Mountable integrated circuit package-in-package system

1. A mountable integrated circuit package-in-package system comprising:

providing an interface integrated circuit package system with a terminal having a plated bump on an encapsulant bump portion of an inner encapsulation;

mounting the interface integrated circuit package system over a package carrier with the terminal facing away from the package carrier;

connecting the package carrier and a pad extension of the terminal; and

forming a package encapsulation over the interface integrated circuit package system with the terminal exposed.

2. The system as claimed in claim 1 further comprising mounting a device over the package carrier and adjacent to the interface integrated circuit package system.

3. The system as claimed in claim 1 further comprising forming a dam ring adjacent the package encapsulation for exposing the terminal.

4. The system as claimed in claim 1 wherein forming the package encapsulation includes forming a ring cover for exposing the terminal.

5. The system as claimed in claim 1 further comprising mounting an external device having an electrical connector connected with the terminal.

6. A mountable integrated circuit package-in-package system comprising:

providing an interface integrated circuit package system with a terminal having a plated bump on an encapsulant bump portion of an inner encapsulation;

mounting the interface integrated circuit package system over a package carrier with the terminal facing away from the package carrier;

connecting an interconnect between the package carrier and a pad extension of the terminal; and

forming a package encapsulation over the interface integrated circuit package system with a portion of the terminal exposed and the pad extension covered.

7. The system as claimed in claim 6 further comprising mounting an integrated circuit over the package carrier and below the interface integrated circuit package system.

8. The system as claimed in claim 6 wherein providing the interface integrated circuit package system includes:

providing an integrated circuit device; and

connecting the integrated circuit device with the terminal and within a cavity of the terminal.

9. The system as claimed in claim 6 wherein providing the interface integrated circuit package system includes:

providing the terminal having a cavity; and

forming the inner encapsulation includes filling the cavity of the terminal.

10. The system as claimed in claim 6 wherein mounting the interface integrated circuit package system includes attaching an adhesive film between the interface integrated circuit package system and the package carrier.

11. A mountable integrated circuit package-in-package system comprising:

a package carrier;

an interface integrated circuit package system, with a terminal having a plated bump on an encapsulant bump portion of an inner encapsulation, over the package carrier with the terminal facing away from the package carrier, and the package carrier connected with a pad extension of the terminal; and

a package encapsulation over the interface integrated circuit package system with the terminal exposed.

12. The system as claimed in claim 11 further comprising a device over the package carrier and adjacent to the interface integrated circuit package system.

13. The system as claimed in claim 11 further comprising a dam ring adjacent the package encapsulation for exposing the terminal.

14. The system as claimed in claim 11 wherein the package encapsulation includes a ring cover for exposing the terminal.

15. The system as claimed in claim 11 further comprising an external device having an electrical connector connected with the terminal.

16. The system as claimed in claim 11 wherein:

the package encapsulation exposes a portion of the terminal and covers the pad extension of the terminal; and

further comprising an interconnect between the package carrier and the pad extension of the terminal.

17. The system as claimed in claim 16 further comprising an integrated circuit over the package carrier and below the interface integrated circuit package system.

18. The system as claimed in claim 16 wherein the interface integrated circuit package system includes an integrated circuit device connected with the terminal and within a cavity of the terminal.

19. The system as claimed in claim 16 wherein the interface integrated circuit package system includes:

the terminal having a cavity; and

an inner encapsulation is in the cavity of the terminal.

20. The system as claimed in claim 16 wherein the interface integrated circuit package system includes an adhesive film between the interface integrated circuit package system and the package carrier.