Granted Patent B2

US 8,409,952 · App. 12/102,488 · Granted Apr 2, 2013

Abstract

Claims (48)

1. A method of forming an electronic device comprising:

forming a first trench in a workpiece including a substrate, the first trench having side walls and a bottom surface extending for a width between the side walls;

forming a charge-storage layer along the side walls and bottom surface of the first trench;

forming spacers along the side walls of the first trench overlying the charge-storage layer;

subsequent to forming the spacers, implanting ions within the substrate underlying the bottom surface of the first trench to form an implant region;

etching, after forming the spacers, at least a portion of the charge-storage layer;

removing the spacers after etching; and

annealing the implant region, wherein after annealing, the implant region extends the width of the bottom surface and along a portion of the side walls.

2. The method of claim 1 , wherein implanting ions comprises implanting a n-type dopant.

3. The method of claim 1 , wherein annealing comprises heating the workpiece at an annealing temperature of not less than approximately 800° C.

4. The method of claim 3 , wherein annealing comprises heating the workpiece at the annealing temperature for a time period of at least approximately 30 seconds.

5. The method of claim 1 , further comprising forming a second trench within the workpiece adjacent to the first trench, the second trench including side walls and a bottom surface extending for a width between the side walls.

6. The method of claim 1 , further comprising:

depositing an insulating material within a portion of the first trench adjacent to the bottom surface after forming the implant region.

7. The method of claim 6 , further comprising:

depositing a semiconductive material within a portion of the first trench overlying the insulating material after forming the implant region.

8. The method of claim 1 , wherein forming the first trench comprises:

forming a photoresist layer overlying the workpiece including the substrate;

patterning the photoresist layer to have openings; and

selectively removing portions of the workpiece underlying the openings.

9. The method of claim 1 , wherein forming the charge-storage layer further comprises:

forming a first oxygen-containing layer;

forming a nitrogen-containing layer over the first oxygen-containing layer; and

removing a portion of the nitrogen-containing layer overlying the bottom surface and exposing the first oxygen-containing layer on the bottom surface.

10. The method of claim 9 , wherein forming the charge storage layer further comprises:

the etching, wherein a portion of the nitrogen-containing layer overlying the bottom surface is etched, and exposing the first oxygen-containing layer on the bottom surface; and

forming a second oxygen-containing layer along the side walls overlying the nitrogen-containing layer and along the bottom surface overlying the first oxygen-containing layer.

11. The method of claim 1 , further comprising implanting ions within the substrate adjacent to the side walls of the trench to form localized implant regions before implanting ions within the substrate to form an implant region, wherein the localized implant regions comprise a different dopant material than the implant region.

12. The method of claim 5 , further comprising forming a third trench between the first trench and the second trench, the third trench having a depth significantly different than a depth of the first trench and a depth of the second trench.

13. The method of claim 12 , wherein the first trench and the second trench have substantially the same depth and the third trench has a depth that is at least approximately 10% less than the depth of the first trench and the second trench.

14. The method of claim 12 , further comprising:

forming an electrically conductive structure having a first portion within a portion of the third trench and a second portion overlying a portion of the third trench, wherein the electrically conductive structure has a width that is significantly greater than a width of the third trench.

15. The method of claim 12 , further comprising forming an electrically insulating material within the third trench.

16. The method of claim 7 , further comprising:

forming a first electrically conductive structure having a first portion overlying a portion of the first trench and a second portion of the electrically conductive structure within a portion of the first trench, wherein the first electrically conductive structure is formed at a substantially non-orthogonal angle to a length of the first trench; and

forming a second electrically conductive structure having a first portion overlying a portion of the second trench and a second portion within a portion of the second trench, wherein the second electrically conductive structure is formed at a substantially non-orthogonal angle to a length of the second trench.

17. The method of claim 16 , wherein the non-orthogonal angle is an acute angle.

18. The method of claim 1 further comprising:

forming a first trench in a workpiece having side walls and a bottom surface extending for a width between the side walls

forming a second trench in the workpiece having side walls and a bottom surface extending for a width between the side walls; and

forming a third trench in the workpiece having side walls and a bottom surface extending for a width between the side walls, wherein the third trench has a depth that is significantly less than a depth of the first trench and a depth of the second trench.

19. The method of claim 18 further comprising:

depositing an electrically insulating material within the third trench;

forming a charge-storage layer within the second trench;

forming spacers along the side walls of second trench overlying the charge-storage layer;

subsequent to forming the spacers of the second trench, implanting ions within the substrate underlying the bottom surface of the second trench to form implant regions; and

etching, after forming the spacers, at least a portion of the charge-storage layer; and

removing the spacers after etching.

Assignments (9)