Semiconductor device sealed in a resin section and method for manufacturing the same
View Patent ↗A semiconductor device includes a first semiconductor chip having a pad electrode formed on an upper surface thereof; a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed; a columnar electrode communicating between the upper surface and the lower surface of the resin section with the upper surface and the lower surface of the columnar electrode being exposed on the resin section and at least a part of the side surface of the columnar electrode being covered; and a bonding wire connecting the pad electrode and the columnar electrode with a part of the bonding wire being embedded in the columnar electrode as one end of the bonding wire being exposed on the lower surface of the columnar electrode and the remaining part of the bonding wire being covered with the resin section, and a method for manufacturing the same.
1. A semiconductor device comprising:
a first semiconductor chip having a pad electrode formed on an upper surface thereof;
a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed;
a columnar electrode communicating between an upper surface and a lower surface of the resin section with an upper surface and a lower surface of the columnar electrode being exposed on the resin section and at least a part of the side surface of the columnar electrode being covered; and
a bonding wire connecting the pad electrode and the columnar electrode with a portion of a length of the bonding wire embedded in the columnar electrode so that one end of the bonding wire is exposed on the lower surface of the columnar electrode and a remaining portion of the length of the bonding wire is covered with the resin section.
2. The semiconductor device according to claim 1 , wherein the side surface of the columnar electrode is surrounded by the resin section.
3. The semiconductor device according to claim 1 , wherein an outer surface of the columnar electrode is exposed on the resin section.
4. The semiconductor device according to claim 1 , further comprising a metal film formed on the upper surface and the lower surface of the columnar electrode.
5. The semiconductor device according to claim 1 , further comprising a second semiconductor chip flip-chip bonded on the first semiconductor chip with a lower surface and a side surface of the second semiconductor chip being covered with the resin section and an upper surface of the second semiconductor chip being exposed on the resin section.
6. The semiconductor device according to claim 1 , wherein the columnar electrode is made of copper or solder.
7. The semiconductor device according to claim 1 , wherein the first semiconductor chip is provided in plurality and such first semiconductor chips are stacked so as to superpose the columnar electrodes for the first semiconductor chips above and below.
8. A semiconductor device comprising:
a first semiconductor chip having a pad electrode formed on an upper surface thereof;
a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed;
a first and second columnar electrodes communicating between an upper surface and a lower surface of the resin section with an upper surface and a lower surface of each of the first and second columnar electrodes being exposed on the resin section and at least a part of the side surface of each of the first and second columnar electrodes being covered; and
a first and second bonding wires connecting the pad electrode and the first and second columnar electrodes, respectively, with a portion of a length of each of the first and second bonding wires embedded in the first and second columnar electrodes, respectively, so that one end of each of the first and second bonding wires is exposed on the lower surface of the first and second columnar electrodes, respectively, and a remaining portion of the length of each of the first and second bonding wires is covered with the resin section.