Semiconductor device and method of manufacturing the same
View Patent ↗The invention enhances moisture resistance between a supporting body and an adhesive layer to enhance the reliability of a semiconductor device. A semiconductor device of the invention has a first insulation film formed on a semiconductor element, a first wiring formed on the first insulation film, a supporting body formed on the semiconductor element with an adhesive layer being interposed therebetween, a third insulation film covering the back surface of the semiconductor element onto the side surface thereof and the side surface of the adhesive layer, a second wiring connected to the first wiring and extending onto the back surface of the semiconductor element with the third insulation film being interposed therebetween, and a protection film formed on the second wiring.
1. A semiconductor device comprising:
a semiconductor element having a front surface, a back surface opposite from the front surface of the semiconductor element and a side surface connecting the front and back surfaces of the semiconductor element;
a first wiring formed on the front surface of the semiconductor element;
a supporting body disposed on the front surface of the semiconductor element;
an adhesive layer attaching the supporting body to the front surface of the semiconductor element, the adhesive layer having a front surface, a back surface opposite from the front surface of the adhesive layer and a side surface connecting the front and back surfaces of the adhesive layer, the back surface of the adhesive layer facing the front surface of the semiconductor element;
an insulation film covering the back surface of the semiconductor element, the side surface of the semiconductor element and the side surface of the adhesive layer;
a second wiring disposed on the insulation film so as to be connected to the first wiring; and
a protection film covering the second wiring.
2. The semiconductor device of claim 1 , further comprising a conductive terminal disposed on the second wiring.
3. The semiconductor device of claim 1 , wherein the second wiring is connected to a surface of the first wiring that faces the front surface of the semiconductor element.
4. The semiconductor device of claim 1 , further comprising a metal film disposed on a portion of the insulation film covering the side surface of the adhesive layer.
5. The semiconductor device of claim 1 , wherein the insulation film comprises an inorganic film.