STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME
A stacked die package is disclosed. The stacked die package includes a wire-bond die that is electrically coupled to other components via one or more wire bonds and a flip-chip die that is coupled to the top surface of the wire-bond die via one or more solder joints. The wire-bond die is formed underneath the flip-chip die. A space defined by the height of the loops of the one or more wire-bonds overlap a space defined by the thickness of one or more solder joints.
1 . A stacked die package, comprising:
a wire-bond die, wherein said wire-bond die is coupled to one or more wire bonds; and
a flip-chip die coupled to the top surface of said wire-bond die via one or more solder joints, wherein said wire-bond die is formed underneath said flip-chip die and wherein a space defined by the height of loops of said one or more wire-bonds, overlaps a space defined by the thickness of said one or more solder joints.
2 . The stacked die package of claim 1 further comprising a molding that encapsulates said wire-bond die and said flip-chip die.
3 . The stacked die package of claim 2 wherein said flip-chip die is thinned by polishing said molding that encapsulates said flip-chip die.
4 . The stacked die package of claim 3 wherein said back surface of said flip-chip die is exposed and is coincident with the top surface of said stacked die package.
5 . The stacked die package of claim 3 further comprising an external heat dissipating element that is attached to said back surface of said flip-chip die.
6 . The stacked die package of claim 1 wherein said wire-bond die comprises a redistribution layer on its top surface.
7 . The stacked die package of claim 1 further comprising staggered wire-bond pads on said wire bond die for connecting a flip chip bond to a substrate through a wire bond.
8 . A stacked die package, comprising:
a plurality of wire-bond dies coupled to one or more wire bonds; and
a flip-chip die coupled to the top surface of one of said plurality of wire-bond dies by one or more solder joints, wherein said plurality of wire-bond dies are formed underneath said flip-chip die and wherein a space defined by a vertical dimension of a wire-bond loop and a space defined by a vertical dimension of said solder joints overlap.
9 . The stacked die package of claim 8 further comprising a molding that encapsulates said wire-bond die and said flip-chip die.
10 . The stacked die package of claim 9 wherein said flip-chip die is thinned by polishing said molding that encapsulates said flip-chip die.
11 . The stacked die package of claim 10 wherein said back surface of said flip-chip die is exposed and is coincident with the top surface of said stacked die package.
12 . The stacked die package of claim 10 further comprising an external heat dissipating element that is attached to said back surface of said flip-chip die.
13 . The stacked die package of claim 8 wherein said one of said wire bond dies comprises a redistribution layer (RDL).
14 . The stacked die package of claim 8 further comprising staggered wire-bond pads on said one of said wire bond dies for connecting a flip chip bond to a substrate through a wire bond.
15 . A method for fabricating a stacked die package, comprising:
forming a substrate;
forming a wire-bond bottom die on said substrate;
forming a redistribution layer (RDL) on said wire-bond bottom die;
forming a re-layout to connect a flip-chip bond to said substrate through a wire-bond; and
forming a flip-chip die on said wire-bond bottom die, wherein said wire-bond bottom die is formed underneath said flip-chip die and wherein spaces defined by a wire-bond loop height of a wire bond associated with said wire-bond bottom die and a thickness of a solder joint associated with said flip-chip overlap.
16 . The method of claim 15 further comprising forming a molding that encapsulates said wire-bond bottom die and said flip-chip die.
17 . The method of claim 16 wherein said flip-chip die is thinned by polishing said molding that encapsulates said flip-chip die.
18 . The method of claim 17 wherein said back surface of said flip-chip die is exposed and is coincident with the top surface of said stacked die package.
19 . The method of claim 17 further comprising:
attaching an external heat dissipating element to said back surface of said flip-chip die.
20 . The method of claim 15 wherein said forming a redistribution layer further comprises forming bump-pads on said wire-bond die.