Patent Assignment
Reel/Frame 035856/0527
Assignment of Assignor's Interest
Recorded: 2015-06-08
Pages: 152
Assignor
SPANSION LLC
Executed: 2015-06-01
Assignee
CYPRESS SEMICONDUCTOR CORPORATION
198 CHAMPION COURT, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(20)
Stacked Die Package Having Reduced Height and Method of Making Same
Application:
12/180,185 →
Publication:
US 2010/0019392
Lateral Charge Storage Region Formation for Semiconductor Wordline
Process of Fabricating a Workpiece Using a Test Mask
Application:
12/206,310 →
Publication:
US 2010/0055809
Simulation of program execution to detect problem such as deadlock
Application:
12/213,871 →
Publication:
US 2009/0037888
Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching
Method for Using Porous Low Dielectric Films in Semiconductor Manufacturing
Application:
12/240,627 →
Publication:
US 2010/0078814
System and Method for Multi-Layer Global Bitlines
Systems and Methods for Downloading Code and Data into a Secure Non-Volatile Memory
Electroplating Apparatus and Method with Uniformity Improvement
Ruthenium interconnect with high aspect ratio and method of fabrication thereof
Radiation-Detecting Structures
Application:
12/340,295 →
Publication:
US 2010/0155611
Fractured Erase System and Method
Adjacent Wordline Disturb Reduction Using Boron/Indium Implant
Line Plotting Method
Direct Pointer Access and Xip Redirector for Emulation of Memory-Mapped Devices
Application:
12/433,159 →
Publication:
US 2010/0280817
A Nand Flash Memory Device
Application:
12/489,226 →
Publication:
US 2010/0322006
Varied Silicon Richness Silicon Nitride Formation
Display Control Device to Display Image Data
Communication Apparatus, Data Communication Method, and Network System
Interface Apparatus and Resynchronization Method
Application:
12/625,041 →
Publication:
US 2010/0142562
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2008
From: TATSUOKA, MASATO; IKE, ATSUSHI
To: FUJITSU LIMITED
Reel/Frame 021198/0889 →
Assignment of Assignor's Interest
Jul 25, 2008
From: GHEE, TAN GIN; KEAT, LEOW HONG
To: SPANSION LLC
Reel/Frame 021295/0501 →
Assignment of Assignor's Interest
Sep 2, 2008
From: KIM, EUNHA; NGO, MINH-VAN
To: SPANSION LLC
Reel/Frame 021522/0205 →
Assignment of Assignor's Interest
Sep 11, 2008
From: PAK, JAMES M.; LI, MIEN; NAGATANI, GO; MATSUSHITA, YANA
To: SPANSION LLC
Reel/Frame 021512/0876 →
Assignment of Assignor's Interest
Sep 25, 2008
From: IWASE, SHIN
To: SPANSION LLC
Reel/Frame 021585/0834 →
Assignment of Assignor's Interest
Sep 29, 2008
From: ROY, ALOK NANDINI; PATEL, ZUBIN P.; FANG, SHENQING
To: SPANSION LLC
Reel/Frame 021601/0866 →
Assignment of Assignor's Interest
Sep 29, 2008
From: WANG, ZHENG; WANG, CONNIE; WILSON, ERIK; YU, WEN
To: SPANSION LLC
Reel/Frame 021681/0385 →
Assignment of Assignor's Interest
Oct 10, 2008
From: PATEL, ZUBIN; YANG, NIAN; LAI, FAN WAN; ROY, ALOK NANDINI
To: SPANSION LLC
Reel/Frame 021666/0963 →
Assignment of Assignor's Interest
Oct 16, 2008
From: BOSCHER, ARNAUD; PRAWITZ, NICOLAS
To: SPANSION LLC
Reel/Frame 021694/0862 →
Assignment of Assignor's Interest
Nov 21, 2008
From: TAKEGUCHI, NAOKI
To: SPANSION LLC
Reel/Frame 021873/0026 →
Assignment of Assignor's Interest
Dec 10, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021985/0715 →
Assignment of Assignor's Interest
Jan 6, 2009
From: FULLWOOD, CLAYTON; HOSSAIN, TIMOTHY Z.; CLOPTON, PATRICK MARK; COLECCHIA, ROBERTO
To: SPANSION LLC
Reel/Frame 022066/0178 →
Assignment of Assignor's Interest
Feb 5, 2009
From: ZITLAW, CLIFFORD A.; NAZARIAN, HAGOP ARTIN
To: SPANSION LLC
Reel/Frame 022215/0166 →
Assignment of Assignor's Interest
Feb 23, 2009
From: KATHAWALA, GULZAR A.; LIU, ZHIZHENG; CHANG, KUO TUNG; XUE, LEI
To: SPANSION LLC
Reel/Frame 022294/0139 →
Assignment of Assignor's Interest
Apr 23, 2009
From: NISHIKAWA, KOUJI; ADACHI, MAKOTO; NAKAMURA, MASAYUKI; MAMIYA, MOTONOBU
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022588/0566 →
Assignment of Assignor's Interest
Jun 22, 2009
From: KWAN, MING SANG; FANG, SHENQING; SUH, YOUSEOK; VAN BUSKIRK, MICHAEL
To: SPANSION LLC
Reel/Frame 022859/0447 →
Assignment of Assignor's Interest
Jul 2, 2009
From: UNSELD, MARKUS
To: SPANSION LLC
Reel/Frame 022906/0601 →
Assignment of Assignor's Interest
Sep 9, 2009
From: MA, YI; FANG, SHENQING; OGLE, ROBERT
To: SPANSION LLC
Reel/Frame 023206/0989 →
Assignment of Assignor's Interest
Oct 30, 2009
From: KOSAKI, MAKOTO
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 023448/0259 →
Assignment of Assignor's Interest
Dec 18, 2009
From: USUI, MINORU
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 023673/0527 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Change of Name
Jul 22, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024748/0328 →
Change of Name
Jul 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024794/0500 →
Security Agreement
Aug 23, 2012
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 028837/0076 →
Assignment of Assignor's Interest
Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →