Array of low resistive vertical diodes and method of production

1. An integrated circuit comprising an array of memory cells, each cell comprising:

a resistively switching memory element;

a vertical selection diode coupled to a selection line in a selection line trench for selecting one memory cell from the array of memory cells,

wherein the selection line is coupled to the vertical selection diode at one vertical sidewall of the selection line trench;

wherein the selection line comprises at least a first layer of conducting material and a second layer of conducting material, the second layer with respect to a substrate plane arranged on top of first material layer, and wherein the first layer of the selection line couples via a thin liner of conducting material to the vertical selection diode; and

wherein the first layer of the selection line and the thin liner of conducting material have the same vertical extension.

2. The integrated circuit of claim 1 , wherein the selection line in its cross sectional area comprises a horizontal protrusion, which is coupled at its vertical front surface to the vertical selection diode.

3. The integrated circuit of claim 1 , wherein the diode comprises a first diode region of a first conductivity type and a second diode region of a second conductivity type, and wherein with respect to a substrate plane the first diode region is arranged vertically below the second diode region and the selection line couples to the first diode region.

4. The integrated circuit of claim 3 , wherein the vertical extension of the first diode region equals or exceeds the vertical extension of the selection line.

5. The integrated circuit of claim 1 , wherein the selection line comprises a third conducting layer on top of the second conducting layer.

6. The integrated circuit of claim 5 , wherein the first and second conducting layers are of poly silicon and the third conducting layer is a metal.

7. The integrated circuit of claim 1 , wherein the selection line comprises at least a first layer of conducting material and a second layer of conducting material, the second layer with respect to a substrate plane arranged on top of the first material layer, and wherein the first layer is coupled to the diode.

8. The integrated circuit of claim 7 , wherein the second layer is arranged vertically below the top edge of the selection line trench.

9. The integrated circuit of claim 1 , wherein the trench comprises a thick layer of insulating material arranged with respect to a substrate plane below the selection line.

10. An integrated circuit comprising:

an array of memory cells, each cell comprising a resistively switching memory element;

a vertical selection diode for selecting one from the array of memory cells; and

a selection line in a selection line trench comprising a third conducting layer on top of a second conducting layer on top of a first conducting layer of conducting material,

wherein the third layer only is coupled to the vertical diode at a vertical sidewall of the selection line trench.

11. The integrated circuit of claim 10 , wherein the selection line in its cross section forms a horizontal protrusion, which couples at its vertical front surface to the vertical selection diode.

12. The integrated circuit of claim 10 , wherein the diode comprises a first diode region of a first conductivity type and a second diode region of a second conductivity type, and wherein with respect to a substrate plane the first diode region is arranged vertically below the second diode region and the selection line is coupled to the first diode region.

13. The integrated circuit of claim 10 , wherein the first and the second layer of the selection line are of the same material and the third layer of the selection line is of a different material.

14. The integrated circuit of claim 10 , wherein the substrate adjacent to a selection line is separated by a trench insulation into pillars, and wherein the pillars are doped to form the vertical selection diodes.