Power electronics devices with integrated gate drive circuitry
View Patent ↗A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; and gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die.
1. A power switch apparatus, comprising:
a printed circuit board (PCB) substrate;
a semiconductor die mounted on the PCB substrate and comprising power electronics circuitry for a high power, alternating current motor application, the semiconductor die being configured to generate a heat flux density of at least 10 W/cm 2 ; and
gate drive circuitry mounted on the PCB substrate and electrically coupled to the power electronics circuitry on the semiconductor die,
wherein the semiconductor die includes a first side mounted to the PCB substrate and a second side opposite the first side, the power switch apparatus further comprising a cooling system for directing a cooling liquid directly onto the second side of the semiconductor die.
2. The power switch apparatus of claim 1 , wherein the power electronics circuitry includes insulated gate bipolar transistors (IGBTs).
3. The power switch apparatus of claim 1 , wherein the semiconductor die is mounted on the PCB substrate with solder.
4. The power switch apparatus of claim 1 , wherein the gate drive circuitry is configured to receive logic level control signals and to convert the control signals into appropriate voltage and current for controlling switching of the power electronics circuitry.
5. The power switch apparatus of claim 1 , further comprising wire bonds for electrically coupling the gate drive circuitry to the power electronics circuitry on the semiconductor die.
6. The power switch apparatus of claim 1 , wherein the semiconductor die is a first semiconductor die and the power switch apparatus further comprises a second semiconductor die mounted on the PCB substrate.
7. The power switch apparatus of claim 1 , further comprising a housing for enclosing the PCB substrate and the semiconductor die.
8. The power switch apparatus of claim 7 , further comprising nozzles coupled to the housing for delivering a cooling fluid to the semiconductor die.
9. An automotive drive system comprising:
an electric motor;
a direct current (DC) power supply coupled to the electric motor;
a power switch apparatus coupled to the electric motor and the DC power supply to receive DC power from the DC power supply and provide alternating current (AC) power to the electric motor, the power switch apparatus comprising:
a printed circuit board (PCB) substrate;
a semiconductor die mounted on the PCB substrate and comprising power electronics circuitry for converting the DC power into AC power, the semiconductor die being configured to generate a heat flux density of at least 10 W/cm 2 ; and
gate drive circuitry mounted on the PCB substrate and electrically coupled to the power electronics circuitry on the semiconductor die,
wherein the semiconductor die includes a first side mounted to the PCB substrate and a second side opposite the first side, the power switch apparatus further comprising a cooling system for directing a cooling liquid directly onto the second side of the semiconductor die.
10. The automotive drive system of claim 9 , wherein the power electronics circuitry includes insulated gate bipolar transistors (IGBTs).
11. The automotive drive system of claim 9 , wherein the semiconductor die is mounted on the PCB substrate with solder.
12. The automotive drive system of claim 9 , further comprising wire bonds for electrically coupling the gate drive circuitry to the power electronics circuitry on the semiconductor die.
13. The automotive drive system of claim 9 , wherein the semiconductor die is a first semiconductor die and the automotive drive system further comprises a second semiconductor die mounted on the PCB substrate.
14. The automotive drive system of claim 9 , further comprising a housing for enclosing the PCB substrate and the semiconductor die.
15. The automotive drive system of claim 14 , further comprising nozzles coupled to the housing for delivering a cooling fluid to the semiconductor die.
16. The power switch apparatus of claim 1 , wherein the gate drive circuitry is integrated directly into the PCB substrate.
17. A power switch apparatus, comprising:
a printed circuit board (PCB) substrate;
a plurality of semiconductor die mounted on the substrate, the semiconductor die comprising insulated gate bipolar transistors (IGBTs) for a high power, alternating current motor application, the semiconductor die being configured to generate a heat flux density of at least 10 W/cm 2 ; and
gate drive circuitry mounted on the substrate and electrically coupled to the IGBTs of the semiconductor die,
wherein the semiconductor die each include a first side mounted to the PCB substrate and a second side opposite the first side, the power switch apparatus further comprising a cooling system for directing a cooling liquid directly onto the second side of the semiconductor die.
18. The power switch apparatus of claim 1 , wherein the PCB substrate includes a fiberglass material.