Semiconductor package structures having liquid coolers integrated with first level chip package modules
View Patent ↗Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
1. An electronic apparatus, comprising:
an organic laminate package substrate comprising first and second opposing surfaces, an IC (integrated circuit) chip flip-chip mounted to the first surface of the package substrate, and an area array of contacts pads formed on a second surface of the package substrate;
a metallic stiffener structure bonded to the package substrate first surface to provide mechanical rigidity to the package substrate; and
a metallic cooler device having upper and lower opposing surfaces and sidewall surfaces, wherein the lower surface of the metallic cooler device is thermally bonded directly to a backside surface of the IC chip;
wherein the metallic cooler device is mechanically coupled to the metallic stiffener structure by extension tabs extending from the metallic stiffener member to each of the sidewall surfaces of the metallic cooler to fixedly maintain the metallic cooler device in position on the backside of the IC chip,
wherein the metallic cooler device comprises a pattern of thermal fins and flow channels surrounded by sidewalls of the metallic cooler device,
wherein a footprint area of the lower surface of the metallic cooler device includes an active surface cooling region and a non-active surface cooling region,
wherein the active surface cooling region is defined by a surface area aligned to the pattern of thermal fins and flow channels between the sidewalls or other microstructures which have a reduced hydraulic diameter and increased cooler surface area;
wherein the non-active surface cooling region surrounds the active surface cooling region, and has an area defined, in part, by a width of the sidewalls around the peripheral region of the lower surface,
wherein the IC chip has a length Lc and width Wc that defines a footprint size of the backside surface of the IC chip;
wherein the active cooling surface region on the lower surface of the metallic cooler device is smaller in a direction perpendicular to the flow channels than the IC chip size, and a width of the footprint area of the lower surface of the metallic cooler device is equal to or wider than the IC chip in the direction perpendicular to the flow channels.
2. The apparatus of claim 1 , further comprising:
a second level package substrate; and
an area array of electrical contacts electrically connecting the area array of contact pads on the second surface of the organic package substrate to a corresponding array of contact pads on a first surface of the second level package substrate.
3. The apparatus of claim 2 , wherein the area array of electrical contacts are BGA (ball grid array) electrical contacts.
4. The apparatus of claim 3 , wherein a total weight of the metallic cooler and the metallic stiffener structure is equal to or less than about
2.7
grams
cm
2
×
Substrate
Area
(
cm
2
)
,
when the metallic cooler device and the metallic stiffener structure are formed of a metallic material having a density of about
9
grams
cm
2
.
5. The apparatus of claim 2 , wherein the area array of electrical contacts include land grid array (LGA) contacts of an LGA compressed between the first and second package substrates, wherein LGA actuation is achieved with a compressive force applied to the metallic cooler device and stiffener or lid.
6. The apparatus of claim 1 , wherein the organic laminate package substrate has a thickness that is less than about 0.8 mm.
7. The apparatus of claim 1 , wherein the metallic cooler device is thermally bonded directly to the backside surface of the IC chip using a thermal adhesive bond material or a soft solder.
8. The apparatus of claim 1 , wherein the metallic stiffener structure comprises:
a planar frame portion that is adhesively bonded to an outer peripheral region of the first surface of the organic package substrate; and
the extension tabs that mechanically couple the planar frame portion and the metallic cooler device together.
9. The apparatus of claim 8 , wherein the extension tabs are integrally formed as part of the planar frame structure and are bonded to the metallic cooler device using adhesive bonding material.
10. The apparatus of claim 9 , wherein the extension tabs are sized and shaped to apply a compressive force to the metallic cooler device against the backside surface of the IC chip.
11. The apparatus of claim 1 , wherein the metallic cooler device comprise a coolant fluid inlet and a coolant fluid outlet on the upper surface thereof.