Integrated circuit and method for producing the same

1. An integrated circuit, comprising:

a carrier substrate;

a wiring level above a carrier substrate, wherein the wiring level comprises a first conductor track composed of a first conductive material and a second conductor track composed of the first conductive material;

an insulating layer above the wiring level, wherein the insulating layer comprises a first opening in a region of the first conductor track of the wiring level and a second opening in a region of the second conductor track of the wiring level, wherein the insulating layer comprises a first insulating material and the carrier substrate comprises a second insulating material different from the first insulating material, wherein the first insulating material of the insulating layer comprises a soldering resist paste, and wherein the insulating layer comprises a further opening in a region of the first conductor track and a portion of solder is arranged in the further opening on the first conductor track; and

a contact bridge composed of a second conductive material, wherein the contact bridge is connected to the first conductor track in a region of the first opening and is connected to the second conductor track in a region of the second opening.

2. The integrated circuit as claimed in claim 1 , wherein the second conductive material comprises a conductive adhesive.

3. The integrated circuit as claimed in claim 1 , wherein the second conductive material comprises conductive silver.

4. The integrated circuit as claimed in claim 1 , wherein the first conductive material comprises any of copper, tin, bismuth and aluminum.

5. An integrated circuit, comprising:

a carrier substrate;

a wiring level arranged on a first surface of the carrier substrate, wherein the wiring level comprises a first conductor track and a second conductor track;

an insulating layer above the wiring level, wherein the insulating layer comprises a first opening in a region of the first conductor track of the wiring level and a second opening in a region of the second conductor track of the wiring level, wherein the insulating layer comprises a further opening in a region of the first conductor track and a portion of solder is arranged in the further opening on the first conductor track;

a contact bridge, wherein the contact bridge is connected to the first conductor track in a region of the first opening and is connected to the second conductor track in a region of the second opening, and wherein the first and the second conductor track of the wiring level are composed of a first conductive material, and the contact bridge is composed of a second conductive material that is different from the first conductive material; and

an integrated circuit component arranged on a second surface of the carrier substrate, wherein the first surface and the second surface are opposite surfaces of the carrier substrate,

wherein the carrier substrate comprises an opening from the first surface to the second surface, and

wherein the integrated circuit component is connected to any of the first and the second conductor track of the wiring level by means of a connection in a region of the opening of the carrier substrate.

6. The integrated circuit as claimed in claim 5 , further comprising:

a housing that at least partly encompasses the integrated circuit component and the carrier substrate.

7. The integrated circuit as claimed in claim 5 , wherein the second conductive material comprises a conductive adhesive.

8. The integrated circuit as claimed in claim 5 , wherein the second conductive material comprises conductive silver.

9. The integrated circuit as claimed in claim 5 , wherein the first conductive material comprises any of copper, tin, bismuth and aluminum.