System and method for cooling using impinging jet control
View Patent ↗A system ( 50 ) for cooling a target element ( 56 ) includes a structure ( 52 ) having an opening ( 62 ) extending through the layer ( 52 ), a pumping device ( 32 ) positioned behind the structure ( 52 ), and a target element ( 56 ) positioned in front of the structure ( 52 ). Transducers ( 58, 60 ) are positioned at opposing ends ( 74, 76 ) of the opening ( 62 ) between the structure ( 52 ) and the target element ( 56 ). The pumping device ( 32 ) drives a jet ( 70 ) of coolant through the opening ( 62 ) toward the target element ( 56 ). The transducers ( 58, 60 ) produce output signals ( 84, 86 ) that perturb the jet ( 70 ) to control oscillation of the jet ( 70 ) in order to stabilize the jet ( 70 ) for impingement with a predetermined location ( 96 ) on the target element ( 56 ). The jet ( 70 ) uniformly spreads from the location ( 96 ) to provide cooling over a surface ( 100 ) of the target element ( 56 ).
1. A system for cooling comprising:
a structure having an opening extending through said structure;
a pumping device behind said structure that drives a jet of coolant through said opening;
a target element positioned in front of said structure so that said jet, driven through said opening, is directed toward said target element; and
a transducer positioned between said structure and said target element, said transducer producing an output signal for perturbing said jet to control an oscillation of said jet in order to stabilize said jet for impingement with a predetermined location on said target element, wherein a predetermined distance between said opening and said target element, a size of said opening, and a velocity at which said pumping device drives said jet through said opening causes said jet to flow in an unsteady laminar flow mode, and perturbation of said jet by said output signal causes a tip of said jet to be substantially non-varying in position over time.
2. A system as claimed in claim 1 wherein said target element comprises:
a circuit board having a first surface facing said jet of said coolant;
a first microelectronic device coupled to said first surface at said predetermined location, said first microelectronic device dissipating heat; and
second microelectronic devices coupled to said first surface and displaced from said predetermined location, said second microelectronic devices dissipating less heat than said first microelectronic device, said jet providing localized cooling of said first microelectronic device at said predetermined location and said jet spreading outwardly from said predetermined location to provide substantially uniform cooling of said second microelectronic devices displaced from said predetermined location.
3. A system as claimed in claim 1 wherein said jet is directed through said opening in a first direction and said output signal of said transducer perturbs said jet in a second direction that is substantially perpendicular to said first direction.
4. A system as claimed in claim 1 wherein said transducer is a first transducer, said output signal is a first output signal, and said system further comprises a second transducer positioned between said structure and said target element, said second transducer producing a second output signal for perturbing said jet.
5. A system as claimed in claim 4 wherein each of said first and second transducers are positioned above said target element at opposing ends of said opening so that a first projected direction of said first output signal faces a second projected direction of said second output signal.
6. A system as claimed in claim 4 wherein said first and second output signals are sinusoidal signals exhibiting a perturbation frequency that corresponds to an oscillation frequency of said jet about said axis.
7. A system as claimed in claim 6 wherein:
said opening is a slot having a first end spaced apart from a second end;
said first transducer is located at said first end; and
said second transducer is located at said second end.
8. A system as claimed in claim 4 wherein said first and second transducers are actuated so that a phase difference between said first and second output signals is approximately one hundred and eighty degrees.
9. A system as claimed in claim 1 wherein said unsteady laminar flow mode is indicated by a range of values of a Reynolds number representing a transition between a laminar flow and a turbulent flow of said jet.
10. A system as claimed in claim 9 wherein said range of values of said Reynolds number is approximately 550-750 for said unsteady laminar flow mode.
11. A method for cooling a microelectronic device coupled to a circuit board at a predetermined location comprising:
determining a mode of cooling for said circuit board to which a plurality of microelectronic devices are coupled, said microelectronic device being one of said plurality of microelectronic devices;
driving a jet of coolant from a back side of a material layer through an opening in said material layer toward said circuit board, said material layer being arranged substantially parallel to and spaced apart from said circuit board by a predetermined distance, said jet exhibiting an oscillation frequency relative to its axis, said driving operation directing said jet toward said circuit board, and a tip of said jet oscillating with respect to said circuit board so that said jet impinges a variety of locations on said circuit board;
actuating a transducer positioned between said material layer and said circuit board to produce an output signal exhibiting a perturbation frequency that is substantially equivalent to said oscillation frequency, said output signal perturbing said jet to control an oscillation of said jet in order to stabilize said jet for impingement with said microelectronic device at said predetermined location;
when said determining operation determines an overall cooling mode for said circuit board, performing said driving and actuating operations; and
when said determining operation determines a local cooling mode for said circuit board, performing said driving operation and abstaining from performing said actuating operation.
12. A method as claimed in claim 11 wherein said opening is a rectangular slot having first and second ends, said transducer is a first transducer located at said first end, said output signal is a first output signal, and said actuating operation comprises actuating a second transducer to produce a second output signal for perturbing said jet, said second transducer being positioned between said material layer and said circuit board and located at said second end of said opening, said second output signal exhibiting said perturbation frequency.
13. A method as claimed in claim 12 wherein said first and second transducers are positioned above said target element so that a first projected direction of said first output signal faces a second projected direction of said second output signal.
14. A method as claimed in claim 12 wherein said actuating operation further comprises actuating said first and second transducers so that said first and second output signals are sinusoidal signals exhibiting a phase difference of approximately one hundred and eighty degrees.
15. A method as claimed in claim 11 wherein second microelectronic devices are coupled to said circuit board displaced from said predetermined location, said first microelectronic device dissipates heat, said second microelectronic devices dissipate less heat than said first microelectronic device, and said actuating operation comprises concentrating said jet to provide localized cooling of said first microelectronic device at said predetermined location and to provide substantially uniform cooling of said second microelectronic devices displaced from said predetermined location.