Wordline resistance reduction method and structure in an integrated circuit memory device
View Patent ↗Methods and structures for reducing resistance in wordlines of an integrated circuit memory device are disclosed. In one embodiment, the method includes forming multiple columns of polycrystalline silicon for respective number of wordlines, forming core transistor junctions and periphery transistor junctions associated with the wordlines, performing a salicidation process for the periphery transistor junction and performing a salicidation process for the columns of polycrystalline silicon to from the wordlines with low resistance.
1. A method for wordline formation in an integrated circuit memory device, comprising:
forming a plurality of columns of a polycrystalline silicon for respective number of wordlines;
forming respective recesses in the plurality of columns by selectively etching top surfaces of the plurality of columns, wherein the selective etching comprises:
depositing an etch stop layer on top of the plurality of columns and depositing a thick oxide layer on top of the etch stop layer;
performing a chemical-mechanical planarization process to remove the thick oxide layer; and
performing a dry etching process with a high selectivity of a material forming the etch stop layer over another material forming the thick oxide layer;
forming core transistor junctions associated with the wordlines; and
performing a salicidation process for the plurality of columns of the polycrystalline silicon to form the wordlines with low resistance, wherein the salicidation process reduces the resistance of the wordlines, wherein other regions except the plurality of columns of the polycrystalline silicon are shielded from the salicidation process.
2. The method of claim 1 , wherein the forming the plurality of columns comprises:
depositing the polycrystalline silicon over insulation layer on floating gates or over charge storage film stacks of memory cells of the integrated circuit memory device to form a wordline layer; and
masking and etching the wordline layer to form the plurality of columns of the polycrystalline silicon and a plurality of gaps in between the plurality of columns.
3. The method of claim 1 , wherein the forming the core transistor junctions further comprises implanting a dose of impurities to the core transistor junctions.
4. The method of claim 1 , wherein the performing the salicidation process comprises:
forming respective oxide spacers in between the plurality of columns of the polycrystalline silicon to provide an insulation between adjacent ones of the wordlines; and
filling the respective recesses with a transition metal or a metal.
5. The method of claim 4 , further comprising annealing the polycrystalline silicon and the transition metal or the metal until the salicidation process is completed.
6. The method of claim 4 , wherein the forming the respective oxide spacers is performed by depositing a spacer material to the plurality of gaps.
7. The method of claim 4 , wherein the transition metal comprises a cobalt, a nickel, a platinum, a titanium or a tungsten.
8. The method of claim 4 , further comprising performing a chemical-mechanical planarization process if the metal is used.
9. The method of claim 4 , wherein the selectively etching the top surfaces of the plurality of columns further comprises:
depositing an etch stop layer on top of the plurality of columns of the polycrystalline silicon and the respective oxide spacers; and
performing a dry etching process with a high selectivity of a material forming the etch stop layer over another material forming the thick oxide layer and spacer.
10. The method of claim 9 , wherein the etch stop layer comprises a silicon nitride, an oxynitride or a silicon oxynitride.
11. The method of claim 9 , wherein the oxide spacers comprise depressions formed on surfaces of the oxide spacers.
12. The method of claim 11 , wherein remnants of the thick oxide layer buried in the depressions survive the chemical-mechanical planarization process.
13. The method of claim 12 , wherein the dry etching process does not affect the remnants of the oxide layer buried in the depressions such that the oxide spacers are unscathed by the dry etching process.
14. A method for wordline formation in an integrated circuit memory device, comprising:
forming a plurality of columns of a polycrystalline silicon for respective number of wordlines;
forming respective recesses in the plurality of columns by selectively etching top surfaces of the plurality of columns, wherein the selective etching comprises:
depositing an etch stop layer on top of the plurality of columns and depositing a thick oxide layer on top of the etch stop layer;
performing a chemical-mechanical planarization process to remove the thick oxide layer; and
performing a dry etching process with a high selectivity of a material forming the etch stop layer over another material forming the thick oxide layer;
forming core transistor junctions and periphery transistor junctions;
performing a salicidation process for the periphery transistor junctions; and
performing a salicidation process for the wordlines that reduces resistance formed on the plurality of wordlines,
wherein the salicidation process for the periphery transistor junctions and core transistor junctions is separately performed from the salicidation process for the wordlines.
15. The method of claim 14 , wherein the forming the plurality of columns comprises:
depositing the polycrystalline silicon over insulation layer on floating gates or over charge storage film stacks of memory cells of the integrated circuit memory device to form a wordline layer; and
masking and etching the wordline layer to form the plurality of columns of the polycrystalline silicon and a plurality of gaps in between the plurality of columns.
16. The method of claim 14 , wherein the performing the salicidation process for the periphery transistor junction comprises depositing a transition metal over the periphery transistor junction and annealing the transition metal.
17. The method of claim 14 , wherein the performing the salicidation process for the wordlines further comprises:
forming respective oxide spacers in between the plurality of columns of the polycrystalline silicon to provide an insulation between adjacent ones of the wordlines; and
filling the respective recesses with a transition metal or a metal.
18. The method of claim 17 , wherein the selectively etching the top surfaces of the plurality of columns further comprises:
depositing an etch stop layer on top of the plurality of columns of the polycrystalline silicon and the respective oxide spacers; and
performing a dry etching process with a high selectivity of a material forming the etch stop layer over another material forming the thick oxide layer and spacer.
19. A wordline structure, comprising:
a plurality of silicon gates for memory cells; and
a plurality of wordlines coupled to the plurality of silicon gates communicating at least one wordline signal, wherein the plurality of wordlines are formed by a process comprising the steps of:
forming a plurality of columns of a polycrystalline silicon for respective number of wordlines;
forming respective recesses in the plurality of columns by selectively etching top surfaces of the plurality of columns, wherein the selective etching comprises:
depositing an etch stop layer on top of the plurality of columns and depositing a thick oxide layer on top of the etch stop layer;
performing a chemical-mechanical planarization process to remove the thick oxide layer; and
performing a dry etching process with a high selectivity of a material forming the etch stop layer over another material forming the thick oxide layer;
forming core transistor junctions associated with the wordlines; and
performing a salicidation process for the plurality of columns of the polycrystalline silicon to form the wordlines with low resistance,
wherein other regions except the plurality of columns of the polycrystalline silicon are shielded from the salicidation process.
20. The wordline structure of claim 19 , wherein the salicidation process of the plurality of wordlines reduces resistance formed on the plurality of wordlines.