IP Library Granted Patent US 7,714,318
Granted Patent B2
US 7,714,318 · App. 12/180,818 · Granted May 11, 2010

Electronic device including a transistor structure having an active region adjacent to a stressor layer

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Quick Facts
Patent No.
US 7,714,318
App. No.
12/180,818
Granted
May 11, 2010
Kind
B2
Abstract

An electronic device can include a transistor structure of a first conductivity type, a field isolation region, and a layer of a first stress type overlying the field isolation region. For example, the transistor structure may be a p-channel transistor structure and the first stress type may be tensile, or the transistor structure may be an n-channel transistor structure and the first stress type may be compressive. The transistor structure can include a channel region that lies within an active region. An edge of the active region includes the interface between the channel region and the field isolation region. From a top view, the layer can include an edge the lies near the edge of the active region. The positional relationship between the edges can affect carrier mobility within the channel region of the transistor structure.

Claims (77)

1. An electronic device comprising:

a first transistor structure of a first conductivity type including a first active region having a first edge that extends substantially along a first channel length direction;

a second transistor structure of the first conductive type including a second active region having a first edge that extends substantially along a second channel length direction;

a portion of a field isolation region lying between the first and second active regions; and

a first portion of a first layer of a first stress type overlying the portion of the field isolation region, wherein:

the first portion of the first layer is not a sidewall spacer;

the first portion of the first layer has a first edge and a second edge opposite the first edge;

the first edge of the first portion of the first layer lies closer to the first edge of the first active region as compared to the first edge of the second active region; and

the second edge of the first portion of the first layer lies closer to the first edge of the second active region as compared to the first edge of the first active region.

2. The electronic device of claim 1 , wherein the first transistor structure comprises a p-channel transistor structure, and the first stress type is compressive.

3. The electronic device of claim 2 , wherein each of the first and second active regions comprises a primary surface lying on a (100) or (110) crystal plane and oriented substantially in a direction of form <110>.

4. The electronic device of claim 1 , wherein:

the first active region comprises a channel width;

the first active region underlies the first portion of the first layer, wherein from a top view, the first portion of the first layer has a dimension that is measured in a direction substantially parallel to the channel width; and

the dimension is no greater than approximately a sum of the channel width and one unit of misalignment tolerance for a mask used to define the opening within the first layer.

5. The electronic device of claim 1 , wherein the first transistor structure comprises an n-channel transistor structure, and the first stress type is tensile.

6. The electronic device of claim 5 , wherein each of the first and second active regions comprises a primary surface lying on a (100) or (110) crystal plane and oriented substantially in a direction of form <100> or <110>.

7. The electronic device of claim 1 , wherein:

the first active region further comprises a second edge, a third edge, and a fourth edge, wherein from a top view, the first and second edges of the first active region lie along a first pair of opposite edges of the first active region, and the third and fourth edges of the first active region lie along a second pair of opposite edges of the first active region; and

the first portion of the first layer further comprises a third edge, and a fourth edge, wherein from the top view:

the second edge of the first portion of the first layer lies adjacent to the second edge of the first active region;

the third edge of the first portion of the first layer lies adjacent to the third edge of the first active region;

the fourth edge of the first portion of the first layer lies adjacent to the fourth edge of the first active region;

a first distance is a distance between the first edge of the first active region and the first edge of the first portion of the first layer;

a second distance is a distance between the second edge of the first active region and the second edge of the first portion of the first layer;

a third distance is a distance between the third edge of the first active region and the third edge of the first portion of the first layer;

a fourth distance is a distance between the fourth edge of the fourth active region and the fourth edge of the first portion of the first layer;

a first sum is a sum of the first and second distances, and a second sum is a sum of the third and fourth distances; and

the first sum is less than the second sum.

8. The electronic device of claim 1 , further comprising a second portion of the first layer overlying the portion of the field isolation region and the second active region, wherein the first and second portions of the first layer are separate and spaced apart from one another.

9. The electronic device of claim 8 , wherein from a top view, some, but not all, of the portion of the field isolation region lies between the first and second portions of the first layer.

10. The electronic device of claim 8 , wherein each of the first and second active regions comprises a primary surface lying on a (100) or (110) crystal plane and oriented substantially in a direction of form <100>.

