Circuit module and electrical component
View Patent ↗In an electrical component including a solid-state circuit portion and a substrate connecting portion, the solid-state circuit portion includes: a supporting surface faced to and supported by the substrate connecting portion; and an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion. This structure makes it possible to arrange, on a circuit board, a plurality of the electrical components in a staggered manner in a height direction.
1. An electrical component, comprising:
a solid-state circuit portion having a semiconductor as a base substance; and
a substrate connecting portion for electrically mounting the solid-state circuit portion on an external substrate, wherein the solid-state circuit portion comprises:
a supporting surface opposed to a mounting surface of the substrate connecting portion and supported by the substrate connection portion; and
an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion, and
wherein the substrate connecting portion comprises:
the mounting surface which is mounted to the external substrate and which has the same size as the supporting surface; and
a connecting surface which is connected to the solid-state circuit portion and which has an area equal to or larger than a sum of the supporting surface and the opposing surface of the solid-state circuit portion.
2. An electrical component according to claim 1 , wherein the substrate connecting portion comprises a first connecting portion connected to the supporting surface of the solid-state circuit portion and a second connecting portion which is mounted to the external substrate to define the mounting surface equal to a size of the supporting surface of the solid-state circuit portion.
3. An electrical component, comprising:
a solid-state circuit portion having a semiconductor as a base substance; and
a substrate connecting portion for electrically mounting the solid-state circuit portion on an external substrate,
wherein the solid-state circuit portion comprises:
a supporting surface opposed to a mounting surface of the substrate connecting portion and supported by the substrate connection portion; and
an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion, and
wherein the substrate connecting portion comprises:
a first connecting portion which defines the mounting surface of the substrate connecting portion and which has an area equal to or larger than a sum of the supporting surface and the opposing surface of the solid-state circuit portion; and
a second connecting portion which is mounted to the external substrate and which has the same area as the supporting surface of the solid-state circuit portion.
4. An electrical component according to claim 1 , wherein at least a portion of the solid-state circuit portion is resin-molded.
5. An electrical component according to claim 1 , wherein the solid-state circuit portion has a structure in which a plurality of solid-state circuit components are stacked on each other.
6. An electrical component according to claim 1 , wherein the substrate connecting portion is connected to a center portion of the solid-state circuit portion.
7. An electrical component according to claim 1 , wherein the substrate connecting portion is connected to a location different from a center portion of the solid-state circuit portion.
8. A circuit module, comprising:
a circuit board; and
a plurality of electrical components mounted on the circuit board,
wherein the plurality of electrical components are arranged in a staggered manner so that adjacent electrical components of the plurality of electrical components partially overlap in a height direction,
wherein each of the plurality of electrical components comprises:
a solid-state circuit portion having a semiconductor as a base substance; and
a substrate connecting portion for electrically mounting the solid-state circuit portion on the circuit board,
wherein the solid-state circuit portion comprises:
a supporting surface which is faced to a mounting surface of the substrate connecting portion and which is supported by the substrate connecting portion; and
an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion.
9. A circuit module according to claim 8 , wherein the solid-state circuit portion comprises a dynamic random access memory.
10. An electrical component according to claim 3 , wherein at least a portion of the solid-state circuit portion is resin-molded.
11. An electrical component according to claim 3 , wherein the solid-state circuit portion has a structure in which a plurality of solid-state circuit components are stacked on each other.
12. An electrical component according to claim 3 , wherein the substrate connecting portion is connected to a center portion of the solid-state circuit portion.
13. An electrical component according to claim 3 , wherein the substrate connecting portion is connected to a location different from a center portion of the solid-state circuit portion.