Automated test equipment with DIB mounted three dimensional tester electronics bricks
View Patent ↗Automated test equipment is provided which includes a test head having a tester electronics bricks mounted to a device interface board. In some embodiments, support circuitry is positioned adjacent the tester electronics bricks opposite the DIB. The support circuitry may include power circuitry and/or data bus circuitry, which may be coupled to separate sides, or the same side of the tester electronics brick. A heat transfer apparatus located between the DIB and the support circuitry may be provided for cooling the tester electronics bricks. A tester electronics brick may include multi-chip modules arranged so that the edges generally define interface sides of the tester electronics brick. These sides may include a DIB interface side mounted to the DIB, a data bus interface side, a power interface side, and a heat transfer interface side. Contacts may be located at the edges of the MCMs.
1. Automated test equipment comprising:
a) a test head comprising:
(i) a device interface board; and
(ii) a tester electronics brick comprising:
(1) multi-chip modules having edges, the multi-chip modules being arranged so that the edges generally define interface sides of the tester electronics brick;
(2) a DIB interface side mounted to the device interface board;
(3) a data bus interface side;
(4) a power interface side; and
(5) a heat transfer interface side.
2. The automated test equipment of claim 1 wherein the DIB interface side comprises electrical contacts at a DIB edge of the multi-chip modules.
3. The automated test equipment of claim 1 wherein the DIB interface side is mounted to the device interface board via a compressible connector.
4. The automated test equipment of claim 3 wherein the DIB interface side comprises contacts on a DIB edge of the multi-chip modules.
5. The automated test equipment of claim 1 further comprising a data bus coupled to the tester electronics brick at the data bus interface side.
6. The automated test equipment of claim 5 further comprising flexible printed circuit boards coupled to the multi-chip modules at the data bus interface side.
7. The automated test equipment of claim 6 wherein the flexible printed circuit boards are soldered to the multi-chip modules.
8. The automated test equipment of claim 5 further comprising interposers coupled between the multi-chip modules adjacent the data bus interface side.
9. The automated test equipment of claim 1 further comprising power circuitry coupled to the multi-chip modules at the power interface side.
10. The automated test equipment of claim 1 further comprising a heat transfer apparatus associated with the multi-chip modules.
11. The automated test equipment of claim 10 wherein the heat transfer apparatus comprises:
a) portions located between the multi-chip modules; and
b) projections extending beyond the multi-chip modules.
12. The automated test equipment of claim 11 further comprising a cooling line adjacent the heat transfer interface side of the tester electronics brick.
13. The automated test equipment of claim 12 further comprising a locking mechanism for securing the projections with the cooling line.
14. The automated test equipment of claim 12 wherein the cooling line is mounted with the device interface board.
15. The automated test equipment of claim 10 wherein the heat transfer apparatus comprises at least one of: (1) heat pipes; (2) cold plates; (3) heat sinks; or (4) fins mounted between the multi-chip modules.
16. The automated test equipment of claim 10 wherein the heat transfer apparatus comprises:
a) a cooling line mounted with the device interface board adjacent the heat transfer interface side of the tester electronics brick; and
b) heat pipes located between the multi-chip modules, the heat pipes comprising projections extending beyond the multi-chip modules and interlocking with the cooling line.
17. The automated test equipment of claim 1 wherein tester electronics brick is configured such that the power interface side is located opposite the DIB interface side and the bus interface side is opposite the heat transfer interface side.
18. The automated test equipment of claim 1 further comprising a heat transfer apparatus associated with the multi-chip modules comprising a cooling line adjacent the heat transfer interface side of the tester electronics brick, the heat transfer apparatus being positioned between the device interface board and power circuitry so as to be capable of supporting the power circuitry above the device interface board.
19. The automated test equipment of claim 1 further comprising the multi-chip modules being secured together as a unit.
20. The automated test equipment of claim 1 wherein the test head further comprises a plurality of the tester electronics bricks mounted to the device interface board.