11. The electronic device of claim 8 , wherein:

the second portion of the first layer has a first edge and a second edge opposite the first edge;

the first edge of the second portion of the first layer lies closer to the first edge of the second active region as compared to the first edge of the first active region; and

the second edge of the second portion of the first layer lies closer to the second edge of the second active region as compared to the first edge of the second active region.

12. The electronic device of claim 8 , wherein:

the first active region further comprises a second edge, a third edge, and a fourth edge, wherein from a top view, the first and second edges of the first active region lie along a first pair of opposite edges of the first active region, and the third and fourth edges of the first active region lie along a second pair of opposite edges of the first active region; and

the first portion of the first layer further comprises a third edge and a fourth edge, wherein from the top view:

the second edge of the first portion of the first layer lies adjacent to the second edge of the first active region;

the third edge of the first portion of the first layer lies adjacent to the third edge of the first active region;

the fourth edge of the first portion of the first layer lies adjacent to the fourth edge of the first active region;

a first distance is a distance between the first edge of the first active region and the first edge of the first portion of the first layer;

a second distance is a distance between the second edge of the first active region and the second edge of the first portion of the first layer;

a third distance is a distance between the third edge of the first active region and the third edge of the first portion of the first layer;

a fourth distance is a distance between the fourth edge of the fourth active region and the fourth edge of the first portion of the first layer;

a first sum is a sum of the first and second distances, and a second sum is a sum of the third and fourth distances; and

the first sum is less than the second sum.

13. The electronic device of claim 12 , wherein:

the second active region further comprises a second edge, a third edge, and a fourth edge, wherein from the top view, the first and second edges of the second active region lie along a first pair of opposite edges of the second active region, and the third and fourth edges of the second active region lie along a second pair of opposite edges of the second active region; and

the second portion of the first layer further comprises a third edge and a fourth edge, wherein from the top view:

the second edge of the second portion of the first layer lies adjacent to the second edge of the second active region;

the third edge of the second portion of the first layer lies adjacent to the third edge of the second active region;

the fourth edge of the second portion of the first layer lies adjacent to the fourth edge of the second active region;

a fifth distance is a distance between the first edge of the second active region and the first edge of the second portion of the first layer;

a sixth distance is a distance between the second edge of the second active region and the second edge of the second portion of the first layer;

a seventh distance is a distance between the third edge of the second active region and the third edge of the second portion of the first layer;

an eighth distance is a distance between the fourth edge of the second active region and the fourth edge of the second portion of the first layer;

a third sum is a sum of the fifth and sixth distances, and a fourth sum is a sum of the seventh and eighth distances; and

the third sum is less than the fourth sum.

14. The electronic device of claim 1 , further comprising:

a third transistor structure of a second conductivity type opposite the first conductivity type, wherein the third transistor structure includes a third active region having a first edge that extends substantially along a third channel length direction; and

a second layer of a second stress type opposite the first stress type, wherein the second layer overlies the third active region and is not a sidewall spacer.

15. The electronic device of claim 14 , wherein the second layer overlies substantially all of the third active region.

16. The electronic device of claim 15 , wherein the second layer overlies the portion of the field isolation region.

17. The electronic device of claim 14 , wherein:

the first and second transistor structures comprise p-channel transistor structures;

the third transistor structure comprises an n-channel transistor structure;

the first stress type is compressive; and

the second stress type is tensile.

18. The electronic device of claim 14 , wherein the second layer has a pattern that is a reverse image of the first layer.

19. The electronic device of claim 14 , further comprising a second portion of the first layer, wherein:

the first and second portions of the first layer are separate and spaced apart from one another;

substantially all of the first active region is covered by the first portion of the first layer, and substantially none of the second portion of the first layer and the second layer overlies the first active region;

substantially all of the second active region is covered by the second portion of the first layer, and substantially none of the first portion of the first layer and the second layer overlies the second active region; and

substantially all of the third active region is covered by the second layer, and substantially none of the first and second portions of the first layer overlies the third active region.

20. The electronic device of claim 14 , wherein each of the first, second, and third active regions comprises a primary surface lying on a (100) or (110) crystal plane and oriented substantially in a direction of form <110>.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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From: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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SECURITY AGREEMENT Recorded Nov 6, 2013
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To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
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SECURITY AGREEMENT Recorded May 13, 2010
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To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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SECURITY AGREEMENT Recorded Dec 9, 2008
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To: CITIBANK, N.A.
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