Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends
A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed.
1. A method for fabricating a semiconductor device structure, comprising:
forming a first at least one via hole in an active surface of a fabrication substrate;
introducing a conductive material into at least a portion of the first at least one via hole to form at least one conductive via;
after or concurrently with forming the at least one conductive via, fabricating at least one conductive element in electrical communication with at least one active component on the active surface; and
after fabricating the at least one conductive element, forming a second at least one via hole in a back side of the fabrication substrate to communicate with the at least one conductive via, the second at least one via hole having a lateral dimension at least twice a lateral dimension of the first at least one via hole.
2. The method of claim 1 , wherein fabricating conductive elements comprises fabricating at least one of contact plugs, wiring lines, and contact pads.
3. The method of claim 1 , further comprising introducing conductive material into at least a portion of the second at least one via hole.
4. The method of claim 1 , wherein introducing a conductive material into at least a portion of the first at least one via hole includes introducing conductive material into the first at least one via hole while interconnecting the at least one active component.
5. The method of claim 3 , wherein introducing conductive material into at least a portion of the second at least one via hole includes at least one of plating a surface of the second at least one via hole with conductive material, depositing conductive material onto the surface of the second at least one via hole, and introducing molten conductive material into the second at least one via hole.
6. The method of claim 1 , wherein forming the first at least one via hole comprises forming at least one via hole having a diameter of about three micrometers (3 μm) to about six micrometers (6 μm).
7. The method of claim 1 , wherein forming the second at least one via hole comprises forming the second at least one via hole having a greater length than a length of the first at least one via hole.
8. The method of claim 1 , further comprising:
removing material from the back side of the fabrication substrate before forming the second at least one via hole.
9. A method for forming a conductive via through a semiconductor device structure, comprising:
fabricating active components on an active surface of a fabrication substrate;
forming a first at least one via hole in the active surface;
introducing conductive material into the first at least one via hole while fabricating interconnection circuitry to interconnect the active components;
thinning the fabrication substrate after fabricating the interconnection circuitry;
forming a second at least one via hole in a back side of the fabrication substrate after the fabrication substrate has been thinned, the second at least one via hole having a diameter at least two times greater than a diameter of the first at least one via hole and communicating with the first at least one via hole; and
introducing conductive material into the second at least one via hole and into contact with conductive material within the first at least one via hole.
10. The method of claim 9 , wherein:
forming the first at least one via hole comprises forming a plurality of first via holes; and
forming the second at least one via hole comprises forming the second via hole in communication with the plurality of first via holes.
11. The method of claim 9 , wherein forming the first at least one via hole is effected after fabricating the active components.