Integrated circuit package system with support structure for die overhang

1. A method for manufacturing an integrated circuit package system comprising:

providing a substrate having a support mounted thereover;

mounting an integrated circuit die above the substrate;

mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support and attached thereto with an adhesive having a thickness larger than a thickness of the integrated circuit die;

connecting the wire-bonded die to the substrate and to the integrated circuit die with bond wires; and

encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.

2. The method as claimed in claim 1 wherein:

providing a substrate having a support mounted thereover includes having a component mounted thereover.

3. The method as claimed in claim 1 wherein:

providing a substrate having a support mounted thereover includes having a component mounted thereover and having an adhesive between the wire-bonded die and the component.

4. The method as claimed in claim 1 wherein:

providing a substrate having a support mounted thereover includes having a spacer mounted thereover.

5. The method as claimed in claim 1 wherein:

providing a substrate having a support mounted thereover includes having a spacer mounted thereover.

6. A method for manufacturing an integrated circuit package system comprising:

providing a substrate having a support mounted thereover;

mounting a first wire-bonded die above the substrate with a first die attach adhesive and connecting the first wire-bonded die with a bond wire to the substrate;

mounting a second wire-bonded die offset above the first wire-bonded die creating an overhang supported by the support, and attached to the first wire-bonded die and to the support with a second die attach adhesive having a thickness larger than a thickness of the integrated circuit die;

connecting the second wire-bonded die to the substrate with the bond wires connected above the overhang; and

encapsulating the first wire-bonded die, the second wire-bonded die and the bond wires with an encapsulation.

7. The method as claimed in claim 6 wherein:

providing a substrate having a support mounted thereover includes mounting the support to the substrate with a surface mount.

8. The method as claimed in claim 6 wherein:

providing a substrate having a support mounted thereover includes mounting the support to the substrate with a ball grid array.

9. The method as claimed in claim 6 wherein:

providing a substrate having a support mounted thereover includes mounting the support to the substrate with an adhesive.

10. The method as claimed in claim 6 wherein:

providing a substrate having a support mounted thereover includes mounting the support to the substrate by contact.

11. An integrated circuit package system comprising:

a substrate;

a support mounted over the substrate;

an integrated circuit die mounted above the substrate;

a wire-bonded die mounted offset above the integrated circuit die with an overhang;

an adhesive attached to the support and the overhang having a thickness larger than a thickness of the integrated circuit die and the wire-bonded die connected to the substrate and to the integrated circuit die with bond wires; and

an encapsulation encapsulating the integrated circuit die, the wire-bonded die and the bond wires.

12. The system as claimed in claim 11 wherein:

the support is a component.

13. The system as claimed in claim 11 wherein:

the support is a component attached to the overhang by an adhesive.

14. The system as claimed in claim 11 wherein:

the support is a spacer.

15. The system as claimed in claim 11 wherein:

the support is a spacer.

16. The system as claimed in claim 11 wherein:

the integrated circuit die is a first wire-bonded die mounted above the substrate by die attach adhesive and connected to the substrate with the bond wires; and

the wire-bonded die is a second wire-bonded die mounted to the first wire-bonded die with the die attach adhesive and the bond wires are connected above the overhang.

17. The system as claimed in claim 16 wherein:

the support is mounted to the substrate with a surface mount.

18. The system as claimed in claim 16 wherein:

the support is mounted to the substrate with a ball grid array.

19. The system as claimed in claim 16 wherein:

the support is mounted to the substrate with an adhesive.

20. The system as claimed in claim 16 wherein:

the support is mounted to the substrate by contact.