IP Library › Granted Patent US 8,114,301
Granted Patent B2
US 8,114,301 · App. 12/114,173 · Granted Feb 14, 2012

Graphoepitaxial self-assembly of arrays of downward facing half-cylinders

Assignee: Micron Technology, Inc.
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Quick Facts
Patent No.
US 8,114,301
App. No.
12/114,173
Granted
Feb 14, 2012
Kind
B2
Abstract

Methods for fabricating sublithographic, nanoscale microstructures in line arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Claims (45)

1. A method of forming a nanostructured polymer material on a substrate, comprising:

forming a self-assembling block copolymer material within a trench in a material layer on the substrate, the trench having a length, a neutral wetting floor, and opposing sidewalls and ends that are preferentially wetting to a minority block of the block copolymer;

applying a material preferentially wetting to the minority block over and in contact with the block copolymer material within the trench; and

annealing the block copolymer material such that the block copolymer material self-assembles into one or more rows of half cylinders of the minority block of the block copolymer within a matrix of a majority block of the block copolymer, the one or more rows of half cylinders oriented parallel to the trench floor and extending the length of the trench, with a face oriented toward and wetting the neutral wetting trench floor.

2. The method of claim 1 , wherein the minority block of the block copolymer comprises a metal.

3. The method of claim 2 , wherein the metal is selected from the group consisting of silicon, chromium, titanium, aluminum, molybdenum, gold, platinum, ruthenium, zirconium, tungsten, vanadium, lead, and zinc.

4. The method of claim 2 , wherein the minority block of the block copolymer is selected from the group consisting of poly(vinylpyridine), poly(methylmethacrylate), poly(lactide), poly(tert-butyl acrylate) poly(ethylene-co-butylene), poly(ethylene oxide), poly(butadiene), and polystyrene.

5. The method of claim 2 , wherein the minority block of the block copolymer is selected from the group consisting of polydimethylsiloxane, poly(vinylmethylsiloxane), and poly(ferrocenylmethylethylsilane).

6. The method of claim 1 , wherein the majority block of the block copolymer is selected from the group consisting of poly(styrene), poly(isoprene), poly(butadiene), and poly(ethylene-alt-propylene), and poly(methylmethacrylate).

7. The method of claim 1 , wherein applying the preferentially wetting material comprises contacting the block copolymer material within the trench with an elastomeric material.

8. The method of claim 7 , wherein the preferentially wetting material comprises poly(dimethylsiloxane) or poly(urethane).

9. The method of claim 8 , wherein the preferentially wetting material comprises poly(dimethylsiloxane) having a hydrophilic surface.

10. The method of claim 9 , wherein the preferentially wetting material comprises poly(dimethylsiloxane) comprising silanol groups on a surface.

11. The method of claim 1 , wherein applying the preferentially wetting material comprises depositing an inorganic material to form a layer over the block copolymer material within the trench.

12. The method of claim 11 , wherein the preferentially wetting material comprises a spin-on dielectric material.

13. The method of claim 1 , further comprising removing the preferentially wetting material to expose the annealed block copolymer material within the trench.

14. The method of claim 13 , wherein removing the preferentially wetting material comprises separating the preferentially wetting material from the annealed block copolymer material.

15. The method of claim 14 , further comprising, applying a solvent to the preferentially wetting material to enhance removal.

16. The method of claim 13 , wherein the preferentially wetting material comprises an oxide material and removing the preferential wetting material layer comprises applying a fluoride-based etchant.

17. The method of claim 1 , further comprising selectively removing the majority polymer block to expose the one or more rows of half cylinders and the substrate adjacent thereto.

18. The method of claim 1 , further comprising selectively removing polymeric material to expose the substrate and forming a metal component of the minority block into an inorganic metal material such that said inorganic metal material forms a line on the substrate.

