IP Library › Granted Patent US 8,028,397
Granted Patent B2
US 8,028,397 · App. 12/107,349 · Granted Oct 4, 2011

Method of making a frame package array device

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Quick Facts
Patent No.
US 8,028,397
App. No.
12/107,349
Granted
Oct 4, 2011
Kind
B2
Abstract

The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.

Claims (8)

1. A method of making a frame packaged array device for holding a plurality of surface mount electronic components for attaching to a circuit board, each component having an electronic component body and first and second opposite terminations, the method comprising:

selecting electronic components to include in the array device; and

attaching the electronic components to an array frame only via the electronic component body, the array frame having an elongated spine and a plurality of ribs protruding axially from one side of the spine, the plurality of electronic components being attached to the array frame and located adjacent to the spine and between respective ribs for attaching the electronic components to the circuit board.

2. The method of claim 1 further comprising testing the electronic components.

3. The method of claim 1 further comprising applying a bonding agent to hold the electronic components in place on the array frame.

4. The method of claim 1 further comprising arranging and packaging the array assembly for automated placement onto circuit boards.

5. The method of claim 1 further comprising electrically attaching the electronic components to the printed circuit board.

6. The method of claim 1 wherein each electronic component is held between the elongated spine and respective ribs via a friction fit.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
MERGER Recorded Jul 18, 2008
From: VISHAY VITRAMON, INCORPORATED
To: VISHAY SPRAGUE, INC.
Reel/Frame 021253/0908 →
MERGER Recorded May 15, 2008
From: VISHAY VITRAMON, INCORPORATED
To: VISHAY SPRAGUE, INC.
Reel/Frame 020951/0047 →