IP Library Granted Patent US 7,839,207
Granted Patent B2
US 7,839,207 · App. 12/179,828 · Granted Nov 23, 2010

Integrated circuit and a method for recovering from a low-power period

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Quick Facts
Patent No.
US 7,839,207
App. No.
12/179,828
Granted
Nov 23, 2010
Kind
B2
Abstract

An integrated circuit, including: (i) a power gated circuit which power supply is shut down during a low-power period; (ii) a retention circuit, coupled to the power gated circuit during at least a portion of a non-low-power period, the retention circuit is adapted to store, during the low-power period, state information reflecting a state of the power gated circuit before the low-power period started; (iii) a first portion of the power grid, coupled to the retention circuit and to a first end of a power supply switch, adapted to provide to the retention circuit a supply voltage during the low-power period and during a non-low-power period; wherein the power supply switch is open during the low-power period and is closed during the non-low-power period; and (iv) a second portion of the power grid, coupled to a second end of the power supply switch and to the power gated circuit; adapted to supply a gated supply voltage to the power gated circuit during the non-low-power period. The first portion of the power grid is characterized by intrinsic capacitance that is larger that the intrinsic capacitance of the second portion of the power grid.

Claims (33)

1. An integrated circuit, comprising:

a power gated circuit that is shut down during a low-power period;

a retention circuit, coupled to the power gated circuit during at least a portion of a non- low-power period, the retention circuit is adapted to store, during the low-power period, state information reflecting a state of the power gated circuit before the low-power period started;

a first portion of a power grid, coupled to the retention circuit and to a first end of a power supply switch, adapted to provide to the retention circuit a supply voltage during the low-power period and during a non-low-power period; wherein the power supply switch is open during the low-power period and is closed during the non-low-power period; and

a second portion of the power grid, coupled to a second end of the power supply switch and to the power gated circuit; adapted to supply a gated supply voltage to the power gated circuit during the non-low-power period;

wherein the first portion of the power grid is characterized by intrinsic capacitance that is larger than an intrinsic capacitance of the second portion of the power grid; and

wherein the integrated circuit comprises multiple metal layers; wherein a topmost metal layer of the integrated circuit comprises only conductors of the first portion of the power grid.

2. The integrated circuit according to claim 1 wherein the topmost metal layer comprises conductors that are connectable by external connectors located substantially near a center of the integrated circuit and are connectible by other external connectors located substantially at an edge of the integrated circuit.

3. The integrated circuit according to claim 1 wherein a majority of the multiple metal layers comprise only conductors of the first portion of the power grid.

4. The integrated circuit according to claim 1 wherein conductors of the second portion of the power grid are included in one or more down most metal layers of the multiple metal layers.

5. The integrated circuit according to claim 1 wherein a majority of the multiple metal layers comprise only conductors of the first portion of the power grid and wherein a minority of the multiple metal layers comprise conductors of the first and second portions of the power grid.

6. The integrated circuit according to claim 1 wherein each metal layer comprises conductors of only a single portion of the power grid.

7. The integrated circuit according to claim 1 wherein the retention circuit comprises PMOS transistors and wherein the integrated circuit comprises multiple conductors that are coupled to a supply source to provide to bulks of the P-MOSFET transistors an N-well supply voltage during the low-power period and during the non-low-power period.

8. The integrated circuit according to claim 1 wherein the retention circuit comprises NMOS transistors and wherein the integrated circuit comprises multiple conductors that are coupled to a supply source to provide to bulks of the N-MOSFET transistors a P-well supply voltage during the low-power period and during the non-low-power period.

9. The integrated circuit according to claim 1 wherein the first portion of the power grid reduces retention circuit noises resulting from instantaneous current, characteristic of the process of powering up the power gated circuit.

10. The integrated circuit according to claim 1 wherein the characteristics of the first portion of the power grid prevents state information errors resulting from a rapid power up process.

11. A method for recovering from a low-power period, the method comprises:

supplying a supply voltage, by a first portion of a power grid that is coupled to a retention circuit and to a first end of a power supply switch, during a non-low-power period;

wherein the power supply switch is open during a low-power period and is closed during the non-low-power period;

supplying a gated supply voltage, by a second portion of the power grid that is coupled to a second end of the power supply switch and to a power gated circuit, a gated supply voltage before the low-power period; wherein the first portion of the power grid is characterized by intrinsic capacitance that is larger than the intrinsic capacitance of the second portion of the power grid;

saving, at the retention circuit that is coupled to the power gated circuit, during the low- power period, state information reflecting a state of the power gated circuit before the low-power period started;

recovering from the low-power period by closing the power supply switch and providing the gated supply voltage to the power gated circuit; and

supplying the supply voltage to an integrated circuit that comprises multiple metal layers;

wherein a topmost metal layer of the integrated circuit comprises only conductors of the first portion of the power grid.

12. The method according to claim 11 wherein the topmost metal layer comprises conductors that are connectable by external connectors located substantially near a center of the integrated circuit and are connectible by other external connectors located substantially at an edge of the integrated circuit.

13. The method according to claim 11 wherein a majority of the multiple metal layers comprise only conductors of the first portion of the power grid.

14. The method according to claim 11 wherein each metal layer comprises conductors of a single part of the power grid only.

15. The method according to claim 11 comprising providing a substrate voltage supply to bulks of P-MOSFET transistors of the power gated circuit during the low-power period and during the non-low-power period.

16. The method according to claim 11 comprising:

providing a P-well voltage supply to bulks of N-MOSFET transistors of the power gated circuit during the low-power period and during the non-low-power period; and

providing an N-well voltage supply to bulks of P-MOSFET transistors of the power gated circuit during the low-power period and during the non-lowpower period.

17. The method according to claim 11 comprising reducing, by the characteristics of the first portion of the power grid, retention circuit noises resulting from instantaneous current, characteristic of the process of powering up the power gated circuit.

18. The method according to claim 11 comprising preventing, by the characteristics of the first portion of the power grid the state information errors resulting from a rapid power up process.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0757 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2010
From: SOFER, SERGEY; ELAZARY, AVI; LAVI, MOSHE
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 024012/0585 →
SECURITY AGREEMENT Recorded Dec 9, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021936/0772 →