Integrated circuit package system with conformal shielding and method of manufacture thereof
View Patent ↗An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads, over the integrated circuit; encapsulating the integrated circuit with an encapsulation while leaving the structure partially exposed; and attaching a conformal shielding to the encapsulation and electrically connected to the grounding pads.
1. A method for manufacturing an integrated circuit package system comprising:
providing a substrate with an integrated circuit mounted thereover;
mounting a structure, having grounding pads, over the integrated circuit;
encapsulating the integrated circuit with an encapsulation, having a side exterior surface and a top exterior surface, while leaving the structure partially exposed; and
attaching a conformal shielding to the side exterior surface and to the top exterior surface of the encapsulation and with the conformal shielding on and around the perimeter of a side of the structure opposite the integrated circuit and electrically connected to the grounding pads.
2. The method as claimed in claim 1 wherein:
mounting the structure includes mounting an interposer, or an exposed integrated circuit die.
3. The method as claimed in claim 1 wherein:
attaching the conformal shielding to the encapsulation includes attaching a protective cover above the structure leaving substantial portions of the grounding pads exposed.
4. The method as claimed in claim 1 further comprising:
attaching the conformal shielding to a vertical edge of the substrate, or singulating the substrate having a vertical edge exposed.
5. The method as claimed in claim 1 wherein:
attaching the conformal shielding to the encapsulation and electrically connected to the grounding pads includes connecting the conformal shield to the grounding pads with a conductive stiffener ring.
6. A method for manufacturing an integrated circuit package system comprising:
providing a substrate with grounding pads and with an integrated circuit attached thereto with a die attach adhesive;
mounting a structure, having grounding pads, over the integrated circuit;
connecting the structure and the integrated circuit to the substrate with a bond wire;
encapsulating the integrated circuit with an encapsulation, having a side exterior surface and a top exterior surface, while leaving the structure partially exposed; and
attaching a conformal shielding to the side exterior surface and to the top exterior surface of the encapsulation and with the conformal shielding on and around the perimeter of a side of the structure opposite the integrated circuit and electrically connected to the grounding pads.
7. The method as claimed in claim 6 further comprising:
mounting a shielding cage below the interposer;
connecting the shielding cage to the grounding pads on the interposer; and
wherein:
encapsulating the integrated circuit includes encapsulating the shielding cage.
8. The method as claimed in claim 6 further comprising:
mounting a shielding cage below the interposer;
connecting the shielding cage to the grounding pads on the substrate; and
wherein:
encapsulating the integrated circuit includes encapsulating the shielding cage.
9. The method as claimed in claim 6 further comprising:
mounting a shielding cage above the interposer; and
connecting the shielding cage to the grounding pads on the interposer.
10. The method as claimed in claim 6 further comprising:
mounting a shielding cage below the substrate; and
connecting the shielding cage to the grounding pads on the substrate.
11. An integrated circuit package system comprising:
a substrate with an integrated circuit mounted thereover;
a structure, having grounding pads, mounted over the integrated circuit;
an encapsulation, having a side exterior surface and a top exterior surface, encapsulating the integrated circuit while leaving the structure partially exposed; and
a conformal shielding attached to the side exterior surface and to the top exterior surface of the encapsulation and with the conformal shielding on and around the perimeter of a side of the structure opposite the integrated circuit and electrically connected to the grounding pads.
12. The system as claimed in claim 11 wherein:
the structure is an interposer.
13. The system as claimed in claim 11 wherein:
the structure is an exposed integrated circuit die.
14. The system as claimed in claim 11 further comprising:
a vertical edge of the substrate with the conformal shielding attached thereto, or a vertical edge of the substrate is exposed.
15. The system as claimed in claim 11 wherein:
the conformal shield is connected to the grounding pads with a conductive stiffener ring.
16. The system as claimed in claim 11 further comprising:
grounding pads on the substrate and the integrated circuit attached thereto with a die attach adhesive; and
a bond wire connecting the structure and the integrated circuit to the substrate.
17. The system as claimed in claim 16 further comprising:
a shielding cage below the interposer;
wherein:
the shielding cage is connected to the grounding pads on the interposer; and
the shielding cage is encapsulated with the encapsulation.
18. The system as claimed in claim 16 further comprising:
a shielding cage below the interposer;
wherein:
the shielding cage is connected to the grounding pads on the substrate; and
the shielding cage is encapsulated with the encapsulation.
19. The system as claimed in claim 16 further comprising:
a shielding cage mounted above the interposer; and
wherein:
the shielding cage is connected to the grounding pads on the interposer.
20. The system as claimed in claim 16 further comprising:
a shielding cage mounted below the substrate; and
wherein:
the shielding cage is connected to the grounding pads on the substrate.