Stacked and redundant chip coolers

1. A cooler comprising:

a base layer;

a cooling layer disposed on the base layer and comprising at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure comprising at least three heat exchange zones, wherein a first inlet slot is disposed between a first adjacent pair of the heat exchange zones and a first outlet slot is disposed between a second adjacent pair of the heat exchange zones, the cooling structure comprising a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered; and

a multilayer manifold disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least one inlet slot and from the at least one outlet slot to a cooler outlet, the multilayer manifold having a bottom layer, a first intermediate layer, a second intermediate layer, and a top layer sequentially disposed on the cooling layer, the top layer comprising the cooler inlet and the cooler outlet, the bottom layer comprising a plurality of tapered slots disposed over respective ones of the inlet slots and outlet slots, the first intermediate layer comprising a plurality of chambers corresponding to respective ones of the tapered slots of the bottom layer, and the second intermediate layer connecting groups of the chambers to one of the cooler inlet and the cooler outlet.

2. The cooler of claim 1 , wherein the inlet slot and outlet slot have an opening wider at a top portion adjacent to the at least one manifold layer and narrower at a bottom portion adjacent to the base layer.

3. The cooler of claim 1 , wherein the base layer is coupled to a heat source, and wherein the inlet slot is aligned to a predetermined portion of the heat source, wherein an inlet slot region provides enhanced cooling as compared to an outlet slot region of the cooler.

4. The cooler of claim 1 , wherein the manifold layers have a pair of inlet slots disposed at an active area of the cooling layer and a pair of outlet slots disposed away from the active area.

5. The cooler of claim 1 , wherein the cooler has a unitary construction.

6. The cooler of claim 1 , wherein the cooling layer includes a plurality of stacked fin layers, and a width of the fins decreases from a bottom fin layer adjacent to the base to a top fin layer adjacent to the manifold layer where a spacing between fins perpendicular to a flow direction is substantially constant.

7. The cooler of claim 1 , wherein the cooling layer is stacked with at least another cooling layer.