MOS transistors formed on the front and back surface of a semiconductor substrate
View Patent ↗The invention realizes low on-resistance and high current flow in a semiconductor device in which a current flows in a thickness direction of a semiconductor substrate. A first MOS transistor having first gate electrodes and first source layers is formed on a front surface of a semiconductor substrate, and a second MOS transistor having second gate electrodes and second source layers is formed on a back surface thereof. A drain electrode connected to the semiconductor substrate, a first source electrode connected to the first source layers, a second source electrode connected to the second source layers, and a first penetration hole penetrating the semiconductor substrate are further formed. A first wiring connecting the first source electrode and the second source electrode is formed in the first penetration hole. The semiconductor substrate serves as a common drain region of the first and second MOS transistors.
1. A semiconductor device comprising:
a semiconductor substrate;
a first MOS transistor formed on a front surface of the semiconductor substrate and comprising a first source and a first gate;
a second MOS transistor formed on a back surface of the semiconductor substrate and comprising a second source and a second gate;
a drain electrode formed on and electrically connected to the semiconductor substrate;
a first source electrode formed on the front surface and electrically connected to the first source of the first MOS transistor;
a second source electrode formed on the back surface and electrically connected to the second source of the second MOS transistor; and
a first wiring formed in a first penetration hole penetrating the semiconductor substrate and electrically connecting the first source electrode and the second source electrode,
wherein the semiconductor substrate is configured to operate as a common drain of the first and second MOS transistors.
2. The semiconductor device of claim 1 , further comprising a second wiring formed in a second penetration hole penetrating the semiconductor substrate and electrically connected to the drain electrode.
3. The semiconductor device of claim 1 , wherein the first wiring is electrically insulated from the semiconductor substrate.
4. The semiconductor device of claim 2 , wherein the first wiring is electrically insulated from the semiconductor substrate.