Method for manufacturing semiconductor integrated circuit device
View Patent ↗Cracks are generated in a resist film part used to form an opening part in a photoreceptor part, whereby etching is performed as far as the inter-layer insulating film in unintended portions. In order to prevent this, the resist pattern used as an etching mask is formed in a shape that disperses the stress. The stress is generated because the resist is hardened by post baking after having been exposed and developed. In order to disperse the stress, the opening part of the resist pattern is formed in a planar shape that has no corners.
1. A method for manufacturing a semiconductor integrated circuit device, comprising:
forming an inter-layer insulating film on a semiconductor substrate containing a photoreceptor part;
coating the inter-layer insulating film with a resist;
forming the resist into a resist pattern;
hardening the resist pattern; and
etching the inter-layer insulating film by using the resist pattern as a mask; wherein
an opening part having a planar shape that is devoid of corners is formed in the resist pattern on top of the photoreceptor part.
2. A method for manufacturing a semiconductor integrated circuit device, comprising:
forming on a semiconductor substrate having a photoreceptor part a wiring structure that is disposed on an edge of the photoreceptor part, and that surrounds the photoreceptor part in a planar shape that has corner parts;
forming an inter-layer insulating film on the semiconductor substrate and wiring structure;
coating a surface of the inter-layer insulating film with a resist;
forming the resist into a resist pattern;
hardening the resist pattern; and
etching the inter-layer insulating film by using the resist pattern as a mask; wherein
an opening part having a planar shape in which the portions corresponding to the corner parts are chamfered is formed in the resist pattern in an area surrounded by the wiring structure.
3. The method for manufacturing a semiconductor integrated circuit according to claim 2 , wherein the planar shape of the opening part is a polygonal shape that has eight or more sides.
4. The method for manufacturing a semiconductor integrated circuit device according to claim 2 , wherein the portions corresponding to the corner parts of the opening part are formed in the shape of a circular arc.