IP Library Granted Patent US 7,839,613
Granted Patent B2
US 7,839,613 · App. 12/045,967 · Granted Nov 23, 2010

Electrostatic discharge protection circuit protecting thin gate insulation layers in a semiconductor device

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Quick Facts
Patent No.
US 7,839,613
App. No.
12/045,967
Granted
Nov 23, 2010
Kind
B2
Abstract

An electrostatic discharge protection circuit protects the internal circuits of a semiconductor. The electrostatic discharge protection circuit includes a first electrostatic protection unit connected to a power source supply pad. The first electrostatic protection unit discharges an ESD current into the power source supply pad when an ESD is introduced into the input/output pad, and generates a first driving voltage by utilizing the ESD current flow through a voltage-drop unit. A driver driven by the first driving voltage generates a second driving voltage by an ESD current. A second electrostatic protection unit discharges the introduced ESD current into the power source supply pad by the second driving voltage such that a voltage applied to a gate of the first NMOS transistor is reduced.

Claims (17)

1. An electrostatic discharge (ESD) protection circuit for protecting an internal circuit of a semiconductor, the ESD protection circuit being installed between an input/output pad and an input buffer including a first NMOS transistor, the ESD protection circuit comprising:

a first electrostatic protection unit connected to a power source supply pad, wherein the first electrostatic protection unit discharges an ESD current into a power source supply voltage pad and a ground voltage supply pad when an ESD is introduced into the input/output pad, and generates a first driving voltage by utilizing the ESD current flow through a voltage-drop unit;

a driver driven by the first driving voltage, wherein the driver generates a second driving voltage by an ESD current; and

a second electrostatic protection unit for discharging the introduced ESD current into the ground voltage supply pad by the second driving voltage such that a voltage applied to a gate of the first NMOS transistor is reduced,

wherein the driver includes a PMOS transistor having a source and a substrate directly connected to the input/output pad and a gate connected to the power source supply pad.

2. The ESD protection circuit as claimed in claim 1 , wherein the second electrostatic protection unit includes a second NMOS transistor having a drain connected to the gate of the first NMOS transistor and the input/output pad and a gate connected to a drain of the PMOS transistor, a source connected to the ground voltage supply pad, a substrate connected to the source, and a gate connected to the driver.

3. The ESD protection circuit as claimed in claim 2 , wherein the first electrostatic protection unit further comprises:

a capacitor having a first end of the capacitor connected to the power source voltage supply pad;

a resistor having a first end connected to a second end of the capacitor, and a second end connected to the ground voltage supply pad; and

a third NMOS transistor having a drain connected to the power source voltage supply pad, a gate connected to the first end of the resistor, a source connected to the ground voltage supply pad, and a substrate connected to the source.

4. The ESD protection circuit as claimed in claim 1 , wherein the driver further includes a resistor having a first end connected to the drain of the PMOS transistor and a second end connected to the ground voltage supply pad.

5. An electrostatic discharge (ESD) protection circuit for protecting an internal circuit of a semiconductor, the ESD protection circuit being installed between an input/output pad and an input buffer including a first NMOS transistor, the ESD protection circuit comprising:

a first electrostatic protection unit connected to a power source supply pad, wherein the first electrostatic protection unit discharges an ESD current into a power source voltage supply pad and a ground voltage supply pad when an ESD is introduced into the input/output pad, and generates a first driving voltage, and generates a second driving voltage by utiliizing the ESD current flow through a voltage-drop unit;

a driver driven by the second driving voltage, wherein the driver generates a third driving voltage by using an ESD current; and

a second electrostatic protection unit for discharging the introduced ESD current into the ground voltage supply pad by the first driving voltage and the third driving voltage, such that a voltage applied to a gate of the first NMOS transistor is reduced,

wherein the driver includes a PMOS transistor having a source and a substrate directly connected to the input/output pad and a gate connected to the power source supply pad.

6. The ESD protection circuit as claimed in claim 5 , wherein the second electrostatic protection unit includes a second NMOS transistor having a drain connected to the gate of the first NMOS transistor and the input/output pad and a gate is connected to a drain of the PMOS transistor, a source connected to the ground voltage supply pad, a substrate connected to the source, and a gate connected to the driver.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →