Electroplating apparatus and method with uniformity improvement
View Patent ↗An electroplating system is provided. The electroplating system includes a divided electrode that is arranged to simultaneously provide a plurality of line currents for an electroplating process. The system includes a current control component that is coupled to the divided electrode. The current control component is configured to determine the magnitude of each of the line currents. The current control component is also configured to regulate individual line currents based, at least in part, on the determined magnitude of each of the line currents.
1. An electroplating system, comprising:
a divided electrode that includes a conductive disc that is divided into a plurality of separate electrode elements, each electrode element having a plurality of electrode fingers, wherein the divided electrode is arranged to substantially simultaneously provide a plurality of line currents for an electroplating process via the plurality of separate electrode elements;
a power supply; and
a current control component arranged between the divided electrode and the power supply, wherein the current control component comprises:
a plurality of current control elements coupled to the divided electrode, wherein each of the plurality of current control elements is configured to sense a magnitude of a corresponding one of the plurality of line currents and generate a corresponding sensing signal, and
a controller circuit coupled to the plurality of current control elements, the controller circuit includes a processor that is configured to receive the corresponding sensing signal and generate a corresponding feedback signal to each of the plurality of current control elements.
2. The electroplating system of claim 1 , wherein the current control component is configured to independently increase or decrease at least one of the line currents of the plurality of line currents relative to another one of the line currents of the plurality of line currents.
3. The electroplating system of claim 1 , wherein the current control component is configured to identify one of the line currents of the plurality of line currents and to set each line current of the portion of the plurality of line currents to the current value associated with the identified line current.
4. The electroplating system of claim 1 , wherein each of the plurality of current control elements includes an ammeter and a variable resistor.
5. The electroplating system of claim 4 , wherein
the ammeter is configured to sense the magnitude of the corresponding one of the plurality of line currents and generate the corresponding sensing signal, and
the variable resistor is configured to receive the corresponding feedback signal and regulate the corresponding one of the plurality of line currents.
6. The electroplating system of claim 4 , wherein the ammeter and the variable resistor of the each of the plurality of current control elements are located outside of a processing chamber of the electroplating system.
7. The electroplating system of claim 1 , further comprising a processing chamber that is configured to contain an electroplating solution such that the current control component is electrically coupled to the electroplating solution via the divided electrode.
8. The electroplating system of claim 1 , wherein the divided electrode includes a cathode, and wherein the electroplating system further comprises:
a processing chamber; and
an anode arranged within the chamber to receive an electroplating current that is based, at least in part, on the plurality of line currents.
9. The electroplating system of claim 1 , wherein the controller circuit is configured to operate over a computer network.
10. The electroplating system of claim 1 , wherein the processor is further configured to generate a control signal to the power supply for controlling a voltage of the power supply between the current control component and the power supply.
11. An electroplating apparatus, comprising:
a processing chamber;
an electrode arranged within the processing chamber, wherein the electrode includes a plurality of electrode elements, each electrode element having a plurality of electrode fingers, that is configured to substantially simultaneously provide a plurality of line currents for an electroplating process;
a power supply;
a plurality of ammeters coupled to the plurality of electrode elements wherein each of the plurality of ammeters is configured to sense a magnitude of a corresponding one of the plurality of line currents and generate a corresponding sensing signal;
a plurality of variable resistors coupled between the plurality of ammeters and power supply; and
a controller circuit coupled to the plurality of ammeters and the plurality of variable resistors, the controller circuit includes a processor configured to receive the corresponding sensing signal and generate a corresponding feedback signal to each of the plurality of variable resistors.
12. The electroplating apparatus of claim 11 , wherein the plurality of ammeters and the plurality of variable resistors are located outside of the processing chamber.
13. The electroplating apparatus of claim 11 , wherein the processor is further configured to generate a control signal to the power supply for controlling a voltage of the power supply between the plurality of variable resistors and the power supply.