Method for manufacturing capacitor of semiconductor device
View Patent ↗A method for manufacturing a capacitor of a semiconductor device includes: forming an interlayer insulating film including a contact plug over a semiconductor substrate; forming a first stack film including a capacitor oxide film and a nitride film over the interlayer insulating film; etching the first stack film to form a first stack pattern and a contact hole that exposes the contact plug; forming a lower electrode in the contact hole; forming a capping oxide film continuously over the first stack pattern to form a bridge connecting the neighboring first stack patterns; forming an etching barrier film including cavities over the capping oxide film; performing a blanket etching process onto the etching barrier film including cavities until the capacitor oxide film is exposed to form a nitride film pattern; and removing the exposed capacitor oxide film.
1. A method for manufacturing a capacitor of a semiconductor device, comprising:
forming an interlayer insulating film including a contact plug over a semiconductor substrate;
forming a first stack film comprising a capacitor oxide film and a nitride film over the interlayer insulating film;
etching the first stack film to form a first stack pattern and a contact hole that exposes the contact plug;
forming a lower electrode in the contact hole;
forming a capping oxide film on a top portion of a structure including the first stack pattern and the lower electrode;
forming an etching barrier film including cavities over the capping oxide film;
performing a blanket etching process onto the etching barrier film including cavities until the capacitor oxide film is exposed to form a nitride film pattern; and
removing the exposed capacitor oxide film.
2. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , further comprising depositing the hard mask film over the capping oxide film before the etching barrier film including cavities is formed.
3. The method for manufacturing a capacitor of a semiconductor device according to claim 2 , wherein the hard mask film is selected from the group consisting of an amorphous carbon layer, a multi-functional hard mask film, an antireflection film and combinations thereof.
4. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , wherein the etching barrier film including cavities is formed by using an organic single film including cavities, an inorganic single film including cavities or an organic-inorganic composite film including cavities.
5. The method for manufacturing a capacitor of a semiconductor device according to claim 4 , the organic single film including cavities comprises an organic compound selected from the group consisting of a photoresist for i-line, a photoresist for G-line, a chemically amplified photoresist and combinations thereof.
6. The method for manufacturing a capacitor of a semiconductor device according to claim 4 , the inorganic single film including cavities comprises an inorganic compound selected from the group consisting of a silica particle, a silica oxide, a silica oxynitride, a mixture including a titanium nitride and a silica oxynitride, a tungsten oxide, spin on glass (SOG) and combinations thereof.
7. The method for manufacturing a capacitor of a semiconductor device according to claim 4 , wherein the cavities have a diameter ranging from 10 nm to 10,000 nm, and is present in an amount ranging from about 20% to 70%, based on the whole region of the etching barrier film.
8. The method for manufacturing a capacitor of a semiconductor device according to claim 4 , wherein the inorganic film included in the organic-inorganic composite film including cavities is present in an amount ranging from 30% to 70%, based on whole region of the composite film.
9. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , wherein forming an etching barrier film including cavities comprises:
i) implanting bubbles into the etching barrier film while forming the etching barrier film simultaneously; and
ii) baking the etching barrier film including cavities after implanting a bubble.
10. The method for manufacturing a capacitor of a semiconductor device according to claim 9 , wherein the baking process is performed at 90° C. to 300° C.
11. The method for manufacturing a capacitor of a semiconductor device according to claim 9 , wherein the etching barrier film is the organic-inorganic composite film including cavities; and further comprising removing the organic compound in the etching barrier film after baking.
12. The method for manufacturing a capacitor of a semiconductor device according to claim 11 , wherein the removing step is performed by a photolithography process or an O 2 strip process.
13. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , wherein the blanket etching process is performed with an etching gas including trifluoromethane (CHF 3 ), argon (Ar), octafluorocyclobutane (C 4 F 8 ), oxygen (O 2 ) and carbon monoxide (CO).
14. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , wherein the-capacitor-oxide-film-removing-step is performed by a wet dip-out etching process using a buffered oxide etchant (BOE) solution.
15. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , further comprising forming a zirconium-aluminum-zirconium (ZAZ) layer over a lower electrode supported by the nitride film floating pattern after removing the exposed capacitor oxide film.
16. The method for manufacturing a capacitor of a semiconductor device according to claim 1 , comprising blocking the contact hole including the lower electrode with the capping oxide film.