Chip-stacked semiconductor device and manufacturing method thereof
View Patent ↗The semiconductor device according to the present invention includes a through electrode that penetrates through a silicon substrate, an isolation trench provided to penetrate through the silicon substrate to surround the through electrode, a silicon film in contact with an inner surface of the isolation trench, a silicon film in contact with an outer surface of the isolation trench, and an insulation film provided between the silicon films. According to the present invention, the silicon film within the isolation trench can be substantially regarded as a part of the silicon substrate. Therefore, even when the width of the isolation trench is increased to increase the etching rate, the width of the insulation film becoming a dead space can be made sufficiently small. Consequently, the chip area can be decreased.
1. A method of manufacturing a semiconductor device comprising:
a first step for forming an isolation trench to surround a through electrode forming area from a main surface of a silicon substrate;
a second step for directly forming a silicon film on a bottom surface and a side surface of the isolation trench;
a third step for forming an insulation film on the silicon film to fill in a gap remaining in the isolation trench after forming the silicon film;
a fourth step for grinding a rear surface of the silicon substrate to expose the isolation trench to the rear surface side of the silicon substrate; and
a fifth step for forming a through electrode that penetrates through the silicon substrate, in the through electrode forming area.
2. The method of manufacturing a semiconductor device as claimed in claim 1 , wherein the third step includes a step for thermally oxidizing a surface of the silicon film.
3. The method of manufacturing a semiconductor device as claimed in claim 1 , wherein the third step includes a step for forming a silicon oxide film by the CVD method.
4. The method of manufacturing a semiconductor device as claimed in claim 2 , wherein the third step includes a step for forming a silicon oxide film by the CVD method.
5. The method of manufacturing a semiconductor device as claimed in claim 1 , wherein the silicon film is a polycrystalline silicon film.
6. The method of manufacturing a semiconductor device as claimed in claim 1 , wherein the silicon film is a monocrystalline silicon film.
7. A method of manufacturing a semiconductor device, comprising:
forming a trench surrounding a first area of a semiconductor substrate, the trench having a bottom surface and two side surfaces being opposite to each other;
forming a silicon film on the bottom surface and side surfaces of the trench;
forming an insulation film on the silicon film in the trench;
grinding a bottom surface of the semiconductor substrate to expose the insulation film formed over the bottom surface of the trench; and
forming a through electrode in the first area after grinding the bottom surface of the semiconductor substrate, the through electrode penetrating the semiconductor substrate.
8. The method of manufacturing a semiconductor device as claimed in claim 7 , wherein the insulation film includes a first layer formed by thermally oxidizing a surface of the silicon film.
9. The method of manufacturing a semiconductor device as claimed in claim 8 , wherein the insulation film includes a second layer formed on the first layer, the second layer being formed by CVD method.
10. The method of manufacturing a semiconductor device as claimed in claim 7 , wherein the insulation film is a silicon oxide film formed by CVD method.
11. The method of manufacturing a semiconductor device as claimed in claim 7 , wherein the silicon film is a polycrystalline silicon film.
12. The method of manufacturing a semiconductor device as claimed in claim 7 , wherein the silicon film is a monocrystalline silicon film.
13. The method of manufacturing a semiconductor device as claimed in claim 7 , further comprising:
forming a transistor on the semiconductor substrate between the forming of the insulation film and the grinding of the bottom surface of the semiconductor substrate.
14. A method of forming a ring-shaped isolation wall for a semiconductor device, the method comprising:
forming an isolation trench to surround a through electrode forming area from a main surface of a silicon substrate;
forming a silicon film on a bottom surface and a side surface of the isolation trench;
forming an insulation film on the silicon film to fill in a gap remaining in the isolation trench after forming the silicon film; and
grinding a rear surface of the silicon substrate to expose the isolation trench to the rear surface side of the silicon substrate.
15. The method of claim 14 , wherein the forming of the insulation film comprises:
thermally oxidizing a surface of the silicon film to form a thermal oxide film on the silicon film; and
depositing a silicon oxide film on the thermal oxide film.