Method for fabricating semiconductor device

1. A method for fabricating a semiconductor device, the method comprising:

forming a first mask pattern on an etch target layer;

forming a TEOS film over the etch target layer and the first mask pattern;

forming a hard mask over the TEOS film, the hard mask including a polysilicon;

forming a second Anti-Reflection film over the hard mask;

patterning a second photo-resist film formed on the second Anti-Reflection film;

etching the second Anti-Reflection film, the hard mask, and the TEOS film by using the patterned second photo-resist film as a mask, the etched TEOS film forming a second mask pattern;

forming a first spacer at a sidewall of the first mask pattern and a second spacer at a sidewall of the second mask pattern;

removing the second mask pattern; and

etching the etch target layer by using the first mask pattern, the first spacer, and the second spacer as an etching mask.

2. The method according to claim 1 , wherein the first mask pattern and the first spacer formed at the sidewall of the first mask pattern are used as the etching mask for forming a gate pattern of a switching transistor.

3. The method according to claim 2 , wherein the second spacer formed at the sidewall of the second mask pattern is used as an etching mask for forming a control gate pattern in a cell string connected to the switching transistor.

4. The method according to claim 1 , wherein the first mask pattern includes a polysilicon film, and the second mask pattern includes a TEOS film.

5. The method according to claim 1 , wherein the first spacer and the second spacer include a polysilicon film.

6. The method according to claim 1 , wherein the act of forming a first mask pattern includes:

forming a polysilicon layer over the etch target layer;

forming a first Anti-Reflection film over the polysilicon layer;

patterning a first photo-resist film formed on the first Anti-Reflection film; and

etching the first Anti-Reflection film and the polysilicon layer by using the patterned first photo-resist film as a mask.

7. A method for fabricating a semiconductor device, the method comprising:

forming a coarse mask pattern for forming a gate pattern of a switching transistor;

forming a sacrificial film over the course mask pattern;

forming a hard mask over the sacrificial film, the hard mask including a polysilicon;

forming a second Anti-Reflection film over the hard mask;

patterning a second photo-resist film formed on the second Anti-Reflection film;

etching the second Anti-Reflection film, the hard mask, and the sacrificial film by using the patterned second photo-resist film as a mask, the etched sacrificial film forming a fine mask pattern for forming a control gate pattern in a cell string connected to the switching transistor; and

forming spacers at sidewalls of the coarse mask pattern and the fine mask pattern to perform a spacer patterning technology (SPT) process.

8. The method according to claim 7 , wherein the act of forming a coarse mask pattern includes:

forming a polysilicon layer over an etch target layer;

forming a first Anti-Reflection film over the polysilicon layer; and

patterning the polysilicon layer with a coarse photo-resist pattern formed on the first Anti-Reflection film.

9. The method according to claim 7 , wherein the coarse mask pattern has the same etching selectivity as that of the spacers, and the fine mask pattern has a different etching selectivity as that of the spacers.

10. The method according to claim 7 , wherein the act of performing an SPT process includes:

forming spacers at sidewalls of the coarse mask pattern and the fine mask pattern;

removing the fine mask pattern; and

etching an etch target layer with the spacers and the coarse mask pattern.

11. A method for fabricating a semiconductor device, the method comprising:

forming an etch target layer over a semiconductor substrate;

forming a pad pattern on the etch target layer disposed at the edge of the semiconductor substrate;

forming a planarized sacrificial film over the resulting structure including the pad pattern;

forming a hard mask over the planarized sacrificial film, the hard mask including a polysilicon;

forming a second Anti-Reflection film over the hard mask;

patterning a second photo-resist film formed on the second Anti-Reflection film;

etching the second Anti-Reflection film, the hard mask, and the sacrificial film without patterning the pad pattern by using the patterned second photo-resist film as a mask, the etched sacrificial film forming a sacrificial pattern;

forming a first spacer at a sidewall of the sacrificial pattern and a second spacer at a sidewall of the pad pattern;

removing the sacrificial pattern to remain the first spacer and the second spacer; and

etching the etch target layer by using the first spacer, the second spacer, and the pad pattern as a mask.

12. The method according to claim 11 , wherein the etch target layer has a deposition structure including a polysilicon layer and a nitride film.

13. The method according to claim 12 , wherein the sacrificial pattern is etched by a wet etching process using a HF solution.

14. The method according to claim 12 , wherein the sacrificial pattern is formed to have a line/space type, and the ratio of line:space is 1:3.

15. The method according to claim 11 , wherein the pad pattern defines at least one of a gate for a source selection line (SSL) or a gate for a drain selection line (DSL).

16. The method according to claim 11 , wherein a first Anti-Reflection film is included when a first photo-resist pattern for forming the pad pattern is formed.

17. The method according to claim 11 , wherein a critical dimension (CD) of the pad pattern is formed to be smaller than that of a target pattern formed by using the pad pattern as part of an etch mask.

18. The method according to claim 11 , wherein the sacrificial film includes a TEOS film.