IP Library Granted Patent US 9,070,512
Granted Patent B2
US 9,070,512 · App. 12/052,251 · Granted Jun 30, 2015

Electrophoretically deposited cathode capacitor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,070,512
App. No.
12/052,251
Granted
Jun 30, 2015
Kind
B2
Abstract

An electrolytic capacitor includes a metal case, a porous pellet anode disposed within the metal case, an electrolyte disposed within the metal case, and a cathode element formed of an electrophoretically deposited metal or metal oxide powder of a uniform thickness disposed within the metal case and surrounding the anode. A method of manufacturing an electrolytic capacitor includes providing a metal case, electrophoretically depositing on the metal can a refractory metal oxide to form a cathode element, and placing a porous pellet anode and an electrolyte within the can such that the cathode element and the anode element being separated by the electrolyte.

Claims (18)

1. A method of manufacturing an electrolytic capacitor, comprising:

providing a metal case;

electrophoretically depositing a single uniform layer consisting only of tantalum powder on the metal case to form a cathode element, wherein the cathode element has an electrical conductivity of more than 0.01 Siemens per cm, wherein the thickness of the cathode element is less than 10 mils (254 μm); and

placing a porous pellet anode and an electrolyte within the can such that the cathode element and the anode element are separated by the electrolyte.

2. A method of forming an electrolytic capacitor, comprising:

placing a porous pellet anode within a metal case;

electrophoretically depositing a cathode element on an inner surface of the metal case, the cathode element consisting of a single uniform layer consisting only of tantalum power, the cathode element having a thickness of less than 10 mils (254 μm), the cathode element having an electrical conductivity of more than 0.01 Siemens per cm, the cathode element arranged to surround the anode; and

placing an electrolyte within the metal case such that the cathode and the anode are electrically connected by the electrolyte.

3. The method of claim 2 , further comprising connecting a first lead to the anode.

4. The method of claim 3 , further comprising connecting a second lead to the cathode.

5. The method of claim 2 , wherein the cathode layer has a thickness of 3 mils (76.2 μm) or greater.

6. A method of manufacturing an electrolytic capacitor, comprising:

providing a metal case;

electrophoretically depositing a single uniform layer consisting only of tantalum powder on an inner surface of the metal case to form a cathode element, wherein the cathode element has an electrical conductivity of more than 0.01 Siemens per cm, and wherein the thickness of the cathode element is less than 10 mils (254 μm); and

placing a porous pellet anode and an electrolyte within the case such that the cathode element and the anode element are physically separated and electrically connected by the electrolyte.

7. The method of claim 6 , further comprising connecting a first lead to the anode.

8. The method of claim 7 , further comprising connecting a second lead to the cathode.

9. The method of claim 6 , wherein the cathode layer has a thickness of 3 mils (76.2 μm) or greater.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2008
From: BREITHAUPT, STEVE; EIDELMAN, ALEX; KATRARO, REUVEN; COHEN, NISSIM
To: VISHAY SPRAGUE, INC.
Reel/Frame 020711/0410 →