Semiconductor device manufacturing method and substrate processing apparatus
View Patent ↗A semiconductor device manufacturing method comprises a process of forming a film on each of multiple substrates arrayed in a processing chamber by a thermal CVD method by supplying a film forming gas into the processing chamber while heating the interior of the processing chamber, wherein in the film forming process, a cycle is performed one time or multiple times with one cycle including a step of flowing the film forming gas from one end towards the other end along the substrate array direction, and a step of flowing the film forming gas from the other end towards the one end along the substrate array direction, without forming temperature gradient along the substrate array direction in the processing chamber.
1. A semiconductor device manufacturing method comprising a process of forming a film on each of multiple substrates arrayed in a processing chamber by a thermal CVD method by supplying a film forming gas into the processing chamber while heating the interior of the processing chamber, wherein in the film forming process, a cycle is performed one time or multiple times with one cycle having sequential steps including a first step of flowing the film forming gas from one end towards the other end along the substrate array direction, and a second step of flowing the film forming gas from the other end towards the one end along the substrate array direction, without forming temperature gradient along the substrate array direction in the processing chamber.
2. A semiconductor device manufacturing method comprising a process of forming a film on each of multiple substrates arrayed in a processing chamber by a thermal CVD method by supplying a film forming gas into the processing chamber while heating the interior of the processing chamber, wherein in the film forming process, a cycle is performed one time or multiple times with one cycle including a step of flowing the film forming gas from one end towards the other end along the substrate array direction, and a step of flowing the film forming gas from the other end towards the one end along the substrate array direction, without forming temperature gradient along the substrate array direction in the processing chamber, further comprising a purge step of purging the interior of the processing chamber between the step of flowing the film forming gas from the one end towards the other end along the substrate array direction, and the step of flowing the film forming gas from the other end towards the one end along the substrate array direction, wherein the film forming gas contains dichlorosilane gas and ammonia gas, and the purge step is performed under an ammonia gas atmosphere.
3. A semiconductor device manufacturing method comprising a process of forming a film on each of multiple substrates arrayed in a processing chamber by a thermal CVD method by supplying a film forming gas into the processing chamber while heating the interior of the processing chamber, wherein in the film forming process, a cycle is performed one time or multiple times with one cycle including a step of flowing the film forming gas from one end towards the other end along the substrate array direction, and a step of flowing the film forming gas from the other end towards the one end along the substrate array direction, without forming temperature gradient along the substrate array direction in the processing chamber,
wherein the film forming gas contains dichlorosilane gas and ammonia gas, and ammonia gas is supplied continuously without stopping, while switching the flow of the film forming gas from the one end towards the other end along the substrate array direction, to the flow from the other end towards the one end along the substrate array direction, or switching the flow of the film forming gas from the other end towards the one end along the substrate array direction, to the flow from the one end towards the other end along the substrate array direction.