Integrated circuit, memory module, and method of manufacturing an integrated circuit

1. An integrated circuit, comprimising a plurity of magnetic tunneling junction stacks, each magnetic tunneling junction stack comprising a reference layer, a barrier layer and a free layer, wherein the plurality of magnetic tunneling junction stacks share a continuous common reference layer, wherein the free layers are laterally separated from each other, wherein a lateral electrical resistance of the continuous common reference layer between two neighboring magnetic tunneling junction stacks is higher than a vertical electrical resistance between a top surface of the continuous common reference layer and a bottom surface of the continuous common reference layer.

2. The integrated circuit according to claim 1 , wherein the continuous common reference layer has a reduced thickness between the magnetic tunneling junction stacks.

3. The integrated circuit according to claim 1 , wherein the barrier layers together form a continuous common barrier layer shared by all magnetic tunneling junction stacks.

4. The integrated circuit according to claim 3 , wherein a lateral electrical resistance of the continuous common barrier layer between two neighboring magnetic tunneling junction stacks is lower than a vertical electrical resistance between a top surface of the continuous common barrier layer and a bottom surface of the continuous common barrier layer.

5. The integrated circuit according to claim 1 , wherein the free layers are laterally separated from each other by a material that is magnetically inactive or only weakly active.

6. The integrated circuit according to claim 5 , wherein the free layers are laterally separated from each other by a material having a higher electrical resistance than the free layers.

7. The integrated circuit according to claim 1 , wherein each memory cell comprises a select device.

8. The integrated circuit according to claim 1 , wherein the free layers are electrically connected to a common conductive plate arranged above the magnetic tunneling junction stacks.

9. The integrated circuit according to claim 1 , wherein a plurality of free layers is electrically connected to a common conductive line arranged above the magnetic tunneling junction stacks.

10. The integrated circuit according to claim 1 , wherein the magnetic tunneling junction stacks serve as sensors.

11. The integrated circuit according to claim 1 , wherein the magnetic tunneling junction stacks serve as memory elements.

12. A memory module comprising at least one integrated circuit comprising a plurality of magneto-resistive memory cells, each memory cell comprising a reference layer, a barrier layer and a free layer that are stacked above each other in this order, wherein the free layers are laterally separated from each other, wherein the reference layers together form a continuous common reference layer shared by all memory cells, and wherein a lateral electrical resistance of the continuous common reference layer between two neighboring magneto-resistive memory cells is higher than a vertical electrical resistance between a top surface of the continuous common reference layer and a bottom surface of the continuous common reference layer.

13. The memory module according to claim 12 , wherein the memory module is stackable.