IP Library Granted Patent US 7,684,229
Granted Patent B2
US 7,684,229 · App. 12/048,176 · Granted Mar 23, 2010

Scalable embedded DRAM array

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Quick Facts
Patent No.
US 7,684,229
App. No.
12/048,176
Granted
Mar 23, 2010
Kind
B2
Abstract

A method and apparatus for scaling an embedded DRAM array from a first process to a second process, wherein the scaling involves reducing the linear dimensions of features by a constant scale factor. From the first process to the second process, DRAM cell capacitor layout area is reduced by the square of the scale factor, while cell capacitance is reduced by the scale factor. The voltage used to supply the logic transistors is scaled down from the first process to the second process. However, the voltage used to supply the sense amplifiers remains constant in both processes. Thus, in an embedded DRAM array of the second process, sense amplifiers are supplied by a greater voltage than the logic transistors. This allows the sensing voltage of DRAM cells to be maintained from one process generation to another, while allowing memory size to scale with the square of the process scale factor.

Claims (9)

1. A method for scaling an embedded DRAM array from a first process to a second process, wherein the DRAM array includes a plurality of DRAM cells and a plurality of sense amplifier transistors, the method comprising:

reducing the linear dimensions of features from the first process to the second process by a scaling factor; and

reducing the layout area of a capacitor structure present in each of the DRAM cells from the first process to the second process, wherein a capacitance associated with each DRAM cell is scaled down by the scaling factor, and the area of each DRAM cell is scaled down by the square of the scaling factor.

2. The method of claim 1 , further comprising:

reducing a first supply voltage from the first process to the second process, wherein the first supply voltage is used to operate logic transistors fabricated on the same chip as the embedded DRAM array; and

maintaining a constant sense amplifier supply voltage from the first process to the second process, wherein the sense amplifier supply voltage is used to operate the sense amplifier transistors of the DRAM array.

3. The method of claim 1 , further comprising:

reducing a first supply voltage in the first process to a second supply voltage in the second process, wherein the first supply voltage is used to operate logic transistors fabricated on the same chip as the embedded DRAM array in the first process, and wherein the second supply voltage is used to operate logic transistors fabricated on the same chip as the embedded DRAM array in the second process; and

using a third supply voltage, greater than the second supply voltage, to operate sense amplifier transistors of the embedded DRAM array in the second process.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2012
From: LEUNG, WINGYU
To: MONOLITHIC SYSTEM TECHNOLOGY, INC.
Reel/Frame 029417/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2012
From: MOSYS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027698/0690 →
CHANGE OF NAME Recorded Apr 3, 2008
From: MONOLITHIC SYSTEM TECHNOLOGY, INC.
To: MOSYS, INC.
Reel/Frame 020741/0975 →