Semiconductor device and method of fabricating semiconductor device
View Patent ↗A semiconductor device includes a gate electrode formed through an insulating film in a groove having a first side surface adjacent to a source region and a base region, and a second conductive type first impurity region formed adjacent to a second side surface of the groove between the groove and a lead-out portion of a drain region existing below the base region so as to extend downward beyond a lower end of the groove.
1. A semiconductor device comprising:
a first conductive type first drain region;
a first conductive type second drain region formed on said first drain region and having an impurity concentration lower than an impurity concentration of said first drain region;
a lead-out portion of said first drain region formed so as to reach said first drain region through said second drain region;
a second conductive type base region formed on said second drain region;
a first conductive type source region formed on said base region;
a gate electrode formed through an insulating film in a groove having a first side surface adjacent to said source region and said base region; and
a second conductive type first impurity region formed adjacent to a second side surface of said groove between said groove and said lead-out portion so as to extend downward beyond a lower end of said groove, wherein
said first impurity region has an impurity concentration lower than an impurity concentration of said base region.
2. The semiconductor device according to claim 1 , wherein
said first impurity region is formed in an annular shape so as to surround said gate electrode, said base region and said source region in plan view, and
said lead-out portion is provided outside said annular first impurity region in plan view.
3. The semiconductor device according to claim 1 , wherein
said first impurity region is formed so as to project toward said groove below said groove.
4. The semiconductor device according to claim 1 , wherein
said first impurity region and said lead-out portion are arranged at a prescribed interval.
5. The semiconductor device according to claim 1 , wherein
a prescribed voltage is applied to said first impurity region.
6. The semiconductor device according to claim 5 , further comprising:
a plug for applying said prescribed voltage to said first impurity region; and
a second conductive type second impurity region provided for connecting said first impurity region and said plug, having an impurity concentration higher than an impurity concentration of said first impurity region.
7. The semiconductor device according to claim 5 , wherein
the same voltage as said prescribed voltage applied to said first impurity region is applied to said source region.
8. The semiconductor device according to claim 1 , wherein
said first impurity region is formed so as to extend downward beyond a lower end of said base region formed between said grooves.
9. A semiconductor device comprising:
a first conductive type first drain region;
a first conductive type second drain region formed on said first drain region and having an impurity concentration lower than an impurity concentration of said first drain region;
a lead-out portion of said first drain region formed so as to reach said first drain region through said second drain region;
a gate electrode formed in a groove formed on said second drain region;
a second conductive type impurity region for current path control formed adjacent to said lead-out portion downward beyond at least a lower end of said groove; and
a second conductive type first impurity region formed between said groove and said impurity region for current path control and formed separately from said impurity region for current path control, so as to extend downward beyond said lower end of said groove.
10. The semiconductor device according to claim 9 , wherein
said impurity region for current path control is formed so as to reach said first drain region.
11. The semiconductor device according to claim 9 , wherein
said impurity region for current path control is formed so as to reach a surface of said second drain region.
12. The semiconductor device according to claim 9 , wherein said first impurity region is formed so as to project toward said groove below said groove.
13. A method of fabricating a semiconductor device, comprising steps of:
forming a first conductive type first drain region;
forming a first conductive type second drain region having an impurity concentration lower than an impurity concentration of said first drain region on said first drain region;
forming a lead-out portion of said first drain region so as to reach said first drain region through said second drain region;
forming a groove on said second drain region;
forming a gate electrode in said groove;
forming a second conductive type impurity region for current path control adjacent to said lead-out portion downward beyond at least a lower end of said groove by ion-implanting an impurity; and
forming a second conductive type first impurity region between said groove and said impurity region for current path control, separately from said impurity region for current path control, so as to extend downward beyond said lower end of said groove by ion-implanting an impurity.
14. The method of fabricating a semiconductor device according to claim 13 , wherein
said step of forming said impurity region for current path control includes a step of forming said impurity region for current path control so as to reach said first drain region.