Integrated circuit package for high-speed signals
An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board (PCB) transmission line to which the packaged chip is attached by, for example, solder balls. In one exemplary embodiment, a three-segment transmission line transformer provides improved broadband performance with the advantage of having a middle segment with a flexible length for easier routing. The length of each end segment of the three-segment transformer is adjusted to provide at least partial cancellation of reflections between the PCB and the transformer, and between the transformer and a circuit on the integrated circuit, respectively. Further, the inductive reactance of the solder balls and via wiring may be cancelled out by the transformed chip impedance to provide a non-inductive termination to the PCB transmission line at approximately one-half the highest data rate of the channel.
1. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein the circuit is adapted to provide an impedance (Zc) and the via stack has an impedance (Zv), and wherein the transformer is adapted to convert the impedance of the circuit to an impedance that combined with the impedance of the via stack has an impedance approximately that of a desired impedance (Zt);
wherein the transmission line transformer comprises:
a middle segment;
a first end segment coupled between the first transformer port and the middle segment; and
a second end segment coupled between the second transformer port and the middle segment; and
wherein the first end segment has a characteristic impedance of approximately |Zt+Zv|, the second end segment has a characteristic impedance of approximately |Zc|, and the middle segment has a characteristic impedance between the characteristic impedances of the first and second end segments.
2. The integrated circuit package of claim 1 , wherein the first end, middle, and second end segments have center-to-center spacings that are substantially the same.
3. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein the transmission line transformer comprises:
a middle segment;
a first end segment coupled between the first transformer port and the middle segment; and
a second end segment coupled between the second transformer port and the middle segment;
wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein the first end segment has a propagation delay approximately equal to the first propagation delay, and the second end segment has a propagation delay approximately equal to the second propagation delay.
4. The integrated circuit package of claim 3 , wherein, at a compensation frequency, the via stack has a reactance that substantially cancels reactance at the second transformer port, and wherein signals to be conveyed through the via stack have a maximum data rate, and the compensation frequency is approximately one-half the maximum data rate.
5. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein the transmission line transformer comprises one or more segment pairs, each segment pair comprising:
a first segment coupled to the first transformer port; and
a second segment coupled between the first segment and the second transformer port;
wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein the first segment has a propagation delay approximately equal to the first propagation delay, and the second segment has a propagation delay approximately equal to the second propagation delay.
6. The integrated circuit package of claim 5 , wherein, at a compensation frequency, the via stack has a reactance that substantially cancels reactance at the second transformer port, and wherein signals to be conveyed through the via stack have a maximum data rate, and the compensation frequency is approximately one-half the maximum data rate.
7. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein the circuit is adapted to provide an impedance (Zc) and the via stack has an impedance (Zv), and wherein the transformer is adapted to convert the impedance of the circuit to an impedance that combined with the impedance of the via stack has an impedance approximately that of a desired impedance (Zt);
wherein the transmission line transformer comprises:
a middle segment;
a first end segment coupled between the first transformer port and the middle segment; and
a second end segment coupled between the second transformer port and the middle segment; and
wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein the first end segment has a propagation delay approximately equal to the first propagation delay, and the second end segment has a propagation delay approximately equal to the second propagation delay.
8. An integrated circuit package comprising:
a chip having a circuit thereon adapted to provide an impedance (Zc);
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack having an impedance (Zv) and adapted to electrically couple the second port to a printed circuit board;
wherein the transformer is adapted to convert the impedance of the circuit to an impedance that combined with the impedance of the via stack has an impedance approximately that of a desired impedance (Zt);
wherein the transmission line transformer comprises one or more segment pairs, each segment pair comprising:
a first segment coupled to the first transformer port; and
a second segment coupled between the first segment and the second transformer port; and
wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein the first segment has a propagation delay approximately equal to the first propagation delay, and the second segment has a propagation delay approximately equal to the second propagation delay.
9. An integrated circuit package comprising:
a chip having a circuit thereon adapted to provide an impedance (Zc);
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack having an impedance (Zv) and adapted to electrically couple the second port to a printed circuit board;
wherein the transformer is adapted to convert the impedance of the circuit to an impedance that combined with the impedance of the via stack has an impedance approximately that of a desired impedance (Zt);
wherein the transmission line transformer comprises one or more segment pairs, each segment pair comprising:
a first segment coupled to the first transformer port; and
a second segment coupled between the first segment and the second transformer port; and
wherein the first segment has a characteristic impedance of approximately |Zt+Zv|, and the second segment has a characteristic impedance of approximately |Zc|.
10. The integrated circuit package of claim 9 , wherein the first and second segments have center-to-center spacings that are substantially the same.
11. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein between the first transformer port and the circuit is a first propagation delay, wherein the via stack has a second propagation delay, and wherein one segment of the multi-segment transformer has a propagation delay approximately equal to the first propagation delay, and another segment of the multi-segment transformer has a propagation delay approximately equal to the second propagation delay.
12. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein, at a compensation frequency, the via stack has a reactance that substantially cancels reactance at the second transformer port, and wherein signals to be conveyed through the via stack have a Nyquist bandwidth with a maximum frequency, the compensation frequency being approximately the maximum frequency.
13. The integrated circuit package of claim 12 , wherein the signals to be conveyed are non-return-to-zero signals having a maximum data rate, and the compensation frequency is approximately one-half the maximum data rate.
14. An integrated circuit package comprising:
a chip having a circuit thereon;
a multi-segment transmission line transformer having a first port and a second port, the first port coupled the circuit; and
a via stack adapted to electrically couple the second port to a printed circuit board;
wherein the via stack comprises:
a substrate;
a plurality of solder balls on a surface of the substrate; and
a pair of vias in the substrate;
wherein the pair of vias couples at least two of the plurality of solder balls to the second transformer port and wherein the substrate is a multilayer substrate comprising glass-epoxy.
15. The integrated circuit package of claim 14 , wherein the chip is bonded to a surface of the substrate opposite to the solder balls.