Triple tier package on package system
View Patent ↗An integrated circuit package system includes: providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof.
1. An integrated circuit package system comprising:
providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and
connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof.
2. The system as claimed in claim 1 wherein:
connecting the second package includes mounting a third integrated circuit below the second integrated circuit.
3. The system as claimed in claim 1 wherein:
connecting the second package includes forming a mold riser in the second encapsulation.
4. The system as claimed in claim 1 wherein:
connecting the second package includes forming a stud bump in the second encapsulation and connected to the second interposer.
5. The system as claimed in claim 1 wherein:
connecting the second package includes forming stud bumps that are stacked in the second encapsulation and connected to the second interposer.
6. An integrated circuit package system comprising:
providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation;
connecting a second package over the first interposer and on the first encapsulation, the second package including a first wire-bonded die having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the first wire-bonded die, the second interposer including an interconnection pad; and
mounting a third package above the second package and connected to the interconnection pad.
7. The system as claimed in claim 6 wherein:
connecting the second package includes forming a stud bump in the second encapsulation and connected to a bond wire; and
mounting a third package includes connecting the third package to the stud bump.
8. The system as claimed in claim 6 wherein:
connecting the second package includes forming a mold riser in the second encapsulation; and
mounting the third package includes mounting the third package touching the mold riser.
9. The system as claimed in claim 6 wherein:
connecting the second package includes only partially encapsulating the second interposer with the second encapsulation.
10. The system as claimed in claim 6 further comprising:
filling between the third package and the second package with an under-fill.
11. An integrated circuit package system comprising:
a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and
a second package connected over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof.
12. The system as claimed in claim 11 wherein:
the second package includes a third integrated circuit mounted below the second integrated circuit.
13. The system as claimed in claim 11 wherein:
the second package includes a mold riser in the second encapsulation.
14. The system as claimed in claim 11 wherein:
the second package includes a stud bump in the second encapsulation and the stud bump being connected to the second interposer.
15. The system as claimed in claim 11 wherein:
the second package includes stud bumps that are stacked in the second encapsulation and the stud bumps are connected to the second interposer.
16. The system as claimed in claim 11 further comprising:
a third package mounted above the second package and connected to the interconnection pad;
wherein:
the second package includes a second substrate mounted below the second integrated circuit;
the second integrated circuit is a first wire-bonded die; and
the second package includes a bond wire connecting the second interposer to the second substrate.
17. The system as claimed in claim 16 wherein:
the second package includes a stud bump in the second encapsulation and the stud bump is connected to bond wire; and
the third package is connected to the stud bump.
18. The system as claimed in claim 16 wherein:
the second package includes a mold riser in the second encapsulation; and
the third package is touching the mold riser.
19. The system as claimed in claim 16 wherein:
the second interposer is only partially encapsulated by the encapsulation.
20. The system as claimed in claim 16 further comprising:
an under-fill between the third package and the second package.