IP Library Granted Patent US 8,127,111
Granted Patent B1
US 8,127,111 · App. 12/110,956 · Granted Feb 28, 2012

Managing data provided to switches in a parallel processing environment

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Quick Facts
Patent No.
US 8,127,111
App. No.
12/110,956
Granted
Feb 28, 2012
Kind
B1
Abstract

An integrated circuit comprises a plurality of tiles. Each tile comprises a processor including a storage module, wherein the processor is configured to process multiple streams of instructions, a switch including switching circuitry to forward data received over data paths from other tiles to the processor and to switches of other tiles, and to forward data received from the processor to switches of other tiles, and coupling circuitry configured to couple data resulting from processing an instruction from at least one of the streams of instructions to the storage module and to the switch.

Claims (21)

1. An integrated circuit, comprising:

a plurality of tiles, each tile comprising:

a processor, and

a switch including switching circuitry to forward data received over data paths from other tiles to the processor and to switches of other tiles, and to forward data received from the processor to switches of other tiles,

with the processor configured to determine whether to delay executing a first instruction received by the processor until an operation associated with a previous instruction has provided data to the switch, the previous instruction having been received by the processor, with the processor configured to determine whether to delay executing the first instruction based on whether the first instruction is configured to provide data to the switch, and configured to proceed to execute the first instruction while the operation associated with the previous instruction is loading data to the switch if the first instruction is not configured to provide data to the switch.

2. The integrated circuit of claim 1 , wherein the previous instruction loads data from a location outside the tile to be provided to the switch.

3. The integrated circuit of claim 2 , wherein the location outside the tile comprises an external memory coupled to at least one of the tiles.

4. The integrated circuit of claim 2 , wherein the processor comprises at least one pipeline comprising a plurality of stages.

5. The integrated circuit of claim 4 , wherein the processor is configured to couple data from a stage of the pipeline before a final stage to the switch.

6. The integrated circuit of claim 5 , wherein the final stage comprises a write-back stage.

7. The integrated circuit of claim 2 , wherein the previous instruction loads data from the location outside the tile in response to a cache miss.

8. A method for processing instructions in an integrated circuit, the integrated circuit comprising a plurality of tiles, each tile comprising a processor and a switch, the method comprising:

processing instructions in a processor of a tile; and

forwarding data received over data paths from other tiles to the processor and to switches of other tiles, and forwarding data received from the processor to switches of other tiles;

with the processor determining whether to delay executing a first instruction received by the processor until an operation associated with a previous instruction has provided data to the switch, the previous instruction having been received by the processor, with the processor determining whether to delay executing the first instruction based on whether the first instruction is configured to provide data to the switch, and executing the first instruction while the operation associated with the previous instruction is loading data to the switch if the first instruction is not configured to provide data to the switch.

9. The method of claim 8 , wherein the previous instruction loads data from a location outside the tile to be provided to the switch.

10. The method of claim 9 , wherein the location outside the tile comprises an external memory coupled to at least one of the tiles.

11. The method of claim 9 , wherein the processor comprises at least one pipeline comprising a plurality of stages.

12. The method of claim 11 , wherein the processor couples data from a stage of the pipeline before a final stage to the switch.

13. The method of claim 12 , wherein the final stage comprises a write-back stage.

14. The method of claim 9 , wherein the previous instruction loads data from the location outside the tile in response to a cache miss.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 42962/0859 Recorded Jul 13, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MELLANOX TECHNOLOGIES, LTD.; MELLANOX TECHNOLOGIES TLV LTD.; MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
Reel/Frame 046551/0459 →
SECURITY INTEREST Recorded Jun 23, 2017
From: MELLANOX TECHNOLOGIES, LTD.; MELLANOX TECHNOLOGIES TLV LTD.; MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 042962/0859 →
DIVIDEND DECLARATION FROM EZCHIP SEMICONDUCTOR INC. TO THE STOCKHOLDER OF RECORD ON 6/2/2015 (EZCHIP INC., A DELAWARE CORPORATION) Recorded Feb 16, 2017
From: EZCHIP SEMICONDUCTOR INC.
To: EZCHIP, INC.
Reel/Frame 041736/0013 →
PURCHASE AGREEMENT Recorded Feb 16, 2017
From: EZCHIP, INC.
To: EZCHIP SEMICONDUCTOR LTD.
Reel/Frame 041736/0151 →
MERGER Recorded Feb 16, 2017
From: EZCHIP TECHNOLOGIES LTD.
To: EZCHIP SEMICONDUCTOR LTD.
Reel/Frame 041736/0321 →
MERGER Recorded Feb 16, 2017
From: EZCHIP SEMICONDUCTOR LTD.
To: MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 041870/0455 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2017
From: EZCHIP SEMICONDUCTOR LTD.
To: EZCHIP TECHNOLOGIES, LTD.
Reel/Frame 041736/0253 →
MERGER Recorded Feb 16, 2017
From: TILERA CORPORATION
To: EZCHIP SEMICONDUCTOR INC.
Reel/Frame 041735/0792 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2008
From: WENTZLAFF, DAVID; AGARWAL, ANANT
To: TILERA CORPORATION
Reel/Frame 020991/0102 →