the heat exchange element comprises a heating foil comprising a carrier sheet supporting a heating wire, the heating foil being attached to the headplate.