Granted Patent B2

US 7,969,164 · App. 12/059,012 · Granted Jun 28, 2011

Abstract

Claims (39)

1. A method for mini module EMI shielding effectiveness evaluation comprising:

providing a test vehicle including at least one test platform, the test platform having at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test;

applying shielding effectiveness transmission signals to the at least one mini emitter; and

evaluating signals received by the mini receiver with a shield under test and the mini receiver with the reference shield, wherein the at least one (i) mini emitter, (ii) mini receiver with the reference shield, and (iii) mini receiver with the shield under test comprise components fabricated concurrently and under fabrication conditions used for fabrication of the at least one test platform of the at least one test vehicle.

2. The method of claim 1 , wherein the test vehicle comprises a first test platform coupled to a first test fixture and a second test platform coupled to a second test fixture, the method for mini module shielding effectiveness evaluation further comprising:

changing a position of the first test fixture with respect to a position of the second test fixture.

3. The method of claim 1 , wherein the mini receiver with the reference shield comprises an EMI sensitive component selected from the group consisting of an RF component, a microwave component, a millimeter wave component, a digital chip component, and an optical module component.

4. The method of claim 1 , wherein for EMI shielding effectiveness corresponding to very near field measurements, the test platform comprises a conductive plate, a dielectric disposed overlying a portion of the conductive plate, a mini emitter, at least two mini receivers, a reference shield overlying one of the at least two mini receivers, and a shield under test overlying another of the at least two mini receivers.

5. The method of claim 4 , wherein the mini emitter is disposed within the test platform and positioned in a central location with respect to the at least two mini receivers, further wherein the at least two mini receivers comprise at least three mini receivers, the test platform further comprising a second reference shield overlying a mini receiver of the at least three mini receivers not covered by either one of the reference shield or the shield under test, still further wherein one of the at least three mini receivers is configured as a non-shielded mini reference receiver.

6. The method of claim 5 , wherein the at least two mini receivers comprise eight mini receivers, the mini receivers being collectively arranged in a square configuration, one mini receiver located at a midpoint of each side and one mini receiver located at each corner of the square configuration, further wherein the mini emitter is located within and at the center of the square configuration.

7. The method of claim 1 , wherein for EMI shielding effectiveness corresponding to near field measurements, the test platform comprises (i) an emitter portion and (ii) at least one receiver portion,

wherein the emitter portion comprises a first conductive plate, a dielectric disposed overlying a portion of the conductive plate, and a mini emitter, and

wherein the receiver portion comprises a second conductive plate, a dielectric disposed overlying a portion of the conductive plate, at least two mini receivers, a reference shield overlying one of the at least two mini receivers, and a shield under test overlying another of the at least two mini receivers.

8. The method of claim 7 , further wherein the emitter portion and the at least one receiver portion are positioned with respect to one another on a common platform, wherein the positioning of the emitter and receiver portions on the common platform simulates one or more operating condition of an EMI sensitive application, wherein the common platform comprises one of a conductive platform and a non-conductive platform.

9. The method of claim 8 , wherein the test platform further comprises (iii) at least one additional receiver portion, wherein the at least one additional receiver portion comprises a conductive plate, a dielectric disposed overlying a portion of the conductive plate, at least two mini receivers, a reference shield overlying one of the at least two mini receivers, and a shield under test overlying another of the at least two mini receivers, wherein the at least one additional receiver portion is also positioned with respect to the emitter portion on the common platform, wherein the positioning of the emitter portion and the at least one additional receiver portion on the common platform simulates one or more operating condition of the EMI sensitive application.

10. The method of claim 1 , wherein each mini receiver comprises a metal layer having an opening formed within the metal layer, a dielectric disposed within the opening, and a receiver antenna extending through the dielectric within the opening.

11. The method of claim 10 , wherein the mini receiver with the reference shield further comprises a second dielectric overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the second dielectric includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the second dielectric, and

wherein the mini receiver with the reference shield further comprises a via wall, the via wall extending from a top surface of the second dielectric, through the second dielectric, and in contact with the metal layer, the via wall further being disposed along a predefined perimeter about the receiver antenna, and a shield coupled to the via wall through a conductive attachment feature.

12. The method of claim 11 , further wherein the conductive attachment feature comprises at least one selected from the group consisting of a conductive attachment ring, a conductive attachment band, and a plurality of conductive attachment pads, and still further wherein the via wall comprises one selected from a single via wall and a double via wall.

13. The method of claim 10 , wherein the mini receiver with the shield under test further comprises a conductive feature overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the conductive feature includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the conductive feature, and wherein the shield under test couples to the conductive feature, and further wherein the conductive feature comprises at least one selected from the group consisting of a conductive coupon, a conductive band, and a conductive ring.