19. A method of forming a nanostructured polymer material on a substrate, comprising:

forming a block copolymer material within a trench in a material layer overlying the substrate, the trench having a width, a length, a depth, a neutral wetting floor, and opposing sidewalls and ends that are preferentially wetting to a minority block of the block copolymer;

applying a material preferentially wetting to the minority block over and in contact with the block copolymer material within the trench; and

causing a microphase separation in the block copolymer material to form one or more rows of half-cylinders comprising the minority block of the block copolymer in a matrix of a majority block of the block copolymer, the one or more rows of half-cylinders oriented parallel to the trench floor and registered to the sidewalls in one or more lines extending the length of the trench, with a face situated on the neutral wetting trench floor.

20. The method of claim 19 , wherein the trench has a width of about 1.5-2 times the L value of the block copolymer, and a single row of a half-cylinder is formed within the trench having a width of about 0.5*L.

21. The method of claim 19 , wherein the trench has a width greater than about 2 times the L value of the block copolymer, and two or more rows of half-cylinders are formed within the trench at a center-to-center distance of about the L value of the block copolymer.

22. The method of claim 21 , wherein the trench has a width of about 3 or more times the L value of the block copolymer.

23. The method of claim 19 , wherein the neutral wetting floor comprises a blend of grafted homopolymers.

24. A method of forming a nanostructured polymer material on a substrate, comprising:

forming a self-assembling block copolymer material within a trench in a material layer on the substrate, the trench having a length, a neutral wetting floor, and opposing sidewalls and ends that are preferentially wetting to a minority block of the block copolymer;

applying an atmosphere preferentially wetting to the minority block over and in contact with the block copolymer material within the trench; and

annealing the block copolymer material such that the block copolymer material self-assembles into one or more rows of half-cylinders of the minority block of the block copolymer within a matrix of a majority block of the block copolymer, the one or more rows of half-cylinders being oriented parallel to the trench floor and extending the length of the trench, with a face oriented toward and wetting the neutral wetting trench floor, and the minority block forming a layer over the block copolymer material.

25. The method of claim 24 , wherein the preferentially wetting atmosphere is selected from the group consisting of clean dry air, humid air, and a near-saturated solvent atmosphere.

26. A method of forming a nanostructured polymer material on a substrate, comprising:

applying a material over and in contact with a block copolymer material within a trench, said material being preferentially wetting to a minority block of the block copolymer material, the trench having a length, a neutral wetting floor, and opposing sidewalls and ends that are preferentially wetting to said minority block of the block copolymer; and

annealing the block copolymer material such that one or more lines of parallel-oriented half-cylinders of said minority block form within the trench within a matrix of a majority block of the block copolymer, said one or more lines of half-cylinders extending the length of the trench and oriented parallel to the trench floor, with a face oriented toward and wetting the neutral wetting trench floor.

27. The method of claim 26 , wherein the minority block of the block copolymer comprises a metal.

28. The method of claim 26 , wherein the preferentially wetting material comprises poly(dimethylsiloxane) or poly(urethane).

29. The method of claim 26 , wherein the preferentially wetting material comprises an oxide material.

30. The method of claim 26 , wherein the preferentially wetting material is a preferentially wetting atmosphere selected from the group consisting of dry air, humid air, and a near-saturated solvent atmosphere.

31. The method of claim 30 , wherein the preferential wetting atmosphere is a near-saturated solvent atmosphere comprising ethanol or dimethylformamide.

32. The method of claim 26 , further comprising removing the preferentially wetting material from contact with the annealed block copolymer material.

33. The method of claim 32 , further comprising selectively removing the majority polymer block to expose said one or more lines of half-cylinders and the substrate adjacent thereto.

34. The method of claim 26 , further comprising removing a layer of the minority block overlying a surface of the annealed block copolymer material within the trench.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2008
From: MILLWARD, DAN B.; WESTMORELAND, DONALD
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020893/0219 →
Continuity (1)
Related Publication 20090274887A1 · Nov 5, 2009