14. The method of claim 1 , wherein the mini emitter and the mini receiver with the shield under test are of different types, the different types having been chosen to simulate at least one selected from a given EMI sensitive circuit and a given EMI sensitive circuit application.

15. The method of claim 14 , further wherein at least one of the mini emitter and the mini receiver with the shield under test comprises a design for simulating an EMI sensitive circuit application.

16. The method of claim 15 , still further wherein the design includes at least one selected from the group consisting of (i) a single symmetric pole for one or both of the mini emitter and mini receiver disposed within a dielectric, (ii) a simple symmetric patch for one or both of the mini emitter and mini receiver wherein the symmetric patch is conductive and disposed overlying a dielectric, (iii) an emitter/receiver having a conductive strip overlying a dielectric, the conductive strip being grounded at one end of the strip, and (iv) an emitter/receiver having a corresponding first strip acting as a transmission line, which is connected to a resistive element which is then connected to a ground via.

17. The method of claim 1 , wherein the mini emitter and the mini receiver with the shield under test are arranged with respect to one another for carrying out transverse shielding effectiveness measurements.

18. The method of claim 1 , wherein the mini emitter and the mini receiver with the shield under test comprise a plurality of mini emitters and a single mini receiver arranged with respect to each other for carrying out both transverse and normal shielding effectiveness measurements.

19. A method for mini module EMI shielding effectiveness evaluation comprising:

providing a test vehicle including at least one test platform, the test platform having at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test;

applying shielding effectiveness transmission signals to the at least one mini emitter; and

evaluating signals received by the mini receiver with a shield under test and the mini receiver with the reference shield, wherein the at least one (i) mini emitter, (ii) mini receiver with the reference shield, and (iii) mini receiver with the shield under test comprise components fabricated concurrently and under fabrication conditions used for fabrication of the at least one test platform of the at least one test vehicle,

wherein each mini receiver comprises a metal layer having an opening formed within the metal layer, a dielectric disposed within the opening, and a receiver antenna extending through the dielectric within the opening,

wherein the mini receiver with the reference shield further comprises a second dielectric overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the second dielectric includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the second dielectric, and wherein the mini receiver with the reference shield further comprises at least one via wall, the via wall extending from a top surface of the second dielectric, through the second dielectric, and in contact with the metal layer, the via wall further being disposed along a predefined perimeter about the receiver antenna, and a shield coupled to the via wall through a conductive attachment feature, further wherein the conductive attachment feature comprises at least one selected from the group consisting of a conductive attachment ring, a conductive attachment band, and a plurality of conductive attachment pads, and

wherein the mini receiver with the shield under test further comprises a conductive feature overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the conductive feature includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the conductive feature, and wherein the shield under test couples to the conductive feature, and further wherein the conductive feature comprises at least one selected from the group consisting of a conductive coupon, a conductive band, and a conductive ring.

20. An apparatus for mini module EMI shielding effectiveness evaluation comprising:

a test vehicle including at least one test platform, the test platform having at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test;

means for applying shielding effectiveness transmission signals to the at least one mini emitter; and

means for evaluating signals received by the mini receiver with a shield under test and the mini receiver with the reference shield, wherein the at least one (i) mini emitter, (ii) mini receiver with the reference shield, and (iii) mini receiver with the shield under test comprise components fabricated concurrently and under fabrication conditions used for fabrication of the at least one test platform of the at least one test vehicle,

wherein each mini receiver comprises a metal layer having an opening formed within the metal layer, a dielectric disposed within the opening, and a receiver antenna extending through the dielectric within the opening,

wherein the mini receiver with the reference shield further comprises a second dielectric overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the second dielectric includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the second dielectric, and wherein the mini receiver with the reference shield further comprises at least one via wall, the via wall extending from a top surface of the second dielectric, through the second dielectric, and in contact with the metal layer, the via wall further being disposed along a predefined perimeter about the receiver antenna, and a shield coupled to the via wall through a conductive attachment feature, further wherein the conductive attachment feature comprises at least one selected from the group consisting of a conductive attachment ring, a conductive attachment band, and a plurality of conductive attachment pads, and

wherein the mini receiver with the shield under test further comprises a conductive feature overlying the metal layer and a portion of the dielectric disposed within the opening of the metal layer, wherein the conductive feature includes an opening in the region of the receiver antenna, wherein the receiver antenna extends through the opening in the conductive feature, and wherein the shield under test couples to the conductive feature, and further wherein the conductive feature comprises at least one selected from the group consisting of a conductive coupon, a conductive band, and a conductive ring.

Assignments (17)